JPS6389330A - Thin film doubling device - Google Patents

Abstract

PURPOSE:To raise the manufacturing yield of thin films by cutting thin films with exact dimensional accuracy by fixing a cutter to cut a continuous thin film held by a holder to a given size to a device main body near a thin film supply path between a thin film supplier and a base plate. CONSTITUTION:A main vacuum plate 10 and a subvacuum plate 13 are provided for a supporter 12 which is provided on the device body 7 in an approachable and separable manner to an insulator base plate 11. At the same time as the suction action of the plate 10 is made, the back end (cut position) of a laminate 1B is sucked by the plate 13. The plates 10 and 13 are moved by the supporter 12, and the cutting position of a cutter 14 is matched with the cutting position of the laminate 1B. The occurrence of unnecessary loosening of the laminate 1B can thus be prevented between the plates 10 and 13.

Description

Detailed Description of the Invention (1) Purpose of the Invention [Field of Industrial Application] The present invention relates to a technology for pasting film, and in particular to a thin film in which a continuous thin film is cut into predetermined dimensions and pasted onto a substrate. The present invention relates to a technique that is effective when applied to a pasting device.

[Prior art]

2. Description of the Related Art Printed wiring boards used in electronic devices such as computers have a predetermined pattern of wiring made of copper or the like formed on one or both sides of an insulating substrate.

This type of printed wiring board can be manufactured using a primary manufacturing process.

First, a laminate consisting of a photosensitive resin (photoresist) layer and a transparent resin film (protective film) for protecting it is laminated by thermocompression on a conductive layer provided on an insulating substrate. This thermocompression bonding lamination is carried out in mass production using a thin film pasting device, a so-called laminator. Thereafter, a wiring pattern film is placed on the laminate, and the photosensitive resin layer is exposed to light for a predetermined period of time through the wiring pattern film and the transparent resin film. After the transparent resin film is peeled off using a peeling device, the exposed photosensitive resin layer is developed to form an etching mask pattern. Thereafter, unnecessary portions of the conductive layer are removed by etching, and the remaining photosensitive resin layer is further removed to form a printed wiring board having a predetermined wiring pattern.

[Problem that the invention seeks to solve]

In the manufacturing process of the above-mentioned printed wiring board, a process of automatically thermocompression-bonding a laminate onto a conductive layer of an insulating substrate using a thin film pasting device is required. The outline of this thermocompression lamination process is as follows.

First, the laminate, which is continuously wound around the supply roller of the thin film applicator, is supplied to the substrate by the main vacuum plate. The main vacuum plate is provided with a plurality of suction holes on the laminate supply surface, and is configured to suck and supply the laminate to the suction holes. The tip of the laminate to be supplied to the substrate is temporarily attached (biased heat compression bonding) onto the conductive layer of the insulating substrate at an arc-shaped temporary attachment section provided on the tip side of the main vacuum plate in the supply direction. The tip of the laminate can be attracted to the temporary attachment part by a sub-vacuum plate that is close to or away from the supply path of the laminate. The main vacuum plate and the sub-vacuum plate are attached to the main body of the apparatus via support members that approach and move away from the substrate so that the laminate can be supplied and temporarily attached.

Next, the laminate to which the tip has been tacked is thermocompression laminated to the substrate using a thermocompression roller. After a certain amount of the laminate is laminated by thermocompression, the laminate is cut into a predetermined size corresponding to the substrate by a cutting device. The cutting device includes a main vacuum plate and a sub-vacuum plate,
Provided on the support member.

In this type of thin film pasting device, as described above, the heavy main vacuum plate, sub-vacuum plate, and cutting device are attached to the same support member. For this reason, there is a problem in that a drive source (for example, an air cylinder) for moving the support member requires a large drive capability (capacity).

Therefore, the patent application filed in 1986 by the applicant of the present application
No. 104391 proposes a technique to solve the above problems. In this technique, a sub-vacuum plate and a cutting device are each fixed to the main body of the device. That is, in the technique, only the main vacuum plate is attached to the support member, and the driving capacity of the drive source for moving the support member is reduced.

However, when cutting the 11M body, it is always necessary to keep the cutting position of the rear end of the supplied laminate substantially stationary at the cutting position of the cutting device.

This stationary rear end of the laminate supplies the cutting position of the laminate to the cutting position of the cutting device at a speed faster than the speed of thermocompression lamination, and the cutting position of the supplied laminate is controlled by the sub-vacuum plate. This is done by adsorbing and holding. At the leading end of the laminate, a slack is formed between the sub-vacuum plate and the thermocompression roller, and this slack allows the thermocompression laminate to advance while the rear end remains stationary.

In the thin film pasting device configured in this way, after the main vacuum plate is moved at a speed faster than the speed of thermocompression bonding lamination by adsorbing the laminate, the cutting position of the laminate is adsorbed by the sub-vacuum plate. , it is very difficult to match the timing of both operations. For this reason, the cutting position of the laminate is adsorbed and held on the sub-vacuum plate while there is slack between it and the main vacuum plate, so the actual cutting position of the M-layer body is aligned with the cutting position of the cutting device. There was a problem that misalignment occurred. This deviation in the cutting position shortens the dimensions of the laminate to be laminated by thermocompression bonding, and accurate thermocompression lamination cannot be performed, resulting in a problem that the manufacturing yield of printed wiring boards decreases.

An object of the present invention is to accurately match the cutting position of a thin film with the cutting position of a cutting device in a thin film pasting device, and to
It is an object of the present invention to provide a technique that allows a support member to which a thin film supply member is attached to be driven by a drive source with a small driving capacity.

