JPS638637B2 - - Google Patents
Info
- Publication number
- JPS638637B2 JPS638637B2 JP46012165A JP1216571A JPS638637B2 JP S638637 B2 JPS638637 B2 JP S638637B2 JP 46012165 A JP46012165 A JP 46012165A JP 1216571 A JP1216571 A JP 1216571A JP S638637 B2 JPS638637 B2 JP S638637B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- substrate
- insulating substrate
- mask
- electroless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US1684670A | 1970-03-05 | 1970-03-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS638637B2 true JPS638637B2 (OSRAM) | 1988-02-23 |
Family
ID=21779293
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP46012165A Expired JPS638637B2 (OSRAM) | 1970-03-05 | 1971-03-05 | |
| JP12177176A Pending JPS53870A (en) | 1970-03-05 | 1976-10-08 | Method of producing printed circuit board with plated through hole |
| JP12177276A Granted JPS52116866A (en) | 1970-03-05 | 1976-10-08 | Method of producing printed circuit board with plated through hole |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12177176A Pending JPS53870A (en) | 1970-03-05 | 1976-10-08 | Method of producing printed circuit board with plated through hole |
| JP12177276A Granted JPS52116866A (en) | 1970-03-05 | 1976-10-08 | Method of producing printed circuit board with plated through hole |
Country Status (2)
| Country | Link |
|---|---|
| JP (3) | JPS638637B2 (OSRAM) |
| CA (1) | CA931664A (OSRAM) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020189071A1 (ja) * | 2019-03-15 | 2020-09-24 | オムロン株式会社 | 距離画像センサ、および角度情報取得方法 |
| US11257232B2 (en) | 2017-05-08 | 2022-02-22 | University Of Fukui | Three-dimensional measurement method using feature amounts and device using the method |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5758394A (en) * | 1980-09-24 | 1982-04-08 | Hitachi Chemical Co Ltd | Method of producing flexible printed circuit board with through hole |
| JPS5758393A (en) * | 1980-09-24 | 1982-04-08 | Hitachi Chemical Co Ltd | Method of producing flexible printed circuit board with through hole |
| JPS62167251U (OSRAM) * | 1986-04-12 | 1987-10-23 | ||
| JPH01295491A (ja) * | 1988-05-24 | 1989-11-29 | Hitachi Chem Co Ltd | 配線板の製造法 |
| JPH0834340B2 (ja) * | 1988-12-09 | 1996-03-29 | 日立化成工業株式会社 | 配線板およびその製造法 |
| JP3264971B2 (ja) | 1991-03-28 | 2002-03-11 | セイコーエプソン株式会社 | インクジェット記録ヘッドの製造方法 |
-
1971
- 1971-03-04 CA CA106913A patent/CA931664A/en not_active Expired
- 1971-03-05 JP JP46012165A patent/JPS638637B2/ja not_active Expired
-
1976
- 1976-10-08 JP JP12177176A patent/JPS53870A/ja active Pending
- 1976-10-08 JP JP12177276A patent/JPS52116866A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11257232B2 (en) | 2017-05-08 | 2022-02-22 | University Of Fukui | Three-dimensional measurement method using feature amounts and device using the method |
| GB2577013B (en) * | 2017-05-08 | 2022-05-04 | Univ Fukui | Three-Dimensional Measurement Method Using Feature Amounts and Device Using the Method |
| WO2020189071A1 (ja) * | 2019-03-15 | 2020-09-24 | オムロン株式会社 | 距離画像センサ、および角度情報取得方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS638638B2 (OSRAM) | 1988-02-23 |
| JPS53870A (en) | 1978-01-07 |
| CA931664A (en) | 1973-08-07 |
| JPS52116866A (en) | 1977-09-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4232060A (en) | Method of preparing substrate surface for electroless plating and products produced thereby | |
| US4632857A (en) | Electrolessly plated product having a polymetallic catalytic film underlayer | |
| US4217182A (en) | Semi-additive process of manufacturing a printed circuit | |
| US3628999A (en) | Plated through hole printed circuit boards | |
| US4701351A (en) | Seeding process for electroless metal deposition | |
| US3925578A (en) | Sensitized substrates for chemical metallization | |
| US3269861A (en) | Method for electroless copper plating | |
| JP2768390B2 (ja) | 無電解金属付着のために基体をコンディショニングする方法 | |
| US4668532A (en) | System for selective metallization of electronic interconnection boards | |
| US3959547A (en) | Process for the formation of real images and products produced thereby | |
| JPH028476B2 (OSRAM) | ||
| US3799816A (en) | Metallizing insulating bases | |
| JPH047117B2 (OSRAM) | ||
| US4847114A (en) | Preparation of printed circuit boards by selective metallization | |
| JP2006522216A (ja) | 銀メッキ回路に適するように改良を受けさせたコーティング | |
| JPS638637B2 (OSRAM) | ||
| JPS636628B2 (OSRAM) | ||
| US4759952A (en) | Process for printed circuit board manufacture | |
| US3674485A (en) | Method of manufacturing electrically conducting metal layers | |
| KR100235930B1 (ko) | 인쇄 배선 보드와 그 형성 방법 | |
| EP0098472A1 (en) | Method for decreasing plated metal defects by treating a metallic surface | |
| JPH0376599B2 (OSRAM) | ||
| US6635410B2 (en) | Metallizing method for dielectrics | |
| US4433009A (en) | Method of manufacturing printed circuits | |
| JPS6349397B2 (OSRAM) |