JPS6387889U - - Google Patents
Info
- Publication number
- JPS6387889U JPS6387889U JP18305086U JP18305086U JPS6387889U JP S6387889 U JPS6387889 U JP S6387889U JP 18305086 U JP18305086 U JP 18305086U JP 18305086 U JP18305086 U JP 18305086U JP S6387889 U JPS6387889 U JP S6387889U
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- integrated circuit
- semiconductor integrated
- flat package
- type semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18305086U JPS6387889U (ro) | 1986-11-27 | 1986-11-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18305086U JPS6387889U (ro) | 1986-11-27 | 1986-11-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6387889U true JPS6387889U (ro) | 1988-06-08 |
Family
ID=31129425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18305086U Pending JPS6387889U (ro) | 1986-11-27 | 1986-11-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6387889U (ro) |
-
1986
- 1986-11-27 JP JP18305086U patent/JPS6387889U/ja active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6387889U (ro) | ||
JPH0375539U (ro) | ||
JPS61199052U (ro) | ||
JPS6398678U (ro) | ||
JPS6169863U (ro) | ||
JPS614436U (ja) | 半導体装置用パツケ−ジ | |
JPH03106758U (ro) | ||
JPS6232550U (ro) | ||
JPH0288240U (ro) | ||
JPH0345649U (ro) | ||
JPS6139952U (ja) | 半導体装置 | |
JPH024249U (ro) | ||
JPS6169850U (ro) | ||
JPS5822741U (ja) | 半導体パツケ−ジ | |
JPH038449U (ro) | ||
JPS63149544U (ro) | ||
JPH0231177U (ro) | ||
JPS6079771U (ja) | 多層配線基板 | |
JPS61134039U (ro) | ||
JPS6149453U (ro) | ||
JPH0334242U (ro) | ||
JPS63182571U (ro) | ||
JPS5844859U (ja) | 混成集積回路 | |
JPH0189722U (ro) | ||
JPS58114049U (ja) | 半導体装置 |