Another object of the present invention is to achieve the above object and to
The object of the present invention is to provide a technology that can cut membranes with accurate dimensions and improve manufacturing yield.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

(2) Structure of the Invention (Means for Solving Problems) Among the inventions disclosed in this application, a brief overview of typical inventions is as follows.

The present invention provides a thin film adhesion device for cutting a continuous thin film into predetermined dimensions and adhering the cut thin film to a substrate. A supporting member is provided in the main body of the apparatus so as to be close to and away from the substrate, a thin film holding member for holding the cut portion of the continuous thin film in the thin film supply path is provided on the supporting member, and the continuous thin film held by the thin film holding member is provided. The present invention is characterized in that a cutting device for cutting the thin film into predetermined dimensions is fixed to the main body of the device near the thin film supply path between the thin film supply member and the substrate.

[Effect]

According to the above-described means, the thin film supplying member and the thin film holding member are provided on a support member, the thin film supplying member holds the thin film, and at the same time, the thin film holding member holds the cutting position of the thin film, and in this state, the cutting device Since the thin film can be cut by the above-mentioned method, it is possible to eliminate slack in the thin film between the thin film supply member and the thin film holding member, and to accurately match the cutting position of the thin film with the cutting position of the cutting device. By fixing the cutting device to the main body of the device and reducing the weight of the Makki support member,
The support member can be driven by a drive source with a small driving capacity.

Further, since the cutting position of the thin film can be precisely matched with the cutting position of the cutting device, the thin film can be cut with accurate dimensions, and the manufacturing yield can be improved.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention applied to a thin film pasting device for thermocompression laminating a laminate consisting of a photosensitive resin layer and a translucent resin film to a printed wiring board will be specifically explained using one drawing. do.

In addition, in all the figures for explaining the embodiment, parts having the same functions are given the same reference numerals, and repeated explanations thereof will be omitted.

FIG. 1 (schematic configuration diagram) shows a thin film pasting device that is an embodiment of the present invention.

As shown in FIG. 1, a laminate 1 has a three-layer structure of a transparent resin film, a photosensitive resin layer, and a transparent resin film.
is continuously wound around the supply roller 2. The laminate 1 of the supply roller 2 is a laminate formed by a thin film separation roller 3, consisting of a transparent resin film (protective film) IA, a photosensitive resin layer with the - side (adhesive side) exposed, and a transparent resin film. Body I
Separated transparent resin film IA and B
is configured to be wound up by a winding row 4.

As shown in FIG. 2 (perspective view of main parts), the supply roller 2 is
The shaft portion 2A and the circular concave portion 5A are fitted together and supported by the roller support member 5. The roller support member 5 is attached to the outside of the cover frame of the apparatus main body 7 by a connecting member such as a screw (or adhesive).

The take-up roller 4 is supported by a roller support member 6 with its shaft portion 4A and four U-shaped portions 6A fitted together. The roller support member 6 is attached to the outside of the cover frame of the apparatus main body 7 in the same manner as the roller support member 5.

The roller support member 5 is provided with an arc-shaped recess 5B as a temporary storage area for the supply roller 2 on the left side (the side closer to the operator). On the other hand, the roller support member 6 has arc-shaped recesses 6B and 6 as temporary storage areas for the winding roller 4 on the right side (the side farthest from the operator).
C is provided.

Each of the circular arc-shaped recesses 5B, 6B, and 6C as a temporary storage area is provided in each of the roller support members 5.6.

For example, it is used as follows: The laminate 1 is gone,
When replacing the supply roller 2, the shaft portion 4A of the take-up roller 4
is fitted from the U-shaped recess 6A into the arc-shaped recess 6B or 6C serving as a temporary storage area. In this state, the supply roller 2
The shaft portion 2A is once fitted into the circular concave portion 5B serving as a temporary storage area from the circular concave portion 5A, and then removed from the roller support member 5. Next, a new supply roller 2 is once fitted into the arc-shaped recess 5B serving as a temporary storage area, and then the shaft portion 2A of the supply roller 2 and the arc-shaped recess 5A are fitted. Then, the shaft portion 4A of the take-up roller 4, which had been fitted into the arc-shaped recess 6B or 6C of the roller support member 6, is fitted into the U-shaped recess 6A.

In this way, each of the arc-shaped recess 5B as a temporary storage area provided in the roller support member 5 and the arc-shaped recess 6B or 6C as a temporary storage area provided in the roller support member 6 has a considerable weight. There is no need to completely remove the supply roller 2 or take-up roller 4, and each can be attached and moved just by moving them a little.
Removal work can be carried out. In other words, in the thin film pasting device, it is possible to improve work efficiency and to improve work safety.

At one end of the thin film separation roller 3, as shown in FIGS. 2 and 3 (enlarged perspective view of main parts), a thin film supply detection device 8 is provided.
is provided. The thin film separation roller 3 is provided in the supply path of the laminate 1, and the thin film supply detection device 8 is connected to the V
C layer body! and in the IB supply path (path from the supply roller 2 to the substrate). The thin film supply detection device 8 is an encoder that rotates in the direction of arrow A with the rotation of the thin film separation roller 3 and has a rotary plate 8B having a slit portion 8A on its circumference, and a detection portion 8C for detecting the slit portion 8A. It consists of In other words, the thin film supply detection device 8 is
It is configured to output a predetermined signal in response to the number of rotations of the thin film separation roller 3.

The rotating plate 8B is made of, for example, a resin material or a light metal material.

It is made of alloy material, etc. The detection unit 8C, for example,
It is configured to be able to detect whether or not the slit portion 8A exists using light, ultrasonic waves, or the like. The thin film supply detection device 8 is
It is attached inside the cover frame of the main body 7 of the apparatus other than the supply route so as not to interfere with the supply of the laminate 1 and IB.

