JPS6386186A - Semiconductor storage device - Google Patents
Semiconductor storage deviceInfo
- Publication number
- JPS6386186A JPS6386186A JP61229738A JP22973886A JPS6386186A JP S6386186 A JPS6386186 A JP S6386186A JP 61229738 A JP61229738 A JP 61229738A JP 22973886 A JP22973886 A JP 22973886A JP S6386186 A JPS6386186 A JP S6386186A
- Authority
- JP
- Japan
- Prior art keywords
- cell
- word line
- layout
- area
- cell area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 9
- 239000003990 capacitor Substances 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 230000010354 integration Effects 0.000 abstract description 9
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
Landscapes
- Semiconductor Memories (AREA)
- Dram (AREA)
- Static Random-Access Memory (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
(産業上の利用分野)
本発明は、半導体記憶装置に係わり、特許、ダイナミッ
ク・メモリに関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a semiconductor memory device, a patent, and a dynamic memory.
(従来の技術)
MOS)ランジスタを集積した半導体記憶装置の中で、
特に1トランジスタ・1キヤパシタ構成のメモリセルを
持つダイナミックラム(以下DRAMと称す)は、すで
に1Mビットの量産が開始されている。さらに最小加工
寸法が1μm以下の微細素子を800万個以上も集積し
た4Mbit D RAMの試作も開始された。この
様に高集積化が実現できた背景にはメモリセル面積の縮
少がある。従来の平面キャパシタを用いたセルでは、セ
ル面積の縮少に伴い、十分な電荷量がかせげないことか
ら、例えば第4図に示す様な基板表面に溝をmシ、これ
を電荷蓄積領域とするいわゆるトレンチタイプのセルが
提案されている。一方セルのレイアウトに関しては、ノ
イズマージンの高いFolded Bil Line方
式が採用されている。(Prior art) In a semiconductor memory device that integrates transistors (MOS),
In particular, mass production of 1M bit dynamic RAM (hereinafter referred to as DRAM) having a memory cell with one transistor and one capacitor has already begun. Furthermore, prototype production of a 4Mbit DRAM that integrates more than 8 million microscopic elements with a minimum processing size of 1 μm or less has begun. The reason behind this high degree of integration is the reduction in memory cell area. In cells using conventional planar capacitors, as the cell area is reduced, it is difficult to accumulate a sufficient amount of charge. A so-called trench type cell has been proposed. On the other hand, regarding the cell layout, a folded bill line method with a high noise margin is adopted.
この構成は第3図に示す様にメモリセルからの信号が現
れるビット線対(BL、BL)を近接して平行に配置し
、かつ、ワード線(WLo−WLn−1)の各−本とB
L、 BL の交点の中で一方の交点のみにメモリセル
を配置するものである。この方式では、1つのメモリセ
ル領域に、2本のワード線を通す必要があるが、第4図
に示した様にメモリセルの縦横比が現在のセルでは約1
=2であるため面積的には問題にならない。In this configuration, as shown in FIG. 3, bit line pairs (BL, BL) on which signals from memory cells appear are arranged close to each other in parallel, and each of the word lines (WLo-WLn-1) B
A memory cell is arranged only at one of the intersections of L and BL. In this method, it is necessary to pass two word lines through one memory cell area, but as shown in Figure 4, the aspect ratio of the memory cell is approximately 1 in the current cell.
= 2, so there is no problem in terms of area.
しかし、ワード線の端に配置されるワード線選択用のロ
ー・デコーダー(以下、R/D)並びにワード線駆動用
回路(以下WLdriver)は、第3図に示す用にワ
ード線ピッチに配置する必要があるため、現段階におい
ても、レイアウト上極めて厳しい状況にある。However, the word line selection row decoder (hereinafter referred to as R/D) and the word line driving circuit (hereinafter referred to as WLdriver) placed at the end of the word line are arranged at the word line pitch as shown in FIG. Because of the necessity, even at this stage, the layout is in an extremely difficult situation.
さらに近年高密度化、高集積化を目的とした新規なメモ
リセルが数多く提案されてbるが、これらは概して、セ
ルを2次元、あるいは3次元的に構成したものである。Furthermore, in recent years, many new memory cells have been proposed for the purpose of increasing density and integration, but these generally have cells configured in two or three dimensions.
この様にセルが多次元化されると、メモリセルの縦横比
は、1:2から1:1に近づく。こうすると、メモリセ
ルと先述したR/D、あルイはWLdrfverとの整
合性がとれなくなシ、メモリセルのピッチはとのR/D
のピッチで制限される。すなわち、メモリセルの縮少に
よシ、高集的化を目指してもある面積以下からばR/D
のレイアウト面積により、メモリセル面積が決定されて
しまい、飛踏的な高集積化には結びつかない。When cells are made multidimensional in this way, the aspect ratio of the memory cell approaches 1:1 from 1:2. If you do this, the memory cells and the R/D mentioned above will not be consistent with WLdrfver, and the pitch of the memory cells will be different from the R/D.
is limited by the pitch of In other words, even if we aim to reduce the number of memory cells and increase the density, if the area is below a certain level, the R/D
The memory cell area is determined by the layout area of the memory cell, which does not lead to radically higher integration.
