JPS6387782U - - Google Patents
Info
- Publication number
- JPS6387782U JPS6387782U JP1986182241U JP18224186U JPS6387782U JP S6387782 U JPS6387782 U JP S6387782U JP 1986182241 U JP1986182241 U JP 1986182241U JP 18224186 U JP18224186 U JP 18224186U JP S6387782 U JPS6387782 U JP S6387782U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- copper foil
- insulating
- exposed end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 2
- 239000012212 insulator Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案の一実施例の分解構成図、第２
図は第１図の実施例の斜視図、第３図は第１図の
実施例を構成する保護カバーの平面図、第４図は
第１図の実施例の断面図、第５図は従来装置の断
面図、第６図は従来装置の斜視図である。
１…芯線、２…被覆材、３…線材、４…プリン
ト基板、５…絶縁基板、６…銅箔パターン、７…
接続用孔部、８…一端、９…底部、１１…側壁部
、１２…孔部、１３…保護カバー。
Figure 1 is an exploded configuration diagram of one embodiment of the present invention, Figure 2
The figures are a perspective view of the embodiment shown in Fig. 1, Fig. 3 is a plan view of the protective cover constituting the embodiment shown in Fig. 1, Fig. 4 is a sectional view of the embodiment shown in Fig. 1, and Fig. 5 is a conventional A sectional view of the device, and FIG. 6 is a perspective view of the conventional device. DESCRIPTION OF SYMBOLS 1...Core wire, 2...Coating material, 3...Wire material, 4...Printed circuit board, 5...Insulating board, 6...Copper foil pattern, 7...
Connection hole, 8... One end, 9... Bottom, 11... Side wall, 12... Hole, 13... Protective cover.
Claims (1)
ト基板を構成する絶縁基板および該絶縁基板に形
成される銅箔パターンに連通して設けられる接続
用孔部に該芯線の露出された少なくとも一端が該
プリント基板の上方から挿入され、半田付けされ
ることにより該銅箔パターンに電気的に接続され
るプリント基板とから成るプリント基板接続装置
において、 絶縁材から成る底部と、絶縁材から成り、該底
部に立設され成る側壁部とから成り、該底部には
孔部が設けられ、該芯線の露出された一端は該プ
リント基板の上方から該底部の孔部を介して該絶
縁基板と銅箔パターンに連通された接続用孔部に
挿入されることにより該半田付けがなされ、該底
部と側壁部により該芯線の露出された一端を被覆
する保護カバーを設けたことを特徴とするプリン
ト基板接続装置。[Scope of Claim for Utility Model Registration] A wire rod in which a core wire is covered with an insulator, and a connection hole provided in communication with an insulating board constituting a printed circuit board and a copper foil pattern formed on the insulating board, A printed circuit board connection device comprising: a printed circuit board having at least one exposed end thereof inserted from above the printed circuit board and electrically connected to the copper foil pattern by soldering; a bottom portion made of an insulating material; , made of an insulating material, and a side wall part standing upright at the bottom part, the bottom part is provided with a hole part, and the exposed end of the core wire is inserted from above the printed circuit board through the hole part in the bottom part. The soldering is performed by inserting the wire into a connection hole communicating with the insulating substrate and the copper foil pattern, and a protective cover is provided to cover one exposed end of the core wire by the bottom and side wall portions. A printed circuit board connection device featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986182241U JPS6387782U (en) | 1986-11-27 | 1986-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986182241U JPS6387782U (en) | 1986-11-27 | 1986-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6387782U true JPS6387782U (en) | 1988-06-08 |
Family
ID=31127856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986182241U Pending JPS6387782U (en) | 1986-11-27 | 1986-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6387782U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010129613A (en) * | 2008-11-25 | 2010-06-10 | Fujitsu Ltd | Attaching component and electronic apparatus with the same |
-
1986
- 1986-11-27 JP JP1986182241U patent/JPS6387782U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010129613A (en) * | 2008-11-25 | 2010-06-10 | Fujitsu Ltd | Attaching component and electronic apparatus with the same |
| US8401358B2 (en) | 2008-11-25 | 2013-03-19 | Fujitsu Limited | Attachment part and electronic apparatus |