In this way, by providing the thin film supply detection device 8 in the supply path of the laminate 1 and IB, it is possible to detect the supply state when the laminate 1 and IB are supplied. In other words, the thin film supply detection device 8 detects whether the laminate 1 or IB is being supplied accurately, such as during an uneven heat compression bonding operation, a thermocompression laminating operation, or a cutting operation of the laminate IB, which will be described later. It is possible to detect whether or not the If the laminate 1 or IB is not being supplied accurately, an abnormality warning device (not shown) such as an alarm can be activated by the output signal of the detection unit 8C to notify the operator. Further, the thin film applying device can be automatically stopped. That is, the thin film supply detection device 8 can improve the manufacturing yield of printed wiring boards.

Note that the thin film supply detection device 8 may be provided at any location within the supply path of the laminate 1 and the IB;
It is advantageous to provide the In other words, the thin film separation roller 3
does not require a complicated configuration and does not require any movement other than rotation, so the thin film supply detection device 8 can be easily attached.

The leading end in the supply direction of the stack IB separated by the thin film separation roller 3 is configured to be attracted to a main vacuum plate 10 through a tension roller 9 shown in FIGS. 1 and 2.

The tension roller 9 is configured to apply appropriate tension to the stacked body IB between the supply roller 2 and the main vacuum plate 10. In other words, the tension roller 9 is configured so as not to cause wrinkles or the like on the supplied VT layer body IB.

The main vacuum plate (thin film supply member) 10 is.

It is configured to supply the laminate IB from a supply roller 2 onto a conductive layer (for example, a Cu layer) of an insulating substrate 11. As shown in FIGS. 1 and 4 (enlarged configuration diagram of main parts), the main vacuum plate 10 has a support member 1 that approaches and separates from the insulating substrate 11 (moves in the direction of arrow B).
It is provided in 2. The support member 12 is a guide member 7A.
is provided in the device body (the housing of the thin film pasting device) 7 so as to be slidable in the direction of arrow B. The support members 12 are provided in pairs above and below the transport path of the insulating substrate 11 .

The upper support member 12 and the lower support member 12 are configured to operate in conjunction with each other (both approach or separate at the same time) by a rack and pinion mechanism. In other words, the pair of upper and lower support members 12.

The respective racks 12A and the pinions 12B fitted with the racks 12A operate in conjunction with each other.

This operation of the support member 12 is performed by a drive source 12G provided in the lower support member 12. The drive source 12C is composed of, for example, an air cylinder. Further, the drive source 12G can be configured with a hydraulic cylinder, an electromagnetic cylinder, a step motor, and a transmission mechanism that transmits its displacement to the support member 12.

The main vacuum plate 10 includes an insulating substrate 11
It is provided on the support member 12 so that it approaches and moves away from (moves in the direction of arrow C). The main vacuum plate 10 is driven by a drive source 12D provided on the support member 12.
It is configured to operate with a rack and pinion mechanism. This rack and pinion mechanism includes a pinion 12E provided on a drive source 12D, a rack 12F provided on a support member 12, and a main vacuum plate 10.
It is composed of a rack 10A installed in the rack 10A. Drive source 1
2D is composed of the same drive source as the drive source 12C.

As shown in FIG. 5 (partial cross-sectional perspective view), the main vacuum plate 10 is provided with a plurality of grooves 10B in the conveyance direction that extend in the supply width direction that is substantially perpendicular to the supply direction of the laminate IB. The length of the groove portion 10B (the length in the same direction as the supply width direction of the laminate IB) is the length of the laminate IB in the supply width direction.
The laminate IB is configured to have substantially the same dimensions as the groove 10B. A plurality of suction holes 10C for suctioning the laminate IB are provided at the bottom of the groove 10B. Although not shown, the suction hole 10C is
It is connected to a vacuum source such as a vacuum pump through an exhaust pipe. The suction operation of the main vacuum plate 10 and the suction operation of the temporary attachment part 10E, which will be described later, are configured to be independently controlled. The end portion 10D of the groove portion 10B is formed into a tapered shape that is dug down from the end portion of the main vacuum plate 10 to the center portion.

The end portion of the stacked body IB that is attracted to the main vacuum plate 10 is located at this end portion 10D (tapered portion).

This tapered end portion 10D has a groove portion 10B.
In addition to maximizing the suction area between the groove 10B and the laminate IB to enhance the suction effect, even if there is a slight deviation in the suction position between the groove 10B and the laminate IB, the groove 1
At the end 10D of 0B, the end of the fJ layer body 1B and the end 10
The adsorption property with D can be improved.

At the tip of the main vacuum plate 10 in the supply direction of the laminate IB, there is provided a temporary attaching part 10E having an arc-shaped surface for adsorbing the laminate IB. The temporary attachment part 10E is configured integrally with the main vacuum plate 10. Inside the temporary attachment part 10E, there are
As shown in the figure, the heater IOF heats the arc-shaped part.
is provided.

The temporary attaching section 10E is configured to temporarily attach the tip of the laminate IB supplied by the main vacuum plate 10 to the insulating substrate 11 (by uneven heat compression bonding).

Note that in the present invention, the main vacuum plate 10 and the temporary attaching portion 10E may be constructed as separate members, respectively, and both may be constructed as the support member 12.

A position close to the temporary attachment part 10H, that is, the temporary attachment part 10
A sub-vacuum plate (thin film holding member) 13 is located near the supply path of the laminate IB between the E and the insulating substrate 11.
is provided. Although the suction holes are not shown, the sub-vacuum plate 13 has an upper suction part 13a and a lower suction part 13b, and is configured in a U-shape, as shown in FIG. The portion indicated by the letter corresponds to the cutting position of the laminate IB).

