JPH049658B2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a technique for attaching a thin film to a substrate.
In particular, the present invention relates to a technique that is effective when applied to a thin film temporary attachment member for a thin film attachment device for temporarily attaching the tip of a thin film to a substrate.

[Prior art]

2. Description of the Related Art Printed wiring boards used in electronic devices such as computers have a predetermined pattern of wiring made of copper or the like formed on one or both sides of an insulating substrate.

This type of printed wiring board can be manufactured by the following manufacturing process.

First, on a conductive layer provided on an insulating substrate,
A laminate consisting of a photosensitive resin (photoresist) layer and a transparent resin film (protective film) that protects it is laminated by thermocompression bonding. This thermocompression bonding lamination is carried out in mass production using a thin film pasting device, a so-called laminator. Thereafter, a wiring pattern film is placed on the laminate, and the photosensitive resin layer is exposed to light for a predetermined period of time through the wiring pattern film and the transparent resin film. After the transparent resin film is peeled off using a peeling device, the exposed photosensitive resin layer is developed to form an etching mask pattern. Thereafter, unnecessary portions of the conductive layer are removed by etching, and the remaining photosensitive resin layer is further removed to form a printed wiring board having a predetermined wiring pattern.

In the manufacturing process of the printed wiring board mentioned above,
There is a need for a process in which a laminate is automatically thermocompression laminated onto a conductive layer of an insulating substrate using a thin film pasting device. The outline of this thermocompression lamination process is as follows.

First, the laminate that is continuously wound around the supply roller of the thin film sticking device is supplied to the substrate by the main vacuum plate. The main vacuum plate is provided with a plurality of suction holes on the laminate supply surface, and is configured to suck and supply the laminate to the suction holes. The tip of the laminate to be supplied to the substrate is temporarily bonded (temporarily thermocompressed) onto the conductive layer of the insulating substrate at an arc-shaped temporary bonding portion provided on the tip side of the main vacuum plate in the supply direction. The leading end of the laminate can be adsorbed to the temporary attachment part by a subvacuum plate that is close to or away from the supply path of the laminate. The main vacuum plate and the sub-vacuum plate are attached to the main body of the apparatus via support members that approach and move away from the substrate so that the laminate can be supplied and temporarily attached.

Next, the laminate to which the tip has been tacked is thermocompression laminated to the substrate using a thermocompression roller. After a certain amount of the laminate is laminated by thermocompression, the laminate is cut into a predetermined size corresponding to the substrate by a cutting device. A cutting device is provided on the support member together with the main vacuum plate and the sub vacuum plate.

[Problem that the invention seeks to solve]

However, this type of thin film applicator has a problem in that if the arc-shaped temporary attachment part provided at the leading end of the main vacuum plate in the supply direction is damaged, the entire main vacuum plate must be replaced. .

In addition, when the tip of the thin film is temporarily attached (temporary thermocompression bonding) on the conductive layer of the insulating substrate at the arc-shaped temporary attachment section provided on the tip side in the supply direction of the main vacuum plate, it is necessary to Since the parts are also heated, the photosensitive resin (photoresist) layer becomes sticky and bubbles are generated in the thermocompression laminated thin film, resulting in poor adhesion.

An object of the present invention is to provide a technique that allows only the damaged temporary attachment part to be replaced even if the arc-shaped temporary attachment part provided on the tip side in the supply direction of the main vacuum plate is damaged in a thin film applicator. It is about providing.

Another object of the present invention is to provide a technique that can heat only the thin film tacking tip member for pressing and tacking a thin film onto the substrate of a thin film tacking member for a thin film sticking device. .

Another object of the present invention is to provide a thin film application device comprising:
It is an object of the present invention to provide a technique that can prevent poor adhesion due to bubbles or the like in a thin film attached to a substrate.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means for solving problems]

A brief overview of typical inventions disclosed in this application is as follows.

The present invention is a thin film tacking member used in a thin film sticking device for sticking a thin film to a substrate, and a thin film tacking tip member for pressing and tacking a thin film to a substrate. It is characterized by being detachably attached to the member body.

Further, the present invention is characterized in that a thin film tacking tip member for tacking the thin film by pressing it onto the substrate is removably attached to the thin film tacking member body with a heat insulating material interposed therebetween.

Further, a heat source setting recess is provided in the main body of the thin film tacking member, and a heat source is provided at a position corresponding to the heat source setting recess of the thin film tacking tip member for pressing and tacking the thin film to be pasted on the substrate. The thin film tacking tip member is detachably attached to the thin film tacking member main body with a heat insulating material interposed therebetween.

[Effect]

According to the above-mentioned means, even if the part of the tip member for thin film tacking where the thin film is pressed and tacked to the substrate is damaged, the tip member for thin film tacking can be removed from the main body of the thin film tacking member and replaced. There is no need to replace the entire main vacuum plate.

In addition, by attaching the tip member for thin film tacking to the main body of the thin film tacking member in a removable manner with a heat insulating material interposed therebetween, only the tip member for thin film tacking is heated, and the heat is conducted to other parts. The heat insulating material prevents the photoresist layer from becoming sticky.
Only the portion of the thin film to be temporarily attached is thermocompression bonded, and it is possible to prevent air bubbles from forming in the thermocompression laminated thin film and causing adhesion failure.

Further, a heating source setting recess is provided in the thin film tacking member main body, a heat source is attached to a position corresponding to the heating source setting recess of the thin film tacking tip member, and the thin film tacking tip member is set as described above. By attaching a heat insulating material to the main body of the thin film temporary attachment member in a removable manner,
The thin film temporary attachment member can be configured compactly.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention applied to a thin film pasting device for thermocompression laminating a laminate consisting of a photosensitive resin layer and a transparent resin film to a printed wiring board will be explained in detail with reference to the drawings. do.

In addition, in all the figures for explaining the examples,
Components having the same function are given the same reference numerals, and repeated explanations thereof will be omitted.

FIG. 1 (schematic configuration diagram) shows a thin film pasting device according to an embodiment of the present invention.

