JPS639036B2 - - Google Patents
Info
- Publication number
- JPS639036B2 JPS639036B2 JP9917181A JP9917181A JPS639036B2 JP S639036 B2 JPS639036 B2 JP S639036B2 JP 9917181 A JP9917181 A JP 9917181A JP 9917181 A JP9917181 A JP 9917181A JP S639036 B2 JPS639036 B2 JP S639036B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- nozzle
- anode
- nozzles
- pass line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 170
- 239000007788 liquid Substances 0.000 claims description 49
- 239000000463 material Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 5
- 238000005192 partition Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
Landscapes
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9917181A JPS5816090A (ja) | 1981-06-26 | 1981-06-26 | メツキ装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9917181A JPS5816090A (ja) | 1981-06-26 | 1981-06-26 | メツキ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5816090A JPS5816090A (ja) | 1983-01-29 |
JPS639036B2 true JPS639036B2 (enrdf_load_stackoverflow) | 1988-02-25 |
Family
ID=14240197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9917181A Granted JPS5816090A (ja) | 1981-06-26 | 1981-06-26 | メツキ装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5816090A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04284691A (ja) * | 1991-03-13 | 1992-10-09 | Arumetsukusu:Kk | プリント配線板の電気めっき方法 |
-
1981
- 1981-06-26 JP JP9917181A patent/JPS5816090A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5816090A (ja) | 1983-01-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8545687B2 (en) | Apparatus and method for the electrolytic treatment of a plate-shaped product | |
US4340449A (en) | Method for selectively electroplating portions of articles | |
JP2002506483A (ja) | 導体プレートや導体箔の電気分解的な処理のための装置 | |
JPH024678B2 (enrdf_load_stackoverflow) | ||
US4377461A (en) | Tab plater for circuit boards or the like | |
US4367125A (en) | Apparatus and method for plating metallic strip | |
US4832811A (en) | Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards | |
US6241860B1 (en) | Electroplating machine | |
CN114808057B (zh) | 电镀装置和电镀系统 | |
WO1995020064A1 (en) | Uniform electroplating of printed circuit boards | |
JP3411103B2 (ja) | 電解めっき方法、電解めっき装置、電解めっき用ラック | |
JPH09511793A (ja) | プレート状の工作物、殊にプリント配線板の電解加工処理装置 | |
JPS6347794B2 (enrdf_load_stackoverflow) | ||
EP0330316B1 (en) | Selective plating apparatus for zone plating | |
EP1533400A1 (en) | A liquid delivery system for an electroplating apparatus, an electroplating apparatus with such a liquid delivery system, and a method of operating an electroplating apparatus | |
JPS639036B2 (enrdf_load_stackoverflow) | ||
US3878062A (en) | Electroplating apparatus and method | |
US6261425B1 (en) | Electroplating machine | |
US5211826A (en) | Electroplating means for perforated printed circuit boards to be treated in a horizontal pass | |
JPS639035B2 (enrdf_load_stackoverflow) | ||
KR100732263B1 (ko) | 기판 형태의 작업물, 특히 인쇄 회로 기판을 전해처리하기위한 장치 | |
KR100418404B1 (ko) | 불용성 양극을 사용하는 수직형 전기도금 장치 | |
JPS5858293A (ja) | 微小孔を有するメツキ物のメツキ装置 | |
JPS5858292A (ja) | 微小孔を有するメツキ物のメツキ装置 | |
JP3105452U (ja) | メッキ基板案内用のモジュール型ガードレール |