The upper suction part 13a of the sub-vacuum plate 13 mainly suctions the tip of the stacked body IB in the supply direction, and the temporary attachment part 1
It is configured to be adsorbed (held) at 0E. The sub-vacuum plate 13 is driven by, for example, an air cylinder that moves toward and away from the supply path of the laminate IB (moves in the direction of the arrow) so that the tip of the laminate IB can be attracted to the temporary attachment part 10E. It is attached to the support member 12 via the source 13A.

In addition, the lower suction part 13b of the sub-vacuum plate 13
is configured to cut the continuous laminate IB with a cutting device 14, suck the rear end of the cut laminate IB, and hold it within the supply path of the laminate IB. As shown in FIG. 4, the lower suction part 13b forms a slack in the laminated body IB (forms a laminated body IB' with slack) between it and the vacuum plate 15 for one rotation after the start of thermocompression bonding lamination. ). The laminated body IB' having this slack can be formed by controlling the supply speed of the laminated body IB of the main vacuum plate 10 to be faster than the circumferential speed of the thermocompression roller 16 (thermocompression lamination speed). can. Although not shown, both are controlled by a sequence control circuit.

Note that the drive source 13A for the sub-vacuum plate 13 may be composed of a hydraulic cylinder or the like, similar to the drive source 12C, in addition to an air cylinder.

Between the temporary attachment part 10E and the insulating substrate 11 (actually,
A cutting device 14 is provided in the main body 7 of the apparatus near the supply path of the laminate IB (between the temporary attachment part 10E and the rotary vacuum plate 15). Specifically, the cutting device 14 is configured at a position facing the sub-vacuum plate 13 when the rear end of the stacked body IB is fed to the cutting position. The cutting device 14 is configured on the front-stage conveyance device 17 side that conveys the insulating substrate 11 (or may be configured on the front-stage conveyance device 17). It is configured to cut the supplied laminate IB into a predetermined length corresponding to the dimensions of the insulating substrate 11.

The specific configuration of this cutting device 14 is shown in FIGS. 6 (schematic plan view seen from the direction of arrow
- Cross-sectional view taken along line ■).

The cutting device 14 is as shown in FIGS. 6 and 7.

It mainly includes a guide member 14A, a moving member 14B, and a disc-shaped cutter 14C.

The guide member 14A extends in the supply width direction of the laminate IB, and both ends (or one end) thereof are fixed to the apparatus main body 7. This fixing is performed using fixing means such as screws, bolts, nuts, screws, and adhesives.

The guide member 14A has a supply width direction (sixth direction) of the laminate IB.
In order to move the moving member 14B accurately in the direction of arrow E shown in the figure, a recess (or protrusion) 14a that fits into the protrusion (or recess) 14b of the moving member 14B is provided.

The moving member 14B is configured to move in the direction of arrow E along the guide member 14A. The moving member 14B is connected to a hollow tube moving member 14E that moves in the direction of arrow E' within a hollow tube 14D that extends along the guide member 14A and is supported at both ends by the device main body 7. The movement of the hollow tube moving member 14E is as follows.

This is performed by blowing (or suctioning) fluid such as air from each end of the hollow tube 14D.

In other words, the hollow tube moving member 14E in FIG.
When fluid is blown from the left side of the hollow tube 14D, it moves from the left side to the right side, and when fluid is blown from the right side of the hollow tube 14D, it moves from the right side to the left side. The moving member 14E in the hollow tube is configured to move the moving member 14B. As the fluid blown into the hollow tube 14D, in addition to air, a gas such as an inert gas, or a liquid such as water or oil may be used.

Further, the moving member 14B may be configured to be moved using an air cylinder, a hydraulic cylinder, a motor, or the like.

The disc-shaped cutter 14C rotates according to the movement of the moving member 14B, and is provided with a blade section on at least its circumferential portion for cutting the laminate 1B. Gear (pinion) 14G
This is provided by fitting the gear 11 provided on the rotating shaft 14H and the rack 14J with the gear 11 interposed therebetween. Both ends (or one end) of the rack 14J are fixed to the apparatus main body 7. The fit between the rack 14J and the gear 14I is stably maintained by a holding roller 14L provided on the moving member 14B.

The disc-shaped cutter 14G is made of a metal material such as high-speed tool steel, and polytetrafluoroethylene is coated on at least the surface of the blade portion. Polytetrafluoroethylene is inert to chemicals, has excellent thermal stability, has a small coefficient of friction, and is difficult to adhere to other materials. In particular, in the thin film pasting device, minute chips containing various chemicals generated by cutting the laminate IB adhere to the blade portion of the disc-shaped cutter 14.
Coating polytetrafluoroethylene is effective because the sharpness of C tends to deteriorate.

The movable member 14B near the disc-shaped cutter 14G is provided with a disc-shaped cutter 1, mainly to ensure the safety of one worker.
A protective cover 14K is provided to cover 4C.

In this cutting device 14, the movable member 14B is connected to the guide member 14.
By moving A in one direction, the rotation of the disc-shaped cutter 14C caused by this movement can cut the laminate IB into a size corresponding to the length of the insulating group Fiii. Also, 1 disc-shaped cutter 14C.

f1 due to round trip movement! Since the layered body IB can be cut at two places, the cutting time of the layered body IB can be shortened.