(発明が解決しようとする問題点)
以上の様に、従来採用されているレイアウト法テハ、セ
ル面積の縮少に伴イR/ D 、 WL driver
のレイアウト面積が極端に縮少され、この2つの整合性
がとれなくなるという問題があった。(Problems to be Solved by the Invention) As described above, as the conventional layout method and cell area are reduced, R/D, WL driver
There was a problem in that the layout area of the two was extremely reduced, making it impossible to maintain consistency between the two.
イアウドに整合性を持たせ高集積化を可能とした半導体
記憶装置を提供することを目的としている。It is an object of the present invention to provide a semiconductor memory device that has high integration density and has high integration.
(問題点を解決するための手段)
本発明はワード線の選択、あるいは駆動のためノR/D
WLdriver 2系列に分離し、ワード線の両
端部に配置させることを特徴とする。(Means for Solving the Problems) The present invention provides R/D for selecting or driving word lines.
The WLdriver is separated into two lines and placed at both ends of the word line.
(作 用)
本発明によれば、従来のR/D WLdriverのレ
イアウト面積を2倍に拡張することが可能となり、今後
セル面積が縮少されても、R/D WLdriverの
レイアウトに十分整合がとれ、DRAMの高集的化に有
効である。(Function) According to the present invention, it is possible to double the layout area of a conventional R/D WLdriver, and even if the cell area is reduced in the future, the layout of the R/D WLdriver can be sufficiently matched. This is effective for increasing the density of DRAM.
さらにR/D WL driver f、構成するMO
8’)ランジスタも十分大きな寸法のものを用いること
ができ、トランジスタの信頼性、ひいてはDRAMの信
頼性も向上し、動作マージンの大きい集積回路が得られ
る。Furthermore, R/D WL driver f, configuring MO
8') A sufficiently large transistor can be used, improving the reliability of the transistor and, by extension, the reliability of the DRAM, resulting in an integrated circuit with a large operating margin.
(実施例)
以下、本発明の詳細な説明する。第1図は本発明のひと
つの実施例であり、メモリセルのワード線と、几/D
WL driverの関係を示したものである。(Example) The present invention will be described in detail below. FIG. 1 shows one embodiment of the present invention, and shows a word line of a memory cell and a
This shows the relationship between WL drivers.
図に示した様に2系列に分離したR/D WLdriv
erをWLの両端部に配置し、WL l −W L n
の選択駆動のためのR/D WL drIverは図中
のWLの上端部、下端部の交互に配貨する。この方法に
より従来より几/D WL driverのレイアウト
面積は2倍になる。いいかえれば、セル面積が従来のA
Kなるまで、几/D WL driverのレイアウト
は可能となり、セル面積の縮少のみKより、高集積化を
計ることができる。R/D WLdrive separated into two lines as shown in the figure
er is placed at both ends of WL, and WL l −W L n
The R/D WL drIver for selective driving is arranged alternately at the upper end and lower end of the WL in the figure. This method doubles the layout area of the DWL driver compared to the conventional method. In other words, the cell area is the same as the conventional A
It is now possible to layout a D/D WL driver up to K, and higher integration can be achieved by simply reducing the cell area.
尚、本発明はセルが微細化されて、1セル領域内に1つ
のワード線のみしか走らすことができない場合でも、例
えば第2図の様K open・Bit Line 方
式と組み合せれば十分有効である。Note that the present invention is sufficiently effective even when cells are miniaturized and only one word line can run within one cell area, if combined with the K open Bit Line method as shown in FIG. 2, for example. .
以上述べた様に本発明によれば、セル面積の縮少によシ
高集的化を計った場合にも、ワード線選択あるいは駆動
のためのR/D WII driver のレイアウ
ト面積に十分整合性があ5DRAMの高集積化、さらに
は信頼性にも十分に効果がある。As described above, according to the present invention, even when increasing cell density by reducing the cell area, it is possible to sufficiently match the layout area of the R/D WII driver for word line selection or driving. This has a sufficient effect on increasing the integration density of 5DRAM and also improving its reliability.
第1図は、本発明の一実施例の半導体記憶装置の概念図
、第2図は、その応用例を説明するための図、第3図は
従来の概念図、第4図はその一例としてのセルの平面図
と断百図である。
1・・・・・・・・・メモリセル
2・・・・・・・・・ ワードM(WL)3・・・・・
・・・・ ビット、75 (BL、 BL )4・・・
・・・・・・ ロウ・デコーダ(R/D ) 、 ワー
ド線駆動回路(WLdriver)FIG. 1 is a conceptual diagram of a semiconductor memory device according to an embodiment of the present invention, FIG. 2 is a diagram for explaining an example of its application, FIG. 3 is a conceptual diagram of a conventional device, and FIG. 4 is an example thereof. FIG. 1...Memory cell 2...Word M (WL)3...
