JPS638142Y2 - - Google Patents
Info
- Publication number
- JPS638142Y2 JPS638142Y2 JP1982066777U JP6677782U JPS638142Y2 JP S638142 Y2 JPS638142 Y2 JP S638142Y2 JP 1982066777 U JP1982066777 U JP 1982066777U JP 6677782 U JP6677782 U JP 6677782U JP S638142 Y2 JPS638142 Y2 JP S638142Y2
- Authority
- JP
- Japan
- Prior art keywords
- board
- ceramic case
- lead
- heat dissipation
- shaped base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 27
- 230000017525 heat dissipation Effects 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982066777U JPS58170847U (ja) | 1982-05-08 | 1982-05-08 | 放熱フイン付き混成集積回路の構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982066777U JPS58170847U (ja) | 1982-05-08 | 1982-05-08 | 放熱フイン付き混成集積回路の構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58170847U JPS58170847U (ja) | 1983-11-15 |
| JPS638142Y2 true JPS638142Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-03-10 |
Family
ID=30076629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982066777U Granted JPS58170847U (ja) | 1982-05-08 | 1982-05-08 | 放熱フイン付き混成集積回路の構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58170847U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1982
- 1982-05-08 JP JP1982066777U patent/JPS58170847U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58170847U (ja) | 1983-11-15 |