In the thin film pasting device configured as described above, the main vacuum plate 10 and the sub-vacuum plate 13 are provided on the support member 12, and the support member 12 is provided on the device main body 7 so as to be close to and away from the insulating substrate 11. By fixing the cutting device 14 for cutting the laminate IB to the device main body 7 near the supply path of the laminate IB between the temporary attachment part 10E and the insulating substrate 11, the member supported by the support member 12 Since the weight of the supporting member 12 is reduced, the supporting member 12 can be driven by the drive rail W12c having a small driving ability (capacity).

Moreover, since the number of parts supported by the support member 12 can be reduced, the structure of the support member 12 and its surroundings can be simplified, and the thin film pasting device can be downsized.

In addition, since the drive source 12C etc. can be downsized,
The manufacturing cost of the thin film attachment device can be reduced.

Further, the cutting device 14 may be configured with a beam cutter using ultrasonic waves, laser beams, etc. instead of the configuration in which one disc-shaped cutter 14G is moved.
4 is a cutter having a blade portion in the supply width direction of the laminate IB with a blade portion approximately equal to or larger than the supply width dimension of the laminate IB, such as a guillotine cutter, a strip cutter, a heated or non-heated wire cutter, These cutting devices 14, which may be configured with a knife-shaped cutter or the like, can cut the entire area of the cut portion of the laminate IB almost instantaneously with a one-degree operation.

The laminate IB whose tip end is temporarily attached (biased heat compression bonding) onto the conductive layer of the insulating substrate 11 at the temporary attachment section 10E of the main vacuum plate 10 is entirely thermocompression laminated by a thermocompression roller 16. It is configured as follows. The thermocompression roller 16 is placed and rotated at the position shown by the dotted line 16' in FIG. 1 during the tacking operation of tacking the tip of the stack IB at the tacking portion 10E. The thermocompression roller 16 is configured so as not to come into contact with the temporary attachment portion 10E during the temporary attachment operation. Heat pressure bonding roller 1 after tacking operation
6 is a position indicated by a solid line from a position indicated by a dotted line indicating the reference numeral 16'.

In other words, it is configured to move to a position where it sandwiches the insulating substrate 11 with the stacked body IB interposed therebetween. The thermocompression roller 16, which holds the insulating substrate 11 with the laminate IB interposed therebetween, rotates in the direction of the arrow F shown in FIG. ,
It is configured to transport this insulating substrate 11.

During the thermocompression bonding lamination step, the suction operation of the main vacuum plate 10 and the sub-vacuum plate 13 on the stacked body IB is stopped. That is, the thermocompression roller 16 is configured so that the stacked body IB is automatically supplied from the supply roller 2 by its rotational force and the clamping force between the thermocompression roller 16 and the insulating substrate 11 .

The rear end of the laminate IB cut by the cutting device 14 is
The 0-rotation vacuum plate 15 is guided by a triangular rotating vacuum plate 15 so as not to cause wrinkles, and is configured to be laminated by thermocompression bonding with a thermocompression roller 16. The 0-rotation vacuum plate 15 is supported coaxially with the thermocompression bonding roller 16. Although not shown, a plurality of suction holes 15A are provided on the suction surface facing the stacked body IB. The structure of the suction surface on which the suction holes 15A are arranged is similar to the suction surface of the main vacuum plate 10 shown in FIG.

Although not shown, a suction hole may also be provided on the upper surface of the one-rotation vacuum plate 15, and by configuring it in this way, as shown in FIG.
can be made easier to form.

The insulating substrate 11 is carried by a pre-transport device 1 comprising a transport roller (lower stage) 17A and a transport roller (upper stage) 17B.
7, it is transported to the temporary attachment position of the ya membrane attachment device stack IB. Further, the latter conveyance device 18, which is composed of a conveyance roller (lower stage) 18A and a conveyance roller (upper stage) 18B, carries the insulating substrate 11 on which the laminate IB is thermocompression laminated using the thermocompression roller 16 of the thin film pasting device. It is configured to be transported to an exposure device that forms a wiring pattern.

As shown in FIGS. 1 and 4, in the main vacuum plate 7 (or the front-stage conveyance device 17, or the support member 12) near the movement path (V# membrane supply path) of the temporary attaching portion 10E of the main vacuum plate 10, As shown, a thin film correction device E119 is provided. The thin film straightening device 19 is configured to straighten the leading end of the laminate IB in the supply direction in the direction of bringing it into close contact with the temporary attachment portion 10E. The thin film straightening device 19 includes a fluid transport pipe 19A extending in the supply width direction of the laminate IB, and a plurality of fluid spray holes 19B provided in the fluid transport pipe 19A.

The fluid transport pipe 19A is also grown to be hollow inside.
It is configured to flow fluid at a pressure higher than normal pressure.

Although the fluid transport pipe 19A has a substantially circular cross-sectional shape in this embodiment, the cross-sectional shape is not limited to this, and may be rectangular or elliptical.

The fluid spray holes 19B are arranged in the direction (fourth direction) for straightening the laminate IB.
It is provided so as to spray fluid in the direction of arrow G shown in the figure).

As the fluid used in the thin film correction device 19, air is used. In addition, as a fluid, gas such as inert gas, water,
A liquid such as oil may also be used.

In this way, in the thin film pasting device, the thin film straightening device 19 that straightens the tip end of the laminate IB in the feeding direction in a direction to bring it into close contact with the temporary pasting section 10E is placed in the main body of the device near the moving path of the temporary pasting section 10E. 7 (or the support member 12 or the pre-transfer device 17), the tip of the laminate IB can be reliably brought into close contact with the temporary attachment part 10H, so that it can be reliably attached to the conductive layer of the insulating substrate 11. The tip of the laminate IB can be temporarily attached (uneven heat compression bonding) to the laminate IB.