As shown in FIG. 1, a laminate 1 having a three-layer structure of a translucent resin film, a photosensitive resin layer, and a translucent resin film is continuously wound around a supply roller 2. As shown in FIG. Laminate 1 wound around supply roller 2
is separated by a thin film separation roller 3 into a transparent resin film (protective film) 1A and a laminate 1B consisting of a photosensitive resin layer and a transparent resin film with one side (adhesive surface) exposed. The separated translucent resin film 1A is configured to be wound up by a winding roller 4.

As shown in FIG. 2 (perspective view of essential parts), the supply roller 2 is supported by a roller temporary support member 5 by fitting its shaft portion 2A into an arcuate recess 5A. The roller temporary support member 5 is attached to the inside of the frame of the apparatus main body 7 by a connecting member such as a screw (or an adhesive).

The winding roller 4 has a shaft portion 4A and a U-shaped recess 6.
A is inserted into the roller support member 6 and supported by the roller support member 6. The roller support member 6 is attached to the inside of the frame of the apparatus main body 7 in the same manner as the roller support member 5.

The roller temporary support member 5 is provided with arc-shaped recesses 5A and 5B on the left side (the side closer to the operator) as temporary storage areas for the supply roller 2. On the other hand, the roller support member 6 is provided with arc-shaped recesses 6B and 6C as temporary storage areas for the winding roller 4 on the right side (the side farthest from the operator).

Each of the arcuate recesses 5A, 5B, 6B, and 6C as temporary storage areas provided in each of the roller support members 5 and 6 is used, for example, as follows. When the laminate 1 is used up and the supply roller 2 is replaced, the shaft portion 4A of the take-up roller 4 is fitted from the U-shaped recess 6A into the arc-shaped recess 6B or 6C serving as a temporary storage area. In this state, the air in the air cylinder is released, and the rod-like member 2B is inserted into the shaft portion of the supply roller 2.
A, the shaft portion 2A is temporarily placed in the arcuate recess 5A as a temporary storage area, and then once fitted into the arcuate recess 5B, and then removed from the roller temporary support member 5. Next, the new supply roller 2 is once fitted into the arc-shaped recess 5B as a temporary storage area, and then,
The rod-shaped member 2B is moved to the arc-shaped recess 5A and fitted into it, and then the air cylinder is operated to insert the rod-shaped member 2B into the shaft portion 2A.
to fit. Then, the shaft portion 4A of the take-up roller 4, which has been fitted into the arc-shaped recess 6B or 6C of the roller support member 6, is fitted into the U-shaped recess 6A.

In this way, each of the arcuate recess 5A or 5B provided in the roller support member 5 as a temporary storage place and the arcuate recess 6B or 6C provided in the roller support member 6 as a temporary storage place has a considerable weight. There is no need to completely remove the supply roller 2 and the take-up roller 4, and each can be attached and removed by just moving them a little. In other words, it is possible to improve work efficiency in the thin film pasting device,
Moreover, operational safety can be improved.

At one end of the thin film separation roller 3, a thin film supply detection device 8 is provided, as shown in FIGS. 2 and 3 (enlarged perspective views of essential parts). The thin film separation roller 3 is provided in the supply path of the laminate 1, and the thin film supply detection device 8 is provided in the supply path (path from the supply roller 2 to the substrate) of the laminates 1 and 1B. . The thin film supply detection device 8 includes a rotary plate 8B that rotates in the direction of arrow A with the rotation of the thin film separation roller 3 and has a slit portion 8A on the circumference thereof;
The encoder includes a detection section 8C that detects the slit section 8A. That is, the thin film supply detection device 8 is configured to output a predetermined signal corresponding to the rotation speed of the thin film separation roller 3. The rotating plate 8B is made of, for example, a resin material, a light metal material, an alloy material, or the like. Detection part 8C
is configured to be able to detect whether or not the slit portion 8A exists using, for example, light, ultrasound, or the like. The thin film supply detection device 8 is attached to the outside of the frame of the device body 7 outside the supply path so as not to interfere with the supply of the laminates 1 and 1B.

In this way, by providing the thin film supply detection device 8 in the supply path of the laminates 1 and 1B, the laminate 1
and 1B can be detected. In other words, the thin film supply detection device 8 detects whether the laminate 1 or 1B is being supplied accurately, such as during a temporary thermocompression bonding operation, a thermocompression lamination operation, or a cutting operation of the laminate 1B, which will be described later. It is possible to detect whether the If the supply of the laminate 1 or 1B is not performed correctly, the detection unit 8C
The output signal can operate an abnormality warning device (not shown) such as an alarm to notify the operator. Further, the thin film applying device can be automatically stopped. That is, the thin film supply detection device 8 can improve the manufacturing yield of printed wiring boards.

Note that the thin film supply detection device 8 is used for the laminates 1 and 1
Although it may be provided anywhere in the supply path of B, it is advantageous to provide it on the thin film separation roller 3. In other words, the thin film separation roller 3 does not require a complicated configuration and does not require any movement other than rotation, so the thin film supply detection device 8 can be easily attached.

Laminated body 1B separated by the thin film separation roller 3
The leading end in the supply direction is configured to be attracted to the main vacuum plate 10 through a tension roller 9 shown in FIGS. 1 and 2.

The tension roller 9 is configured to apply appropriate tension to the laminate 1B between the supply roller 2 and the main vacuum plate 10 or the thermocompression roller 16. In other words, the tension roller 9 is configured so as not to cause wrinkles or the like on the supplied laminate 1B.

Main vacuum plate (thin film supply member) 1
0 is configured to supply the laminate 1B from a supply roller 2 onto a conductive layer (for example, a Cu layer) of an insulating substrate 11. The main vacuum plate 10 is provided on a support member 12 that is close to and away from the insulating substrate 11 (moves in the direction of arrow B), as shown in FIGS. 1 and 4 (enlarged configuration diagram of main parts). ing. The support member 12 is provided in the apparatus main body (casing of the thin film application apparatus) 7 so that the guide member 7A can be slid in the direction of arrow B. The support members 12 are provided in pairs above and below the transport path of the insulating substrate 11 . Upper support member 12
and the lower support member 12 are configured to operate in conjunction with each other (both approach or separate at the same time) by a rack-and-pinion mechanism. In other words, the pair of upper and lower support members 12 are operated in conjunction with the racks 12A provided thereon and the pinions 12B fitted with the racks 12A. This operation of the support member 12 is performed by a drive source 12C provided in the lower support member 12. Drive source 12C
is composed of, for example, an air cylinder. Also,
The drive source 12C can be composed of a hydraulic cylinder, an electromagnetic cylinder, a step motor, and a transmission mechanism that transmits the displacement thereof to the support member 12.

