JPS6379976A - Electroless gold plating solution - Google Patents
Electroless gold plating solutionInfo
- Publication number
- JPS6379976A JPS6379976A JP22183586A JP22183586A JPS6379976A JP S6379976 A JPS6379976 A JP S6379976A JP 22183586 A JP22183586 A JP 22183586A JP 22183586 A JP22183586 A JP 22183586A JP S6379976 A JPS6379976 A JP S6379976A
- Authority
- JP
- Japan
- Prior art keywords
- gold
- plating solution
- gold plating
- soln
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 44
- 239000010931 gold Substances 0.000 title claims abstract description 44
- 238000007747 plating Methods 0.000 title claims abstract description 42
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 38
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 claims abstract description 7
- DHCDFWKWKRSZHF-UHFFFAOYSA-N sulfurothioic S-acid Chemical compound OS(O)(=O)=S DHCDFWKWKRSZHF-UHFFFAOYSA-N 0.000 claims abstract 3
- CBMIPXHVOVTTTL-UHFFFAOYSA-N gold(3+) Chemical class [Au+3] CBMIPXHVOVTTTL-UHFFFAOYSA-N 0.000 claims 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 abstract description 9
- -1 amine salt Chemical class 0.000 abstract description 9
- 239000003638 chemical reducing agent Substances 0.000 abstract description 7
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 abstract description 6
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052744 lithium Inorganic materials 0.000 abstract description 2
- 229910052700 potassium Inorganic materials 0.000 abstract description 2
- 229910052708 sodium Inorganic materials 0.000 abstract description 2
- 239000011734 sodium Substances 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 239000003002 pH adjusting agent Substances 0.000 abstract 2
- 231100000614 poison Toxicity 0.000 abstract 2
- 230000007096 poisonous effect Effects 0.000 abstract 2
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 abstract 1
- GMKDNCQTOAHUQG-UHFFFAOYSA-L dilithium;dioxido-oxo-sulfanylidene-$l^{6}-sulfane Chemical compound [Li+].[Li+].[O-]S([O-])(=O)=S GMKDNCQTOAHUQG-UHFFFAOYSA-L 0.000 abstract 1
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 abstract 1
- 235000019345 sodium thiosulphate Nutrition 0.000 abstract 1
- 229940071240 tetrachloroaurate Drugs 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 32
- 150000002366 halogen compounds Chemical class 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 150000003839 salts Chemical group 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- DHCDFWKWKRSZHF-UHFFFAOYSA-L thiosulfate(2-) Chemical compound [O-]S([S-])(=O)=O DHCDFWKWKRSZHF-UHFFFAOYSA-L 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 235000018936 Vitellaria paradoxa Nutrition 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010277 boron hydride Inorganic materials 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- ADPOBOOHCUVXGO-UHFFFAOYSA-H dioxido-oxo-sulfanylidene-$l^{6}-sulfane;gold(3+) Chemical compound [Au+3].[Au+3].[O-]S([O-])(=O)=S.[O-]S([O-])(=O)=S.[O-]S([O-])(=O)=S ADPOBOOHCUVXGO-UHFFFAOYSA-H 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- SRCZENKQCOSNAI-UHFFFAOYSA-H gold(3+);trisulfite Chemical compound [Au+3].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O.[O-]S([O-])=O SRCZENKQCOSNAI-UHFFFAOYSA-H 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000006174 pH buffer Substances 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000001603 reducing effect Effects 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000004764 thiosulfuric acid derivatives Chemical class 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Landscapes
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は無電解金めつき液の組成に係り、特にシア／化
物イオンを含まず、かつ高安定な厚付は可能な無電解金
めつき液に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to the composition of an electroless gold plating solution, and in particular to an electroless gold plating solution that does not contain shea/oxide ions and is capable of highly stable thick plating. Regarding dripping liquid.
従来の無電解金めつき液としては、たとえば、グレイテ
ィング、第５７巻（１９７０年）第９１４頁から第９２
０頁（Ｐｌａｔｉｎｇ、 ５７ （１９７０）ＰＰ９１
４−９２０）に示されている０ｋｉｎａｋａによるもの
、米国特許第３３００３２８号公報に記載されているＬ
ｕｃｅによるもの、あるいは特公昭５６−２０３５５号
公報に記載されているノ・ツクらによるものがある。Conventional electroless gold plating solutions include, for example, Grating, Vol. 57 (1970), pp. 914 to 92.
Plating, 57 (1970) PP91
4-920) by Okinaka, and L described in U.S. Pat. No. 3,300,328.
uce, or Notsuk et al. described in Japanese Patent Publication No. 56-20355.