Furthermore, the lower suction part 13 of the sub-vacuum plate 13
1 and 4 on the apparatus main body 7 (or the front-stage conveyance device 17, or the support member 12) close to the stacked body IB (IB') supplied between the rotary vacuum plate 15 and the rotary vacuum plate 15.
As shown in the figure, a thin film ejection device 20 is provided.

In other words, the thin film ejecting device 20 is configured to form the laminated body IB' with the slack in the direction of bringing it into close contact with the thermocompression roller 16. The thin film protrusion device 20 includes a fluid transport pipe 20A extending in the supply width direction of the stacked body IB, and a plurality of fluid spray holes 20B provided in the fluid transport pipe 2OA.

The fluid transport pipe 2OA has a hollow interior and is configured to flow fluid at a pressure higher than normal pressure. In this embodiment, the cross-sectional shape of the fluid transport pipe 20A is approximately circular, but like the fluid transport pipe 19A, the cross-sectional shape is not limited to this, and may be rectangular or elliptical. .

The fluid spray hole 20B is provided so as to spray fluid in a direction (in the direction of arrow H shown in FIG. 4) in which the slack of the laminated body IB' is made to protrude as described above.

As the fluid used in the thin film ejection device 20, air is used as in the three-film correction device 19. Further, as the fluid, a gas such as an inert gas, or a liquid such as water or oil may be used.

In this way, in the thin film pasting device, the thermocompression roller 16
The laminate IB' has the slack in the direction in which it comes into close contact with the laminate IB'.
The thin film protruding device 20 for correcting the
), it is possible to create a slack in the direction in which the laminated body IB' is reliably brought into close contact with the thermocompression roller 16, so that the rear end of the laminated body IB can be reliably attracted to the one-turn vacuum plate i5. can be done. Therefore, the rear end portion of the laminate IB can be thermocompression-bonded and laminated onto the conductive layer of the insulating substrate 11 without causing any stains or the like.

Note that the present invention relates to the thin film orthodontic device 19 or the four-film orthodontic device 8J.

The device 20 may include a plurality of fluid spray nozzles provided in the supply width direction of the laminate IB, which spray fluid so as to straighten or protrude the laminate IB in an appropriate direction as described above.

Further, the present invention provides a thin film correction device 19 or a thin film protrusion device 2.
0 was provided in a suction tube extending in the supply width direction of the laminate IB, and a plurality of suction tubes were provided in this suction tube.

It may also be configured with a suction hole that sucks the laminate IB in a direction that corrects or protrudes it in an appropriate direction as described above.

Furthermore, in the present invention, the thin film correction device v119 or the thin film protrusion device 20 may be configured with a protruding member that presses or protrudes the laminate IB in an appropriate direction as described above.

Further, the present invention provides a thin film correction device 19 with a thin film protruding device 20.
Alternatively, it is also possible to use the thin film straightening device 19 as the thin film ejecting device 20.

As shown in FIGS. 1 and 4, a substrate guide member 2 is provided in the apparatus main body 7 (or the subsequent conveyance device 18) between the thermocompression roller 16 and the conveyance roller 18A of the subsequent conveyance device 18.
1 is provided. The substrate guide member 21 is a laminate I
It is configured to guide the insulating substrate 11 on which B is laminated by thermocompression bonding from the thermocompression lamination position to the positions of the transport rollers 18A and 18B. The substrate guide member 21 has, for example, a comb-like shape in which a plurality of rod-shaped portions extending in the transport direction of the insulating substrate 11 are arranged in the transport width direction. The comb-shaped substrate guide member 21 can reduce the contact area with the insulating substrate 11 and reduce frictional resistance when transporting the insulating substrate 11, so that it can guide the insulating substrate 11 smoothly. can.

In this way, the thermocompression roller 1G and the subsequent conveyance device 18
By providing the substrate guide member 21 between the conveyor roller 18A, especially in the case of a thin insulating substrate 11,
This prevents the tip end of the thermocompression laminated material from sagging in the transport direction and reliably guides it to the transport rollers 18A and 18B for transport, thereby preventing troubles in the subsequent transport device 18 (transport path for the insulating substrate 11). can be prevented. In particular, in the conveyance device of the thin film pasting apparatus of this embodiment, a space is required for the thermocompression roller 16 to move from the position indicated by the dotted line with the symbol 16° to the position shown by the solid line in order to perform the tacking operation. Therefore, a considerable space (vO feed distance) is formed between the thermocompression roller 16 and the conveyance roller 18A, so the substrate guide member 21 is effective.

Note that in the present invention, the substrate guide member 21 may have a net-like structure.

Further, in one embodiment of the present invention, the substrate guide member 21 may have a plate-like structure.

Next, regarding the thermocompression laminating method of the laminate IB using the thin film pasting apparatus of this embodiment, the method shown in FIGS. 1, 4, and 8 will be described.
This will be briefly explained using FIGS. 10 to 10 (enlarged configuration diagrams of main parts for each process).

First, the leading end in the feeding direction of the laminate IB separated by the thin film separation roller 3 by hand.

It is arranged between the sub-vacuum plate 13 and the cutting device 14.

Next, the front stage transport device i! 17 conveyance rollers 17A and 1
When the leading end in the transport direction of the insulating substrate 11 transported by 7B is transported to the temporary attachment position, the sub-vacuum plate 13
The tip of the laminate IB is suctioned. After adsorbing the laminate IB, the drive source 13A moves the sub-vacuum plate 13 to a position away from the supply path of the laminate IB, and as shown in FIG. Let it absorb. At this time, the suction operation of the main vacuum plate 10 and the tacking part 10E is performed, and the thin film straightening device 19 can straighten the laminate IB, so that the tip of the laminate IB can be reliably attracted to the tacking part 10E. Can be done. Incidentally, when the continuous operation is performed, the leading end of the laminate IB cut by the cutting device 4 is attracted to the temporary attachment part 10E.