The main vacuum plate 10 is provided on the support member 12 so as to be close to and away from the insulating substrate 11 (move in the direction of arrow C). The main vacuum plate 10 is configured to operate by a drive source 12D provided on the support member 12 and a rack and pinion mechanism. This rack and pinion mechanism has a drive source 1.
Pinion 12E and support member 12 provided in 2D
The rack 12F is provided on the main vacuum plate 10, and the rack 10A is provided on the main vacuum plate 10. The drive source 12D is configured with the same one as the drive source 12C.

As shown in FIG. 5 (partial cross-sectional perspective view), the main vacuum plate 10 is provided with a plurality of grooves 10B in the conveyance direction, which extend in the supply width direction that is substantially perpendicular to the supply direction of the laminate 1B. . Groove 1
The length of 0B (the length in the same direction as the supply width direction of the laminate 1B) is slightly larger than that of the laminate 1B, which has the largest width among the applied laminates. The laminate 1 is placed at the bottom of the groove 10B.
A plurality of suction holes 10C for adsorbing B are provided. Although not shown, the suction hole 10C is
It is connected to a vacuum source such as a vacuum pump through an exhaust pipe. The end portion 10D of the groove portion 10B is formed into a tapered shape that is dug down from the end portion of the main vacuum plate 10 to the center portion.

At the tip of the main vacuum plate 10 in the supply direction of the laminate 1B, as shown in FIG. 6 (cross-sectional view of the main part), there is a tacking member 30 whose surface for adsorbing the laminate 1B is formed in an arc shape. is removably attached with a set screw 32 with a heat insulating material 31 made of plastic such as phenol resin interposed therebetween. This thin film tacking member 30 has a tacking member main body 3
3 and a tacking tip member 34, which is removably attached to the tacking member body 33 with a set screw 32 via a heat insulating material 31 such as plastic. Temporary attachment tip member 3 for temporarily attaching the laminate 1B to the insulating substrate 11
The tip portion 34A of No. 4 is, for example, in the shape of a narrow band with a width of 1.5 mm. Then, the tip member 34 for temporary attachment
A heater 35 for heating the tip portion 34A is provided on the temporary attachment member main body 33 side. This heater 35
A heat insulating material 31 is provided on the side of the thin film temporary attachment member main body 33 in the protruding portion due to the provision of the heat insulating material 31.

Further, the structure of the portion of the thin film tacking member 30 for tacking the laminate 1B to the insulating substrate 11 is as shown in FIGS. 6 and 7, as shown in FIGS. A plurality of thin film adsorption grooves 36 are provided on the boundary surface. These thin film adsorption grooves 36
A thin film suction groove 37 is provided in the exposed part of the heat insulating material 31, and a thin film suction groove 37 is provided in the exposed part of the heat insulating material 31 along the thin film tacking tip member 34. 38 are provided.

Further, the thin film temporary attachment member main body 33 is provided with a thin film suction groove 39 and a thin film suction hole 40. The thin film suction groove 36 and the thin film suction hole 40 are suctioned by a thin film suction means (not shown) of the same system, and are independently controlled from the thin film suction means of the main vacuum plate 10 described above. It's getting old.

By providing the thin film adsorption grooves 36 to 39 and the thin film adsorption holes 40 in this way, the laminated body 1B
The temporary attachment portion can be accurately set at the position of the tip portion 34A.

Here, as shown in FIG. 8, the thin film suction groove 36 is omitted and a thin film suction groove 41 which is an extension of the thin film suction groove 37 is placed on the insulating substrate 11 side of the thin film temporary attachment member main body 33. A similar effect can be obtained by configuring the thin film suction groove 41 provided on the exposed surface to communicate with the thin film suction groove 39 provided in the thin film temporary attachment member main body 33.

Next, the structure of the thin film temporary attachment member main body 33 is shown in FIGS. 9 (perspective view of main parts), FIG. 10 (plan view seen from the direction of arrow M in FIG. 9), and FIG. 12 (a sectional view taken along the line A-A shown in FIG. 10), and FIG. 13 (a plan view seen from the direction of arrow N)
0) and FIG. 14 (a sectional view taken along the CC line shown in FIG. 11).

As shown in FIGS. 7, 9, and 11, a plurality of thin film suction grooves 36 are formed inwardly from the insulating substrate 11 on the interface between the thin film temporary attachment member main body 33 and the heat insulating material 31. The first air reservoir cavity 4 is provided and communicated with these thin film adsorption grooves 36.
2 is provided. 13 and 1
As shown in FIG. 4, a second air reservoir cavity 42 is connected to the first air reservoir cavity 42 and is cut deeper than the first air reservoir cavity 42.
A cavity 43 is provided. A vent hole 44 is provided which communicates with this second air reservoir cavity 43 and penetrates the main vacuum plate 10 side. This ventilation hole 44 is in communication with a third air reservoir cavity 45 provided on the surface of the main vacuum plate 10 side. On the other hand, the ventilation hole 40 is provided in the center of the thin film temporary attachment member main body 33 so as to penetrate from the insulating substrate 11 side toward the main vacuum plate 10 side. It is connected to a third air reservoir cavity 45 provided on the side surface.

A plurality of thin film adsorption mechanisms for suctioning the laminate 1B are provided in the thin film tacking member main body 33, and by selecting and independently driving them according to the width of the laminate 1B, Laminated body 1B
is strongly attracted by the thin film tacking member main body 33, and the tacking portion is accurately set at the position of the tip portion 34A.

In addition, in the center line portion of the thin film tacking member main body 33 on the side of the thin film tacking tip member 34, FIGS.
As shown in FIGS. 1 to 13, a heater setting groove 46 of a predetermined depth is provided, and the thin film tacking tip member 34 is provided in this heater setting groove 46.
A portion of the heater 35 provided in the heater 35 is fitted into the heater 35.