...Bit, 75 (BL, BL)4...
... Row decoder (R/D), word line drive circuit (WLdriver)
Claims (2)
成の複数個のメモリセルをマトリクス状に配置し、メモ
リセルへのアクセス信号線であるワード線を平行に配置
した半導体記憶装置において、ワード線の選択あるいは
駆動のための回路を2系列に分割しセルアレイの両端部
に分離して配置させることにより、この選択・駆動をセ
ルアレイの両端部から行うことを可能としたことを特徴
とする半導体記憶装置。(1) In a semiconductor memory device in which a plurality of memory cells each having one transistor and one capacitor are arranged in a matrix on a semiconductor substrate, and word lines, which are access signal lines to the memory cells, are arranged in parallel, the word lines A semiconductor memory device characterized in that the selection and driving can be performed from both ends of the cell array by dividing the selection or driving circuit into two lines and placing them separately at both ends of the cell array. .
は、それぞれ常にセルアレイの両端部に配置した特許請
求の範囲第1項記載の半導体記憶装置。(2) The semiconductor memory device according to claim 1, wherein the selection/drive circuits for two adjacent word lines are always arranged at both ends of the cell array.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61229738A JPS6386186A (en) | 1986-09-30 | 1986-09-30 | Semiconductor storage device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61229738A JPS6386186A (en) | 1986-09-30 | 1986-09-30 | Semiconductor storage device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6386186A true JPS6386186A (en) | 1988-04-16 |
Family
ID=16896912
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61229738A Pending JPS6386186A (en) | 1986-09-30 | 1986-09-30 | Semiconductor storage device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6386186A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02123596A (en) * | 1988-11-02 | 1990-05-11 | Nec Corp | Semiconductor memory device |
JPH0444695A (en) * | 1990-06-12 | 1992-02-14 | Toshiba Corp | Semiconductor memory |
JPH04252491A (en) * | 1991-01-28 | 1992-09-08 | Nec Corp | Semiconductor memory |
US5396451A (en) * | 1988-09-19 | 1995-03-07 | Fujitsu Limited | DRAM device having cells staggered along adjacent rows and sources and drains aligned in a column direction |
US5517457A (en) * | 1993-12-21 | 1996-05-14 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5832295A (en) * | 1981-08-19 | 1983-02-25 | Fujitsu Ltd | Semiconductor storage device |
-
1986
- 1986-09-30 JP JP61229738A patent/JPS6386186A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5832295A (en) * | 1981-08-19 | 1983-02-25 | Fujitsu Ltd | Semiconductor storage device |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5396451A (en) * | 1988-09-19 | 1995-03-07 | Fujitsu Limited | DRAM device having cells staggered along adjacent rows and sources and drains aligned in a column direction |
JPH02123596A (en) * | 1988-11-02 | 1990-05-11 | Nec Corp | Semiconductor memory device |
JPH0444695A (en) * | 1990-06-12 | 1992-02-14 | Toshiba Corp | Semiconductor memory |
JPH04252491A (en) * | 1991-01-28 | 1992-09-08 | Nec Corp | Semiconductor memory |
US5517457A (en) * | 1993-12-21 | 1996-05-14 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4675845A (en) | Semiconductor memory | |
US7274613B2 (en) | Dynamic random access memory (DRAM) capable of canceling out complementary noise development in plate electrodes of memory cell capacitors | |
EP0055572B1 (en) | A semiconductor memory device | |
DE3941926C2 (en) | Semiconductor memory device | |
JP2953708B2 (en) | Dynamic semiconductor memory device | |
US4590588A (en) | Monolithic semiconductor memory | |
US5263002A (en) | Semiconductor memory device and its topography | |
US6094390A (en) | Semiconductor memory device with column gate and equalizer circuitry | |
JP3781819B2 (en) | Semiconductor memory device having triple port | |
US5319605A (en) | Arrangement of word line driver stage for semiconductor memory device | |
JPH08222706A (en) | Semiconductor storage device | |
JP2785655B2 (en) | Semiconductor device | |
JPS6386186A (en) | Semiconductor storage device | |
JP3068944B2 (en) | Mask ROM | |
EP1162623B1 (en) | Semiconductor memory device having segment type word line structure | |
JP2902666B2 (en) | Dynamic semiconductor memory device | |
JPH11145426A (en) | Dram and memory cell array thereof | |
JPH0794597A (en) | Dynamic semiconductor memory | |
JPH11340438A (en) | Semiconductor storage | |
US6421266B1 (en) | Memory circuit having improved sense-amplifier block and method for forming same | |
JPH10303387A (en) | Semiconductor storage device | |
JP2000138355A (en) | Semiconductor memory device | |
JPS601710B2 (en) | semiconductor memory | |
GB2239540A (en) | Semiconductor memory array with staggered word line drivers | |
KR100204537B1 (en) | A semiconductor memory device having subword line and strap structure |