Thereafter, the support member 12 is moved by the driving source 12C, and the main vacuum plate 10 and the sub-vacuum plate 13 are moved in a direction closer to the insulating substrate 11. Along with this movement, the main vacuum plate 10 is further moved relative to the support member 12 by the drive source 12D, and as shown in FIG. Temporary bonding (uneven heat compression bonding) is carried out on the conductive layer No. 11.

After temporarily attaching the laminate IB, attach the main vacuum plate 1.
0 and the temporary attachment part 10E are stopped, and as shown in FIG. 10, the main vacuum plate 10, the temporary attachment part 10E, and the sub vacuum plate 13 are separated from the temporary attachment position using the drive sources 12G and 12D.

This separation occurs when the laminate IB shown in FIG.
The drive source 12G moves the main vacuum plate 10 to a position further away from the position in the process of adsorption to E.
and move the sub-vacuum plate 13. This amount of movement is proportional to the amount of slack provided to the laminate IB'. At this time, as described above, the drive source 12C of the support member 12 fixes the cutting device 4 to the device main body 7, so it is possible to reduce the size or increase the driving capacity to increase the operating speed. can.

Thereafter, the thermocompression roller 16 is moved from the position indicated by the dotted line with the reference numeral 16' to the temporary attachment position indicated by the solid line. Then, the insulating substrate 11 to which the tip of the laminate IB is temporarily attached is held and rotated between the thermocompression rollers 16, thereby laminating the laminate IB by thermocompression on the conductive layer of the insulating substrate 1. At this time, main vacuum plate 10,
Since the suction operations of the temporary attaching portion 10E and the sub-vacuum plate 13 are stopped, the thermocompression roller 16 has its rotational force and the clamping force with the insulating substrate 11, and the stacked body I
B is automatically supplied from the supply roller 2.

When a certain amount of the laminate IB is laminated by thermocompression bonding, the adsorption operations of the main vacuum plate 10, sub-vacuum plate 13, and rotary vacuum plate 15 are started substantially simultaneously. Then, from the state shown in FIG. 10, the support member 12 is moved by the driving source 12G, and the main vacuum plate 10 supplies the weight B of the layer M to the insulating substrate 1.

As shown in FIG. 4, the sub-vacuum plate 13
The rear end (cutting position) of the laminate IB at the lower suction part 13b of
coincide with the cutting position of the cutting device 14.

The supply speed of the laminate IB (moving speed of the support member 12) is
It is set faster than the thermocompression laminating speed by the thermocompression roller 16 (peripheral speed of the thermocompression roller 16).

In this way, the main vacuum plate 10 and the sub-vacuum plate 13 are provided on the support member 12, and this support member 12 is provided on the device main body 7 so as to be close to and away from the insulating substrate 11, so that the main vacuum plate 10 Substantially simultaneously with the suction operation, the rear end (cutting position) of the #It layer body weight is suctioned by the sub-vacuum plate 13, the main vacuum plate 10 and the sub-vacuum plate 13 are moved by the support member 12, Since the cutting position of the laminated body IB can be matched with the cutting position of the cutting device 14, unnecessary slack is not generated in the laminated body IB between the main vacuum plate 10 and the sub-vacuum plate 13. That is, as shown in FIG.

The distance between the main vacuum plate 10 and the position where the disc-shaped cutter 14C of the sub-vacuum plate 13 acts (U-shaped part) is the cutting position of the laminated body IB and the cutting position of the cutting device 14 shown in FIG. There is no change even when the values are matched.

Therefore, the cutting position of the laminate IB and the cutting position of the cutting device 14 can be precisely matched, so that the laminate IB is cut to exact dimensions with respect to the dimensions of the insulating substrate 11 and laminated by thermocompression bonding. This makes it possible to improve manufacturing yield.

Moreover, as mentioned above, the main vacuum plate 10
and a support member 12 provided with a sub-vacuum plate 13
Since the cutting device 14 is fixed to the device main body 7, it can be driven by a drive source 12C with a small driving capacity.

After supplying the laminated body IB and when the cutting position of the laminated body IB is matched with the cutting position of the cutting device 14, a laminated body IB' with slack between the sub-vacuum plate 10 and the rotary vacuum plate 15 is formed. can do. By straightening the thin film straightening device 20, both ends of the laminated body IB'' with slack in the supply direction can be reliably attracted to the lower suction portion 13b of the sub-vacuum plate 13 and the rotary vacuum plate 15, respectively. .

In this state, the cutting device 14 cuts the rear end portion (the cutting portion 1!) of the laminate IB into a predetermined size corresponding to the size of the insulating substrate 11.

Thereafter, when the rear end of the laminated body IB cut by the cutting device 14 is attracted to the rotary vacuum plate 15, the rotary vacuum plate 15 rotates at a speed slightly slower than the rotation speed of the thermocompression roller 16, and the insulation A 0-rotation vacuum plate 15 capable of thermocompression laminating the rear end of the yi layer weight B on the conductive layer of the substrate 11 has a thermocompression roller 1
By rotating at a speed slightly lower than the rotational speed of 6, it is possible to apply appropriate tension to the laminate IB between it and the thermocompression roller 16, so that wrinkles etc. do not occur in the laminate IB.