By configuring the thin film tacking member 30 as described above, even if the portion of the thin film tacking tip member 34 where the thin film is tacking by pressing the laminate 1B attached to the insulating substrate 11 is damaged, Since the thin film tacking tip member 34 can be removed from the thin film tacking member main body 33 and replaced, there is no need to replace the entire main vacuum plate 10.

Further, the thin film tacking tip member 34, which presses the thin film to be pasted on the insulating substrate 11 to temporarily attach the thin film, is detachably attached to the thin film tacking member main body 33 with the heat insulating material 31 interposed therebetween. Since only the thin film tacking tip member 34 is heated and the heat insulating material 31 can prevent the heat from being conducted to other parts, the photosensitive resin (photoresist) layer does not become sticky. In this case, only the portion of the thin film to be temporarily attached is thermocompression bonded, and it is possible to prevent bubbles from forming in the thermocompression laminated thin film and causing adhesion failure.

A sub-vacuum plate (thin film holding member) 13 is provided at a position close to the thin film tacking member 30, that is, near the supply path of the laminate 1B between the thin film tacking member 30 and the insulating substrate 11. It is being The subvacuum plate 13 has an upper suction part 13a and a lower suction part 13b, and is configured in a U-shape, as shown in FIG. 4, although the thin film suction holes are not shown. This U-shaped portion corresponds to the cutting position of the laminate 1B). The upper suction part 13a of the sub-vacuum plate 13 mainly suctions the tip of the stacked body 1B in the supply direction, and the temporary attachment part 1
It is configured to be adsorbed (held) at 0E. The subvacuum plate 13 is a laminate 1B.
The support member 12 is moved toward and away from the supply path of the stacked body 1B (moves in the direction of arrow D) via a drive source 13A, for example, an air cylinder, so that the tip of the support member 12 can be adsorbed to the temporary attachment part 10E. is attached to.

Further, the lower suction portion 13b of the sub-vacuum plate 13 is connected to the cutting device 14 for cutting the continuous laminate 1B.
The cut laminate 1B is cut by the laminate 1B, and the rear end of the cut laminate 1B is sucked and held within the supply path of the laminate 1B. The lower suction part 13b is attached to the rotary vacuum plate 15 after the start of thermocompression lamination.
As shown in FIG.
It is configured to form a slack in B (to form a laminated body 1B' with slack). The laminated body 1B' with this slack is lower than the laminated body 1B of the main vacuum plate 10 with respect to the circumferential speed of the thermocompression roller 16 (thermocompression lamination speed).
can be formed by rapidly controlling the supply rate of . Although the control of both is not shown,
This is done by a sequence control circuit.

In addition, the driving source 1 of the subvacuum plate 13
In addition to an air cylinder, the drive source 3A may be configured with a hydraulic cylinder or the like similar to the drive source 12C.

A cutting device is installed in the main body 7 of the apparatus near the supply path of the laminate 1B between the temporary attachment section 10E and the insulating substrate 11 (actually, between the temporary attachment section 10E and the rotary vacuum plate 15). 14 are provided.
Specifically, the cutting device 14 is configured at a position facing the sub-vacuum plate 13 when the rear end portion of the stacked body 1B is fed to the cutting position. The cutting device 14 is configured on the front-stage transport device 17 side that transports the insulating substrate 11 (or may be configured on the front-stage transport device 17). The cutting device 14 is
The laminated body 1B continuously supplied by the main vacuum plate 10 is cut into predetermined lengths corresponding to the dimensions of the insulating substrate 11.

The specific structure of this cutting device 14 is shown in FIG. 15 (a schematic plan view seen from the direction of the arrow in FIG. 4) and FIG. 16 (a sectional view taken along the - line in FIG. 15).
Indicated by

As shown in FIGS. 15 and 16, the cutting device 14 mainly includes a guide member 14A and a moving member 1.
4B and a disc-shaped cutter 14C.

The guide member 14A extends in the supply width direction of the laminate 1B, and both ends (or one end) thereof are fixed to the apparatus main body 7. This fixing is performed using fixing means such as screws, bolts, nuts, screws, adhesives, etc.

The guide member 14A is fitted with a convex portion (or concave portion) 14b of the movable member 14B so that the movable member 14B can be accurately moved in the supply width direction of the laminate 1B (direction of arrow E shown in FIG. 15). A concave portion (or convex portion) 14a is provided.

The moving member 14B is configured to move in the direction of arrow E along the guide member 14A. The moving member 14B is a hollow tube 1 extending along the guide member 14A and having both ends supported by the device main body 7.
It is connected to a hollow tube moving member 14E that moves in the direction of arrow E' within 4D. Moving member in hollow tube 1
4E is moved by blowing (or suctioning) fluid such as air from each end of the hollow tube 14D.
This is done by That is, in FIG. 15, the hollow tube moving member 14E moves from the left side to the right side when fluid is blown from the left side of the hollow tube 14D.
It is configured so that when fluid is blown from the right side of the hollow tube 14D, it moves from the right side to the left side. The moving member 14E in the hollow tube is configured to move the moving member 14B. As the fluid blown into the hollow tube 14D, in addition to air, a gas such as an inert gas, or a liquid such as water or oil may be used. Further, the moving member 14B may be configured to be moved using an air cylinder, a hydraulic cylinder, a motor, or the like.

The disc-shaped cutter 14C rotates in accordance with the movement of the moving member 14B, and is provided at least at its circumferential portion with a blade portion for cutting the laminate 1B. The disc-shaped cutter 14C is rotated through a gear (pinion) 14G provided on the rotation shaft 14F.
This is provided by fitting the gear 14I provided on the 4H with the rack 14J. Both ends (or one end) of the rack 14J are fixed to the main body 7 of the apparatus.
The fit between the rack 14J and the gear 14I is stably maintained by a holding roller 14L provided on the moving member 14B.

The disc-shaped cutter 14C is made of a metal material such as high-speed tool steel, and at least the surface of the blade portion is coated with polytetrafluoroethylene. Polytetrafluoroethylene is inert to chemicals, has excellent thermal stability, has a small coefficient of friction, and is difficult to adhere to other materials. In particular, in the thin film pasting device, minute chips containing various chemicals generated by cutting the laminate 1B tend to adhere to the blade and deteriorate the sharpness of the disc-shaped cutter 14C. Application of fluoroethylene is effective.

