JPS6389264U - - Google Patents

Info

Publication number

JPS6389264U

JPS6389264U JP18517586U JP18517586U JPS6389264U JP S6389264 U JPS6389264 U JP S6389264U JP 18517586 U JP18517586 U JP 18517586U JP 18517586 U JP18517586 U JP 18517586U JP S6389264 U JPS6389264 U JP S6389264U

Authority

JP

Japan

Prior art keywords

pad

board

bond pad

ceramic sub

soldering

Prior art date

1986-12-01

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000919 ceramic Substances 0.000 claims description 7
• 238000005476 soldering Methods 0.000 claims description 6
• XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
• 229910052710 silicon Inorganic materials 0.000 claims description 4
• 239000010703 silicon Substances 0.000 claims description 4
• 239000000758 substrate Substances 0.000 claims description 4
• 229910015365 Au—Si Inorganic materials 0.000 claims 1
• 239000004020 conductor Substances 0.000 claims 1
• 229910003460 diamond Inorganic materials 0.000 claims 1
• 239000010432 diamond Substances 0.000 claims 1
• 230000005496 eutectics Effects 0.000 claims 1
• 229910002065 alloy metal Inorganic materials 0.000 description 1
• 239000006023 eutectic alloy Substances 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1