これらの従来技術のうち、０ｋｉｎａｋａの液は多量の
シアン化物イオンを含み、作業時および廃液処理時の安
全性に問題があった。またＬｕｃｅによる液も・・ツク
らによる液のどちらも、シアン化物イオンを含まない無
電解金めつき液であるが、金源中の金イオンが３価であ
るため、 ０ｋｉｎａｋａ。Among these conventional techniques, the Okinaka liquid contains a large amount of cyanide ions, which poses a safety problem during work and waste liquid treatment. Both the solution by Luce and the solution by Tsuk et al. are electroless gold plating solutions that do not contain cyanide ions, but because the gold ions in the gold source are trivalent, they are 0kinaka.
液に比べると多量の還元剤が必要であった。特にＬｕｃ
ｅの液は不安定で、めっき開始後２時間はどで液中に沈
殿が生じてめっきが続けられなくなった。A large amount of reducing agent was required compared to liquid. Especially Luc
The solution e was unstable, and within 2 hours after the start of plating, a precipitate formed in the solution, making it impossible to continue plating.
本発明の目的はめっき液中にシアン化物イオンを全く含
まず、しかもシアン化物イオンを含んだ従来のめっき液
と同程度のめつき液安定性をもつ無電解金めつき液を提
供することにある。The purpose of the present invention is to provide an electroless gold plating solution that does not contain any cyanide ions and has the same level of plating solution stability as conventional plating solutions that contain cyanide ions. be.
上記目的はハロゲン化金（ＩＩ［）塩とチオ硫酸塩。 The above objects are gold(II[) halides and thiosulfates.
亜硫酸塩を少な（とも主成分として含むことを特徴とす
る無電解金めつき液により、達成される。This is achieved by using an electroless gold plating solution that is characterized by containing a small amount of sulfite as a main component.
１作用〕
従来の無電解金めっき液で用いられたシアン化物イオン
は、金イオンと強（結合し、シアン化金錯体を形成させ
た後、還元剤によりシアン化金錯イオンを還元し、金を
析出させる場合、水溶液中の金沈殿物の生成を防止する
。本発明の無電解金めつき液においては、ハロゲン化合
（Ｉ）酸塩は金膜となるもので、これにチオ硫酸塩と亜
硫酸塩を添加することにより、チオスルファト金あるい
は亜硫酸金もしくはこれらの混合の錯体な形成すると思
われる。チオ硫酸塩、亜硫酸塩は金イオンに対する錯化
剤の役割をしていると考えられ、シアン化物イオンと同
様な作用と思われる。一方、これらは若干還元作用もあ
るので、金３価イオンを金１価イオンにしていることも
考えられる。しかるに金３価イオンを直接、還元剤で金
まで析出できないことから明らかである。1 Effect] Cyanide ions used in conventional electroless gold plating solutions strongly bond with gold ions to form a gold cyanide complex, and then reduce the gold cyanide complex ions with a reducing agent to form gold. When precipitating gold, this prevents the formation of gold precipitates in an aqueous solution.In the electroless gold plating solution of the present invention, the halogen compound (I) salt forms a gold film, and thiosulfate and By adding sulfite, it is thought that a complex of gold thiosulfate, gold sulfite, or a mixture thereof is formed. Thiosulfate and sulfite are thought to act as complexing agents for gold ions, and cyanide It seems to have the same effect as ions.On the other hand, since these also have a slight reducing effect, it is possible that trivalent gold ions are converted to monovalent gold ions.However, trivalent gold ions can be directly converted to gold using a reducing agent. This is clear from the fact that it cannot be precipitated.
ハロゲン化合（ＩＩＩ）酸塩はテトラクロ口金酸塩。The halogen compound (III) acid salt is tetracrostomate.
テトラブロム金酸塩、テトラヨード金酸塩を用いること
ができる。また、ハロゲン化合（ＩＩＩ）酸塩と亜硫酸
塩はリチウム、ナトリウム、カリウム、ルビジウム、も
しくはアンモニウム塩を用いることができる。Tetrabromoaurate and tetraiodoaurate can be used. Further, as the halogen compound (III) salt and sulfite, lithium, sodium, potassium, rubidium, or ammonium salts can be used.
本発明におけるめっき液には上述した成分の他に還元剤
が含まれる。さらに有利には、ＰＨ緩衝剤が含まれる。The plating solution in the present invention contains a reducing agent in addition to the above-mentioned components. Further advantageously, a PH buffer is included.