Moving member 14B near the disc-shaped cutter 14C
A protective cover 14K that covers the disc-shaped cutter 14C is provided mainly to ensure the safety of the worker.

In this cutting device 14, the movable member 14B moves the guide member 14A in one direction, and the rotation of the disc-shaped cutter 14C caused by this movement cuts the laminate into a size corresponding to the length of the insulating substrate 11. 1B can be cut. Furthermore, the disc-shaped cutter 14C can cut the laminate 1B at two locations by moving back and forth, so that the cutting time for the laminate 1B can be shortened.

In the thin film sticking device configured in this way,
A main vacuum plate 10 and a sub vacuum plate 13 are provided on a support member 12, and this support member 12 is provided on the main body 7 of the device so as to be close to and away from the insulating substrate 11, and a cutting device 14 cuts the laminate 1B. is fixed to the main body 7 of the apparatus near the supply path of the laminate 1B between the temporary attachment part 10E and the insulating substrate 11, thereby reducing the weight of the member supported by the support member 12, which reduces the driving capacity ( capacity)
The support member 12 can be driven by a small drive source 12C.

Moreover, since the number of parts supported by the support member 12 can be reduced, the structure of the support member 12 and its surroundings can be simplified, and the thin film pasting device can be downsized.

Further, since the driving source 12C and the like can be downsized, the manufacturing cost of the thin film sticking device can be reduced.

Further, the cutting device 14 includes a disc-shaped cutter 14C.
Instead of moving the beam, a beam cutter using ultrasonic waves, laser beams, etc. may be used.
Furthermore, the cutting device 14 includes a cutter having a blade portion approximately equal to or larger than the supply width dimension of the laminate 1B, such as a guillotine cutter, a band cutter, a heated or non-heated cutter, etc., in the supply width direction of the laminate 1B. It may also be configured with a heating wire cutter, a knife cutter, or the like. These cutting devices 14 are
With one operation, the entire area of the cut portion of the laminate 1B can be cut almost instantly.

Temporary attachment part 1 of the main vacuum plate 10
The laminate 1B whose tip end is temporarily bonded (temporarily thermocompression bonded) onto the conductive layer of the insulating substrate 11 at 0E is configured such that its entirety is thermocompression laminated by a thermocompression roller 16. The thermocompression roller 16 is placed and rotated at the position shown by the dotted line 16' in FIG. 1 during the tacking operation of tacking the tip of the laminate 1B at the tacking portion 10E. The thermocompression roller 16 is configured so as not to come into contact with the temporary attachment portion 10E during the temporary attachment operation. After the tacking operation, the thermocompression roller 16 moves from the position indicated by the dotted line 16' to the position indicated by the solid line, that is, the position where it holds the insulating substrate 11 with the laminate 1B interposed therebetween. It is configured. The thermocompression roller 16 sandwiching the insulating substrate 11 with the laminate 1B interposed therebetween,
It is configured to rotate in the direction of arrow F shown in FIG. 4, to thermocompress and laminate the laminate 1B onto the conductive layer of the insulating substrate 11, and to transport the insulating substrate 11. During the thermocompression bonding lamination step, the suction operation of the main vacuum plate 10 and the sub vacuum plate 13 of the stacked body 1B is stopped. That is, the thermocompression roller 16 is configured so that the stacked body 1B is automatically supplied from the supply roller 2 by its rotational force and the holding force between the thermocompression roller 16 and the insulating substrate 11.

The rear end of the laminated body 1B cut by the cutting device 14 is attached to a triangular rotating vacuum plate 55.
It is configured to be guided so as not to cause wrinkles, etc., and to be laminated by thermocompression bonding with a thermocompression roller 16. The rotary vacuum plate 15 is supported on the same axis as the thermocompression roller 16 and is configured to rotate around it. Although not shown in the drawings, the rotary vacuum plate 15 has a plurality of suction surfaces facing the laminate 1B. A suction hole 15A is provided. The structure of the suction surface on which the thin film suction holes 15A are provided is similar to the suction surface of the main vacuum plate 10 shown in FIG. Although not shown, a suction hole may also be provided on the upper surface of the rotary vacuum plate 15, and by configuring it in this way, the laminated body 1B' with more slack can be formed as shown in FIG. It can be made easier.

The insulating substrate 11 has a transport roller (lower stage) 1
7A and a transport roller (upper stage) 17B, the pre-stage transport device 17 transports the thin film pasting device to the tacking position of the laminate 1B. Further, the latter conveyance device 18, which is composed of a conveyance roller (lower stage) 18A and a conveyance roller (upper stage) 18B, carries the insulating substrate 11 on which the laminate 1B is thermocompression laminated using the thermocompression roller 16 of the thin film pasting device. It is configured to be transported to an exposure device that forms a wiring pattern.

Temporary attachment part 1 of the main vacuum plate 10
The apparatus main body 7 (or the front-stage conveyance device 17, or the support member 1) near the movement path (thin film supply path) of 0E
2) is provided with a thin film correction device 19, as shown in FIGS. 1 and 4. Thin film correction device 1
9 is the laminate 1 in the direction of bringing it into close contact with the temporary attachment part 10E.
It is configured to correct the tip portion of B in the supply direction. The thin film straightening device 19 includes a fluid conveying pipe 19A extending in the supply width direction of the laminate 1B.
and a plurality of fluid spray holes 19B provided in this fluid transport pipe 19A.

The fluid transport pipe 19A has a hollow interior and is configured to flow fluid at a pressure higher than normal pressure. Although the fluid transport pipe 19A has a substantially circular cross-sectional shape in this embodiment, the cross-sectional shape is not limited to this, and may be rectangular or elliptical.

The fluid spray holes 19B are provided so as to spray fluid in a direction (direction of arrow G shown in FIG. 4) for straightening the stacked body 1B.

As the fluid used in the thin film correction device 19, air is used. Alternatively, an inert gas or the like may be used.