The insulating substrate 11 on which the laminate IB is laminated by thermocompression bonding is moved to the substrate guide member 2 by the rotational force of the thermocompression roller 16.
1, and are transported to the transport rollers 18A and 18B of the subsequent stage transport device 18 without any trouble. The insulating substrate 11 transported to the subsequent stage transport device 18 is transported to an exposure device.

Although the invention made by the present inventor has been specifically explained based on the above-mentioned embodiments, the present invention is not limited to the above-mentioned embodiments, and can be modified in various ways without departing from the gist thereof. Of course.

For example, one aspect of the present invention includes the sub-vacuum plate 13, the sub-vacuum plate which causes the tip of the laminate IB in the supply direction to be attracted to the temporary attaching part 10E, and the cutting device 14.
and a sub-vacuum plate used as a holder, and each may be controlled independently.

Further, the present invention can be applied to a thin film pasting device that preheats the insulating substrate 11 of the embodiment described above and then heat-presses and laminates the laminate IB on the insulating substrate 11 using a non-heated pressing roller.

Further, the present invention can be applied to a thin film pasting device for pasting a protective film on a decorative board used as a construction material.

(3) Effects of the invention According to the invention, a continuous thin film is cut into predetermined dimensions,
In a thin film adhering device for adhering the cut thin film to a substrate, a thin film supplying member for supplying the continuous thin film to the substrate is attached to a support member.

The support member is provided in the apparatus main body so as to be close to and away from the substrate, and the support member is provided with a thin film holding member that holds the cut portion of the continuous thin film within the thin film supply path, and the thin film is held by the thin film holding member. By fixing a cutting device that cuts a continuous thin film into predetermined dimensions to the main body of the device near the thin film supply path between the thin film supply member and the substrate, the thin film supply member and the thin film holding member can be attached to the support member. At the same time, the thin film supplying member holds the thin film and the thin film holding member holds the cutting position of the thin film, and in this state, the cutting device can cut the thin film, so that the thin film supplying member and the thin film holding member are Eliminate sagging of the thin film between.

The cutting position of the thin film and the cutting position of the cutting device can be precisely matched, and since the cutting device is fixed to the main body of the device and the weight of the supporting member is reduced, a drive source with a small driving capacity can cut the supporting member. can be driven.

Further, since the cutting position of the thin film and the cutting position of the cutting device can be precisely matched, the thin film can be cut with accurate dimensions and the manufacturing yield can be improved.

[Brief explanation of the drawing]

FIG. 1 is a schematic configuration diagram of a thin film pasting device that is an embodiment of the present invention. 2 is a perspective view of the main part of FIG. 1, and FIG. 3 is an enlarged perspective view of the main part of the thin film supply detection device shown in FIG. 2. FIG. 4 is an enlarged configuration diagram of the main parts of FIG. 1, FIG. 5 is a partial cross-sectional perspective view of the main vacuum plate shown in FIGS. 1 and 4, and FIG. Arrow■
A schematic plan view seen from the direction. FIG. 7 is a sectional view of the main part taken along the line ■-■ in FIG. 6, and FIGS. 8 to 10 are views of FIG. FIG. 2 is an enlarged configuration diagram of main parts. In the figure, IB: laminate (thin film), 2: supply roller. 3...Thin film separation roller, 4...Take-up roller, 7...
・Device main body, 8... Thin film supply detection device, 10... Main vacuum plate (thin film supply member), IOE...
- Temporary attachment part, 11... Insulating substrate, 12... Support member, 12C, 12D, 13A... Drive source, 13... Sub-vacuum plate (thin film holding member), 14... Cutting device , 14A... Guide member, 14B... Moving member, 14G... Disc-shaped cutter, 15... Rotating vacuum plate (rotating suction member), 16... Thermocompression bonding roller, 17.18...・Transport device, 17A, 17B, 1
8A. 18B... Conveyance roller, 19... Thin film correction device, 2
0... Thin film protrusion device, 21... Substrate guide member.

Claims (8)

[Claims] (1) In a thin film attaching device that cuts a continuous thin film into predetermined dimensions and attaches the cut thin film to a substrate, a thin film supplying member that supplies the continuous thin film to the substrate is attached to a supporting member, and the thin film supplying member that supplies the continuous thin film to the substrate is attached to the supporting member. The supporting member is provided with a thin film holding member that holds the cut portion of the continuous thin film in the thin film supply path, and the continuous thin film held by the thin film holding member is A thin film pasting device, characterized in that a cutting device for cutting the thin film into predetermined dimensions is fixed to the main body of the device near the thin film supply path between the thin film supply member and the substrate. (2) The thin film applying device according to claim 1, wherein the thin film supply member is configured to approach and separate from the substrate with respect to the support member. (3) The thin film attaching device according to claim 1 or 2, wherein the thin film holding member is configured to be close to and away from the thin film supply path. (4) Each of the thin film adhering devices according to any one of claims 1 to 3, wherein the thin film supplying member is provided with a temporary adhesion portion on the side in the thin film supplying direction. (5) The cutting device includes a guide member provided extending in the width direction of the thin film, which is substantially perpendicular to the thin film supply direction;
Each of claims 1 to 4 comprises a moving member that moves along the guide member and a disc-shaped cutter provided on the moving member. Thin film attachment device. (6) A rack is provided near the guide member of the cutting device along the guide member, and the movable member is provided with a pinion that engages with the rack and rotates the disc-shaped cutter. The thin film applying device according to claim 5, characterized in that: (7) The thin film pasting device according to claim 5 or 6, wherein the moving member of the cutting device is configured to move a guide member using fluid. (8) The thin film pasting device according to claim 5 or 7, wherein the disc-shaped cutter of the cutting device has a blade portion coated with polytetrafluoroethylene.