ここで、還元剤は金の表面において還元反応性を示すも
ので、水素化ホウ素化合物。Here, the reducing agent is a boron hydride compound that exhibits reduction reactivity on the surface of gold.
次亜リン酸塩、ヒドラジン、ホルマリン、チオ尿素、ブ
ドウ糖などであり、特に、チオ尿素が好適である。Examples include hypophosphite, hydrazine, formalin, thiourea, and glucose, with thiourea being particularly preferred.
またＰＨ緩衝剤はめっき液の反応を一定に維持する点で
重要である。これらは酸解離定数とＰＨ値との関係から
決まる。例えば、ＰＨ８〜９に維持する場合にはホウ酸
塩、アミン塩類が好ましい。Further, the pH buffer is important in keeping the reaction of the plating solution constant. These are determined from the relationship between acid dissociation constant and pH value. For example, when maintaining the pH at 8 to 9, borates and amine salts are preferred.
以上、本発明の無電解金めっき液の実施例について代表
的なものを用いて説明する。Examples of the electroless gold plating solution of the present invention will be described above using typical examples.
実施例１
大きさ２．５備Ｘ２．５ｃｍ＋厚さ０．３閣の銅板に厚
さ２〜４ｍのニッケル皮膜を、次に厚さ０．２〜１ｍの
金皮膜、３ 。Example 1 A 2-4 m thick nickel film was applied to a copper plate measuring 2.5 x 2.5 cm + 0.3 cm thick, followed by a 0.2-1 m thick gold film.
をそれぞれ電気めっきで形成させた試料とした。The samples were each formed by electroplating.
この試料を脱脂液で、次に希塩酸で洗浄後、水洗する。This sample is washed with a degreasing solution, then with dilute hydrochloric acid, and then with water.
この試料を以下に示す成分のめつき液に２時間浸した。This sample was immersed in a plating solution containing the components shown below for 2 hours.
めっき液の組成９条件
めっき液を攪拌し、３０分毎に試料を取り出し、金膜厚
を重量法により測定した。その結果を第１図の曲線１に
示した。金膜厚は２時間で３．２ｍに達した。析出した
金膜は明黄色であり、液中に沈殿も発生せず、安定であ
った。Composition of Plating Solution 9 Conditions The plating solution was stirred, samples were taken out every 30 minutes, and the thickness of the gold film was measured by gravimetric method. The results are shown in curve 1 in FIG. The gold film thickness reached 3.2 m in 2 hours. The deposited gold film was bright yellow in color and stable with no precipitation occurring in the liquid.
実施例２
上記実施例１と同様に準備した試料を以下に示す成分の
めつき液に２時間浸した。Example 2 A sample prepared in the same manner as in Example 1 above was immersed in a plating solution containing the components shown below for 2 hours.
めっき液の組成１条件
、 ４ 、
めっき液を攪拌し、実施例１と同様に金膜厚を測定した
。その結果を図の曲線２に示した。金膜厚は２時間で、
２．７μｍに達した。金膜は明黄色でめっき液も分解せ
ず、安定であった。Composition of plating solution Conditions 1 and 4. The plating solution was stirred and the gold film thickness was measured in the same manner as in Example 1. The results are shown in curve 2 in the figure. Gold film thickness is 2 hours,
It reached 2.7 μm. The gold film was bright yellow and the plating solution did not decompose and was stable.
実施例３
上記実施例１と同様に準備した試料を以下に示す成分の
めつき液に２時間浸した。Example 3 A sample prepared in the same manner as in Example 1 above was immersed in a plating solution containing the components shown below for 2 hours.
めっき液の組成１条件
めっき液を攪拌し、実施例１と同様に金膜厚な測定した
。その結果を図の曲線６に示した。金膜厚は２時間で２
，４μｍに達した。金膜は明黄色であり、めっき液も分
解せず、安定であった。Composition of Plating Solution 1 Condition The plating solution was stirred and the thickness of the gold film was measured in the same manner as in Example 1. The results are shown in curve 6 in the figure. The thickness of the gold film is 2 in 2 hours.
, reached 4 μm. The gold film was bright yellow and the plating solution did not decompose and was stable.
以上述べたように、本発明によれば有毒なシアン化物イ
オンを含まない無電解めっき液によって壺厚付は金めっ
きを長時間行えるので、無電解金めつき作業の安全化な
らびＫめつき廃液処理の簡素化の点で効果がある。また
、特にセラミック基板など、電子部品の金めつき工程に
本発明を導入すれば、めっき工程を大幅に合理化するこ
とができる０As described above, according to the present invention, thick gold plating can be performed for a long time using an electroless plating solution that does not contain toxic cyanide ions, which makes electroless gold plating work safer and wastes K plating solution. This is effective in simplifying processing. Furthermore, if the present invention is introduced into the gold plating process for electronic components such as ceramic substrates, the plating process can be significantly streamlined.