In this way, in the thin film attachment device, the temporary attachment part 1
A thin film straightening device 19 for straightening the leading end of the stacked body 1B in the supply direction in the direction of bringing it into close contact with 0E is installed on the device main body 7 (or the support member 12 or the pre-stage conveyance device 17) near the moving path of the temporary attachment portion 10E. By providing this, the tip of the laminate 1B is securely attached to the temporary attachment part 10.
Since it can be brought into close contact with E, the insulating substrate 1
The tip of the laminate 1B can be reliably tack-bonded (temporary thermocompression bonded) onto the conductive layer 1.

Furthermore, the apparatus main body 7 (or the pre-stage conveyance device 17, or the support member 12) near the stacked bodies 1B and 1B' supplied between the lower suction part 13b of the sub-vacuum plate 13 and the rotating vacuum plate 15 As shown in FIGS. 1 and 4, a thin film ejection device 20 is provided. In other words, the thin film ejecting device 20 is configured to form the laminated body 1B' with the slack in the direction in which the laminated body 1B' is brought into close contact with the thermocompression roller 16. Thin film ejection device 20
is composed of a fluid transport pipe 20A extending in the supply width direction of the laminate 1B, and a plurality of fluid spray holes 20B provided in the fluid transport pipe 20A.

The fluid transport pipe 20A has a hollow interior and is configured to flow fluid at a pressure higher than normal pressure. Although the fluid transport pipe 20A has a substantially circular cross-sectional shape in this embodiment, the cross-sectional shape is not limited to this like the fluid transport pipe 19A, and the cross-sectional shape may be rectangular or elliptical.

The fluid spray hole 20B is provided so as to spray fluid in the direction (direction of arrow H shown in FIG. 4) in which the slack of the stacked body 1B' is made to protrude as described above.

As the fluid used in the thin film ejection device 20, air is used as in the thin film correction device 19. Alternatively, an inert gas or the like may be used.

In this way, in the thin film pasting device, the thin film ejecting device 20 for correcting the sagging laminate 1B' in the direction of causing the laminate 1B' to fall toward the thermocompression roller 16 is installed in the device body near the laminate 1B'. 7 (or the support member 12 or the front-stage conveyance device 17), it is possible to provide slack in the direction in which the laminated body 1B' is reliably brought into close contact with the thermocompression roller 16.
The rear end portion of the stacked body 1B can be reliably attracted to the rear end portion of the stacked body 1B. Therefore, the rear end of the laminate 1B can be reliably thermocompressed and laminated onto the conductive layer of the insulating substrate 11 without causing wrinkles or the like.

In addition, in the present invention, a plurality of thin film straightening devices 19 or thin film protruding devices 20 are provided in the supply width direction of the laminate 1B, and a fluid is sprayed so as to straighten or protrude the laminate 1B in an appropriate direction as described above. It may also be composed of a fluid spray nozzle.

Furthermore, the present invention provides a suction tube that extends the thin film correction device 19 or the thin film protrusion device 20 in the supply width direction of the laminated body 1B, and a plurality of suction tubes that are provided in the laminated body 1B. It may also be configured with a suction hole that sucks in a direction that corrects or protrudes in an appropriate direction.

Further, in the present invention, the thin film correction device 19 or the thin film protrusion device 20 may be configured with a protruding member that corrects or protrudes the laminate 1B in an appropriate direction as described above.

Further, in the present invention, the thin film straightening device 19 can also be used as the thin film protruding device 20, or the thin film protruding device 20 can also be used as the thin film straightening device 19.

As shown in FIGS. 1 and 4, a substrate guide member 21 is provided in the apparatus main body 7 (or the subsequent conveyance device 18) between the thermocompression roller 16 and the conveyance roller 18A of the subsequent conveyance device 18. ing. The substrate guide member 21 is configured to guide the insulating substrate 11 on which the laminate 1B is laminated by thermocompression bonding from the thermocompression lamination position to the positions of the transport rollers 18A and 18B. The substrate guide member 21 has, for example, a comb-like shape in which a plurality of rod-shaped portions extending in the transport direction of the insulating substrate 11 are arranged in the transport width direction. The comb-shaped substrate guide member 21 can reduce the contact area with the insulating substrate 11 and reduce frictional resistance when transporting the insulating substrate 11, so that it can guide the insulating substrate 11 smoothly. can.

In this way, by providing the substrate guide member 21 between the thermocompression bonding roller 16 and the conveyance roller 18A of the latter stage conveyance device 18, especially in the case of a thin insulating substrate 11, the leading edge in the conveyance direction after thermocompression bonding lamination is The transport roller 1
Since the substrate can be reliably guided and transported to 8A and 18B, troubles in the subsequent transport device 18 (transport route for the insulating substrate 11) can be prevented. Particularly, in the conveying device of the thin film pasting apparatus of this embodiment, a space is required for the thermocompression roller 16 to move from the position indicated by the dotted line with the reference numeral 16' to the position shown by the solid line in order to perform the tacking operation. Then,
The substrate guide member 21 is effective because a considerable space (transport distance) is formed between the thermocompression roller 16 and the transport roller 18A.

Note that in the present invention, the substrate guide member 21 may have a net-like structure.

Further, in the present invention, the substrate guide member 21 may be configured in a plate-like structure.

Next, the laminate 1 produced by the thin film pasting device of this example.
Regarding the thermocompression bonding lamination method of B, the first
This will be briefly explained using FIG.

First, by hand, the thin film of the laminate fed out from the supply roller 2 is separated from the protective film via the thin film separation roller 3. and the cutting device 14, and after activating the vacuum source to adsorb and hold the laminate 1B on the main vacuum plate 10 and the sub-vacuum plate 13, the cutting device 14 is operated to cut the laminate 1B. , remove unnecessary parts of the laminate.

Next, when the leading end in the transport direction of the insulating substrate 11 transported by the transport rollers 17A and 17B of the pre-stage transport device 17 is transported to the temporary attachment position, the drive source 13
At A, the subvacuum plate 13 is moved to a position away from the supply path of the laminate 1B, and as shown in FIG. 17, the tip of the laminate 1B is attracted to the temporary attachment part 10E. At this time, the main vacuum plate 10 and the temporary attachment part 10E are being sucked together, and the thin film straightening device 19 can straighten the stacked body 1B, so that the tip of the stacked body 1B is securely attached to the temporary attachment part 10E. It can be adsorbed.

