JPS638059B2 - - Google Patents

Info

Publication number
JPS638059B2
JPS638059B2 JP58050983A JP5098383A JPS638059B2 JP S638059 B2 JPS638059 B2 JP S638059B2 JP 58050983 A JP58050983 A JP 58050983A JP 5098383 A JP5098383 A JP 5098383A JP S638059 B2 JPS638059 B2 JP S638059B2
Authority
JP
Japan
Prior art keywords
glass
semiconductor
powder
becomes
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58050983A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59174544A (ja
Inventor
Kazuo Hatano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Electric Glass Co Ltd
Original Assignee
Nippon Electric Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Glass Co Ltd filed Critical Nippon Electric Glass Co Ltd
Priority to JP58050983A priority Critical patent/JPS59174544A/ja
Publication of JPS59174544A publication Critical patent/JPS59174544A/ja
Publication of JPS638059B2 publication Critical patent/JPS638059B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Glass Compositions (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP58050983A 1983-03-25 1983-03-25 半導体被覆用ガラス Granted JPS59174544A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58050983A JPS59174544A (ja) 1983-03-25 1983-03-25 半導体被覆用ガラス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58050983A JPS59174544A (ja) 1983-03-25 1983-03-25 半導体被覆用ガラス

Publications (2)

Publication Number Publication Date
JPS59174544A JPS59174544A (ja) 1984-10-03
JPS638059B2 true JPS638059B2 (enExample) 1988-02-19

Family

ID=12874030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58050983A Granted JPS59174544A (ja) 1983-03-25 1983-03-25 半導体被覆用ガラス

Country Status (1)

Country Link
JP (1) JPS59174544A (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8401250D0 (en) * 1984-01-18 1984-02-22 British Telecomm Semiconductor fabrication
US4810420A (en) * 1986-10-02 1989-03-07 General Electric Company Thick film copper via-fill inks
US4830988A (en) * 1986-10-02 1989-05-16 General Electric Company Dielectric inks for multilayer copper circuits
US4733018A (en) * 1986-10-02 1988-03-22 Rca Corporation Thick film copper conductor inks
US4772574A (en) * 1986-10-02 1988-09-20 General Electric Company Ceramic filled glass dielectrics
US4808770A (en) * 1986-10-02 1989-02-28 General Electric Company Thick-film copper conductor inks
US4808673A (en) * 1986-10-02 1989-02-28 General Electric Company Dielectric inks for multilayer copper circuits
US4816615A (en) * 1987-08-20 1989-03-28 General Electric Company Thick film copper conductor inks
US4788163A (en) * 1987-08-20 1988-11-29 General Electric Company Devitrifying glass frits
DE102006062428B4 (de) 2006-12-27 2012-10-18 Schott Ag Verfahren zur Herstellung eines mit einem bleifreien Glas passiviertenelektronischen Bauelements sowie elektronisches Bauelement mit aufgebrachtem bleifreien Glas und dessen Verwendung
DE102009027109B4 (de) * 2009-06-23 2012-02-16 Schott Ag Bleihaltiges Weltraumglas, seine Herstellung und Verwendung
JP2012031048A (ja) * 2010-07-01 2012-02-16 Nippon Electric Glass Co Ltd 無鉛半導体封入用ガラス
EP2717299B1 (en) * 2011-05-26 2016-07-27 Shindengen Electric Manufacturing Co., Ltd. Glass composition for semiconductor junction protection, production method for semiconductor device, and semiconductor device
JP5548276B2 (ja) * 2011-08-29 2014-07-16 新電元工業株式会社 半導体接合保護用ガラス組成物、半導体装置の製造方法及び半導体装置

Also Published As

Publication number Publication date
JPS59174544A (ja) 1984-10-03

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