JPS6389259U - - Google Patents
Info
- Publication number
- JPS6389259U JPS6389259U JP18305886U JP18305886U JPS6389259U JP S6389259 U JPS6389259 U JP S6389259U JP 18305886 U JP18305886 U JP 18305886U JP 18305886 U JP18305886 U JP 18305886U JP S6389259 U JPS6389259 U JP S6389259U
- Authority
- JP
- Japan
- Prior art keywords
- protrusion
- resin
- metal block
- lead frame
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000008188 pellet Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 3
- 229910052751 metal Inorganic materials 0.000 claims 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18305886U JPS6389259U (US06534493-20030318-C00166.png) | 1986-11-28 | 1986-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18305886U JPS6389259U (US06534493-20030318-C00166.png) | 1986-11-28 | 1986-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6389259U true JPS6389259U (US06534493-20030318-C00166.png) | 1988-06-10 |
Family
ID=31129441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18305886U Pending JPS6389259U (US06534493-20030318-C00166.png) | 1986-11-28 | 1986-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6389259U (US06534493-20030318-C00166.png) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5138973A (ja) * | 1974-09-30 | 1976-03-31 | Hitachi Ltd | Jushifushigatahandotaisochinoseiho |
| JPS5417347U (US06534493-20030318-C00166.png) * | 1978-07-15 | 1979-02-03 | ||
| JPS5527655A (en) * | 1978-08-21 | 1980-02-27 | Hitachi Ltd | Substrate for resin sealed type semiconductor device |
-
1986
- 1986-11-28 JP JP18305886U patent/JPS6389259U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5138973A (ja) * | 1974-09-30 | 1976-03-31 | Hitachi Ltd | Jushifushigatahandotaisochinoseiho |
| JPS5417347U (US06534493-20030318-C00166.png) * | 1978-07-15 | 1979-02-03 | ||
| JPS5527655A (en) * | 1978-08-21 | 1980-02-27 | Hitachi Ltd | Substrate for resin sealed type semiconductor device |