After that, the main vacuum plate 10 is attached to the insulating substrate 11 with respect to the support member 12 using the drive source 12D.
As shown in FIG. 18, the tip of the laminate 1B adsorbed to the temporary attachment part 10E is temporarily attached (temporary thermocompression bonding) onto the conductive layer of the insulating substrate 11.

After the laminate 1B is temporarily attached, the suction operation of the main vacuum plate 10 and the temporary attachment part 10E is stopped, and as shown in FIG. 19, the drive sources 12C and 1
2D main vacuum plate 10, temporary attachment part 1
0E and the double plate 13 are separated from the temporary attachment position. This separation is achieved by moving the main vacuum plate 10 and the sub-vacuum plate 13 by the driving source 12C to a position where they are further separated from each other compared to the position in the process of adsorbing the laminate 1B to the temporary attachment part 10E shown in FIG. 17. let This amount of movement is proportional to the amount of slack that the laminate 1B' has. At this time, the drive source 12C of the support member 12 is
As described above, since the cutting device 14 is fixed to the device main body 7, it is possible to reduce the size or increase the driving ability and increase the operating speed.

Thereafter, the thermocompression roller 16 is moved from the position indicated by the dotted line with the reference numeral 16' to the temporary attachment position indicated by the solid line. Then, the insulating substrate 11 to which the tip of the laminate 1B is temporarily attached is held between the thermocompression rollers 16 and rotated, thereby laminating the laminate 1B on the conductive layer of the insulating substrate 11 by thermocompression bonding. At this time, main vacuum plate 10, temporary attachment part 1
0E, since the suction operation of each of the sub-vacuum plates 13 has stopped, the thermocompression roller 16 has its rotational force and the clamping force of the insulating substrate 11, and the stacked body 1B is attached to the supply roller 2. It is now automatically supplied from

When a certain amount of the laminate 1B is thermocompressed and laminated, the main vacuum plate 10, the sub-vacuum plate 13, and the rotating vacuum plate 1 are formed.
The respective suction operations of 5 are started substantially simultaneously. Then, from the state shown in FIG.
2C, the support member 12 is moved, the main vacuum plate 10 supplies the laminate 1B to the insulating substrate 11, and as shown in FIG. The rear end (cutting position) of 1B is aligned with the cutting position of the cutting device 14. The supply speed of the laminate 1B (the moving speed of the support member 12) is the same as that of the thermocompression roller 1.
6 thermocompression laminating speed (thermocompression roller 1
6).

In this way, the main vacuum plate 10 and the sub vacuum plate 13 are provided on the support member 12, and the support member 12 is provided on the device main body 7 so as to be close to and away from the insulating substrate 11. Substantially simultaneously with the suction operation of the vacuum plate 10, the rear end portion (cutting position) of the laminate 1B is sucked by the sub-vacuum plate 13, and the main vacuum plate 10 and the sub-vacuum plate 13 are held together by the support member 12. Since the cutting position of the laminated body 1B can be made to match the initial cutting position of the cutting device 14 by moving the laminated body 1B, unnecessary slack in the laminated body 1B between the main vacuum plate 10 and the sub-vacuum plate 13 can be avoided. It will no longer occur. That is, the main vacuum plate 10 and the sub vacuum plate 13 shown in FIG.
The distance from the position where the disc-shaped cutter 14C acts (U-shaped portion) changes even when the cutting position of the laminated body 1B and the cutting position of the cutting device 14 shown in FIG. 4 are aligned. Never. Therefore, the cutting position of the laminate 1B and the cutting position of the cutting device 14 can be precisely matched, so that the laminate 1B is cut to exact dimensions with respect to the dimensions of the insulating substrate 11, and the laminate 1B is thermocompression bonded. It can be laminated and the manufacturing yield can be improved. Moreover, as described above, since the support member 12 provided with the main vacuum plate 10 and the sub vacuum plate 13 fixes the cutting device 14 to the device main body 7, it is driven by the drive source 12C with a small driving capacity. be able to.

After supplying the laminate 1B and aligning the cutting position of the laminate 1B with the cutting position of the cutting device 14,
Laminated body 1 with slack between the sub-vacuum plate 10 and the rotary vacuum plate 15
B′ can be formed. Both ends of the laminated body 1B' with the slack in the feeding direction are reliably adsorbed to the lower suction part 13b of the sub-vacuum plate 13 and the rotary vacuum plate 15 by straightening the thin film straightening device 19. I can do it.

In this state, the cutting device 14 cuts the rear end portion (cutting position) of the laminate 1B into a predetermined size corresponding to the size of the insulating substrate 11.

After that, the laminate 1B cut by the cutting device 14
The slack portion of the rotary vacuum plate 15 is attracted by the rotary vacuum plate 15 as it slides forward, and when the rear end approaches the rotary vacuum plate 15 appropriately, the rotary vacuum plate 15 starts rotating and the rotary vacuum plate 15 moves forward. The suction surface of the plate 15 is the insulating substrate 11
While rotating the insulating substrate 1 so that it approaches the surface of
The rear end portion of the laminate 1B can be thermocompression-bonded and laminated on the conductive layer 1. The rotary vacuum plate 15 rotates at a speed slightly slower than the rotational speed of the thermocompression roller 16, and due to the frictional force of sliding on the suction surface of the thermocompression roller 16, the rotary vacuum plate 15 applies appropriate pressure to the laminated body 1B between the thermocompression bonding roller 16. Since a sufficient tension can be applied, wrinkles etc. do not occur in the laminate 1B.

The insulating substrate 11 on which the laminate 1B is laminated by thermocompression bonding is conveyed by the rotational force of the thermocompression roller 16 through the substrate guide member 21 to the conveyance rollers 18A and 18B of the subsequent conveyance device 18 without causing any trouble. . The insulating substrate 11 transported to the subsequent stage transport device 18 is transported to an exposure device.

The invention made by the present inventor has been specifically explained based on the above embodiments, but the present invention includes:
It goes without saying that the invention is not limited to the embodiments described above, and that various modifications can be made without departing from the spirit thereof.

