JPS6390865U - - Google Patents

Info

Publication number
JPS6390865U
JPS6390865U JP18746186U JP18746186U JPS6390865U JP S6390865 U JPS6390865 U JP S6390865U JP 18746186 U JP18746186 U JP 18746186U JP 18746186 U JP18746186 U JP 18746186U JP S6390865 U JPS6390865 U JP S6390865U
Authority
JP
Japan
Prior art keywords
differential signal
case
signal terminal
terminal pairs
separated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18746186U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0717155Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986187461U priority Critical patent/JPH0717155Y2/ja
Publication of JPS6390865U publication Critical patent/JPS6390865U/ja
Application granted granted Critical
Publication of JPH0717155Y2 publication Critical patent/JPH0717155Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1986187461U 1986-12-04 1986-12-04 Lsi用ケ−ス Expired - Lifetime JPH0717155Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986187461U JPH0717155Y2 (ja) 1986-12-04 1986-12-04 Lsi用ケ−ス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986187461U JPH0717155Y2 (ja) 1986-12-04 1986-12-04 Lsi用ケ−ス

Publications (2)

Publication Number Publication Date
JPS6390865U true JPS6390865U (US07754267-20100713-C00017.png) 1988-06-13
JPH0717155Y2 JPH0717155Y2 (ja) 1995-04-19

Family

ID=31137962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986187461U Expired - Lifetime JPH0717155Y2 (ja) 1986-12-04 1986-12-04 Lsi用ケ−ス

Country Status (1)

Country Link
JP (1) JPH0717155Y2 (US07754267-20100713-C00017.png)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0227741U (US07754267-20100713-C00017.png) * 1988-08-12 1990-02-22
JPH0541463A (ja) * 1991-08-05 1993-02-19 Ngk Spark Plug Co Ltd 集積回路用パツケージ
JP2001094032A (ja) * 1999-09-21 2001-04-06 Matsushita Electronics Industry Corp 半導体装置
JP2008140938A (ja) * 2006-11-30 2008-06-19 Rohm Co Ltd 半導体装置およびそれを用いた電子機器
JP2009239318A (ja) * 1998-02-19 2009-10-15 Texas Instr Inc <Ti> 高性能ボールグリッドアレイパッケージの最適回路設計レイアウト
JP2013051448A (ja) * 2012-12-11 2013-03-14 Furukawa Electric Co Ltd:The 並列光伝送装置
WO2015146738A1 (ja) * 2014-03-24 2015-10-01 技術研究組合光電子融合基盤技術研究所 Icチップを基板に搭載させるための基板上のパッド・アレイ構造、並びに当該パッド・アレイ構造を有する光モジュール
JP2016032097A (ja) * 2014-07-25 2016-03-07 京セラサーキットソリューションズ株式会社 配線基板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57154861A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Package
JPS60163442A (ja) * 1984-02-02 1985-08-26 Fujitsu Ltd 半導体集積回路装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57154861A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Package
JPS60163442A (ja) * 1984-02-02 1985-08-26 Fujitsu Ltd 半導体集積回路装置

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0227741U (US07754267-20100713-C00017.png) * 1988-08-12 1990-02-22
JPH0541463A (ja) * 1991-08-05 1993-02-19 Ngk Spark Plug Co Ltd 集積回路用パツケージ
JP2009239318A (ja) * 1998-02-19 2009-10-15 Texas Instr Inc <Ti> 高性能ボールグリッドアレイパッケージの最適回路設計レイアウト
JP2001094032A (ja) * 1999-09-21 2001-04-06 Matsushita Electronics Industry Corp 半導体装置
JP2008140938A (ja) * 2006-11-30 2008-06-19 Rohm Co Ltd 半導体装置およびそれを用いた電子機器
US8188953B2 (en) 2006-11-30 2012-05-29 Rohm Co., Ltd. Semiconductor device
JP2013051448A (ja) * 2012-12-11 2013-03-14 Furukawa Electric Co Ltd:The 並列光伝送装置
WO2015146738A1 (ja) * 2014-03-24 2015-10-01 技術研究組合光電子融合基盤技術研究所 Icチップを基板に搭載させるための基板上のパッド・アレイ構造、並びに当該パッド・アレイ構造を有する光モジュール
JPWO2015146738A1 (ja) * 2014-03-24 2017-04-13 技術研究組合光電子融合基盤技術研究所 Icチップを基板に搭載させるための基板上のパッド・アレイ構造、並びに当該パッド・アレイ構造を有する光モジュール
US9775245B2 (en) 2014-03-24 2017-09-26 Photonics Electronics Technology Research Association Pad-array structure on substrate for mounting IC chip on substrate, and optical module having said pad-array structure
JP2016032097A (ja) * 2014-07-25 2016-03-07 京セラサーキットソリューションズ株式会社 配線基板

Also Published As

Publication number Publication date
JPH0717155Y2 (ja) 1995-04-19

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