For example, in the present invention, the sub-vacuum plate 13 is used as a sub-vacuum plate for adsorbing the leading end of the laminate 1B in the feeding direction to the temporary attaching part 10E, and a sub-vacuum plate used as a receiving member of the cutting device 14. It may also be configured with a yum plate and each may be controlled independently.

Further, the present invention provides the insulating substrate 11 of the above embodiment.
After preheating, the laminate 1B is placed on this insulating substrate 11.
It can be applied to a thin film pasting device that performs thermocompression lamination using a non-heated pressure roller.

The present invention can also be applied to a thin film pasting device that laminates a laminate 1B without a protective film 1A that is removed before being pressure-bonded to a substrate.

Further, the present invention can be applied to a thin film pasting device for pasting a protective film on a decorative board used as a construction material.

[Effects of the Invention] As explained above, according to the present invention, the thin film tacking tip member is detachably attached to the main vacuum plate body, so that the thin film of the thin film tacking tip member is pressed. Even if the part to be temporarily attached is damaged, the thin film temporary attachment tip member can be removed from the main vacuum plate and replaced, so there is no need to replace the entire main vacuum plate. Thereby, the life of the device can be improved.

In addition, by detachably attaching the thin film tacking tip member to the main vacuum plate body with a heat insulating material interposed, only the thin film tacking tip member is heated, and the heat is conducted to other parts. This can be prevented by the insulation material, so the photosensitive resin (photoresist) layer does not become sticky.
Only the portion where the thin film is temporarily attached is thermocompression bonded, and it is possible to prevent bubbles from forming in the thermocompression laminated thin film.

Further, a heating setting recess is provided in the thin film tacking member main body, a heat source is installed in a position corresponding to the heating source setting recess of the thin film tacking tip member, and the thin film tacking tip member is attached to the thin film tacking member main body. By attaching the heat insulating material removably to the body, it is possible to heat only the thin film tacking tip member with a compact structure and prevent the heat from being conducted to other parts. Therefore, only the portion where the thin film is temporarily attached can be thermocompression bonded without making the photosensitive resin (photoresist) layer sticky.

[Brief explanation of drawings]

FIG. 1 is a schematic configuration diagram of a thin film pasting device according to an embodiment of the present invention, FIG. 2 is a perspective view of main parts of FIG. 1, and FIG. 3 is a thin film supply detection device shown in FIG. 2. FIG. 4 is an enlarged perspective view of the main parts of FIG. 1, FIG. 5 is a partial cross-sectional perspective view of the main vacuum plate shown in FIGS. 1 and 4, and FIG. , sectional views of the temporarily attached part of the main vacuum plate shown in FIGS. 1 and 4, and FIGS. 7 and 8 are cross-sectional views of the temporary attached part of the main vacuum plate shown in FIGS. FIG. 9 is a perspective view of the main part showing the structure of the part, FIG. 9 is a perspective view of the main part showing the structure of the thin film temporary attachment member body shown in FIG. 6, and FIG. 10 is a plane seen from the direction of arrow M in FIG. 11 is a plan view seen from the direction of arrow N in FIG. 9, and FIG. 12 is a plan view of the first
Cross-sectional view taken along the A-A cutting line shown in Figure 0, No. 13
14 is a sectional view taken along the line C--C shown in FIG. 11, and FIG. 15 is a sectional view taken along the line C--C shown in FIG. 4. FIG. 16, a schematic plan view seen from the direction of the arrow, is a cross-sectional view of the main part taken along the - line in FIG.
7 to 19 are enlarged configuration diagrams of essential parts of FIG. 1 shown in each step to explain the thermocompression laminating method. In the figure, 1B...laminate (thin film), 2... supply roller,
3... Thin film separation roller, 4... Winding roller, 7... Apparatus main body, 8... Thin film supply detection device, 10... Main vacuum plate (thin film supply member), 11... Insulating substrate, 12... Support member, 12C, 12D ,13A
... Drive source, 13... Subvacuum plate (thin film holding member), 14... Cutting device, 14A... Guide member, 14B... Moving member, 14C... Disc-shaped cutter, 15... Rotating vacuum plate (rotating suction member), 16... Thermocompression roller, 17, 18... Conveying device, 17A, 17B, 18A, 18B... Conveying roller, 19... Thin film straightening device, 20... Thin film protruding device,
21... Substrate guide member, 30... Thin film temporary attachment member, 3
DESCRIPTION OF SYMBOLS 1... Heat insulating material, 32... Set screw, 33... Thin film temporary attachment member main body, 34... Tip member for thin film temporary attachment, 34A... Tip part, 35... Heater, 36-39, 41... Thin film adsorption groove, 40, 44 ...Vent hole, 42...First cavity, 43...Second cavity, 45...Third cavity, 46...Heater setting groove.

Claims (1)

[Scope of Claims] 1. A thin film tacking member used in a thin film sticking device for sticking a thin film to a substrate, which includes a thin film tacking tip member for pressing and tacking a thin film to a substrate, A thin film tacking member for a thin film pasting device, characterized in that the thin film tacking member is detachably attached to the main body of the thin film tacking member. 2 A thin film tacking member used in a thin film adhering device for adhering a thin film to a substrate, in which a thin film tacking tip member for pressing and tacking the thin film to the substrate is attached to the main body of the thin film tacking member. A thin film temporary attachment member for a thin film attachment device, characterized in that it is detachably attached with a heat insulating material interposed therebetween. 3. A thin film temporary attachment member used in a thin film attachment device for attaching a thin film to a substrate, which has a recess for setting a heat source in the main body of the thin film temporary attachment member, and presses the thin film to be attached to the substrate for temporary attachment. A heat source was attached to the tip member for thin film tacking at a position corresponding to the heat source setting recess, and the tip member for thin film tacking was detachably attached to the main body of the thin film tacking member with a heat insulating material interposed therebetween. A thin film temporary attachment member for a thin film attachment device, characterized in that: 4 The width of the thin film tacking portion of the thin film tacking tip member is configured to be a fine line, for example,
A thin film temporary attachment member for a thin film attachment device according to any one of claims 1 to 3, characterized in that the thickness is 1.5 mm.