図は本発明の実施例の無電解金めつき液を用いて、合皮
膜を析出させたときの金膜厚（μｍ）とめつぎ時間（時
間）との関係を示す図である。
１．２．５・・実験データThe figure shows the relationship between the gold film thickness (μm) and the potting time (hours) when a synthetic film is deposited using the electroless gold plating solution of the example of the present invention. 1.2.5...Experimental data
Claims (1)
を少なくとも主成分として含むことを特徴とする無電解
金めつき液。1. An electroless gold plating solution containing at least a halogenated gold(III) salt, a thiosulfate, and a sulfite as main components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61221835A JP2635026B2 (en) | 1986-09-22 | 1986-09-22 | Electroless plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61221835A JP2635026B2 (en) | 1986-09-22 | 1986-09-22 | Electroless plating solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6379976A true JPS6379976A (en) | 1988-04-09 |
| JP2635026B2 JP2635026B2 (en) | 1997-07-30 |
Family
ID=16772938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61221835A Expired - Lifetime JP2635026B2 (en) | 1986-09-22 | 1986-09-22 | Electroless plating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2635026B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH049475A (en) * | 1990-04-26 | 1992-01-14 | Electroplating Eng Of Japan Co | Electroless gold plating bath |
| JPH04371584A (en) * | 1991-06-19 | 1992-12-24 | Nikko Kyodo Co Ltd | Electroless gold plating solution |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2803147A1 (en) * | 1978-01-25 | 1979-07-26 | Heraeus Gmbh W C | Aq. electroless gold plating bath for nickel (plated) parts - contains thiosulphato-aurate, thiosulphate and EDTA, giving good adhesion at low plating temp. |
| JPH0735583A (en) * | 1992-06-20 | 1995-02-07 | Texas Instr Inc <Ti> | System and method of discriminating object |
-
1986
- 1986-09-22 JP JP61221835A patent/JP2635026B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2803147A1 (en) * | 1978-01-25 | 1979-07-26 | Heraeus Gmbh W C | Aq. electroless gold plating bath for nickel (plated) parts - contains thiosulphato-aurate, thiosulphate and EDTA, giving good adhesion at low plating temp. |
| JPH0735583A (en) * | 1992-06-20 | 1995-02-07 | Texas Instr Inc <Ti> | System and method of discriminating object |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH049475A (en) * | 1990-04-26 | 1992-01-14 | Electroplating Eng Of Japan Co | Electroless gold plating bath |
| JPH04371584A (en) * | 1991-06-19 | 1992-12-24 | Nikko Kyodo Co Ltd | Electroless gold plating solution |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2635026B2 (en) | 1997-07-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR910006643B1 (en) | Electroless gold plating solution | |
| JPS5818430B2 (en) | Electroless plating bath and plating method | |
| US4374876A (en) | Process for the immersion deposition of gold | |
| JPH04276081A (en) | Method for electroless plating of tin, lead, or alloy | |
| CN112593220B (en) | Cyanide-free chemical gold-deposition solution suitable for semiconductor and display panel | |
| TW200416299A (en) | Electroless gold plating solution | |
| JPH0293076A (en) | Production of fine metal body utilized for electroless plating | |
| JPH0261073A (en) | Electroless tin plating bath and electroless tin plating method | |
| JPS591668A (en) | Improved non-electrolytic gold plating bath and plating process | |
| US2871139A (en) | Silvering process and materials | |
| US4400415A (en) | Process for nickel plating aluminum and aluminum alloys | |
| JPS6379976A (en) | Electroless gold plating solution | |
| JP3148428B2 (en) | Electroless gold plating solution | |
| GB2133046A (en) | Electroless direct deposition of gold in metallized ceramics | |
| JPS62202080A (en) | Hydrazine bath for chemical deposition of nickel and/or cobalt and preparation thereof | |
| JP2967106B2 (en) | Electronic component manufacturing method | |
| EP0384679B1 (en) | Electrolytic deposition of gold-containing alloys | |
| JPH0860377A (en) | Electroless gold plating solution | |
| JP2000345359A (en) | Electroless gold plating solution | |
| JP3252470B2 (en) | Electroless gold plating solution and bathing method thereof | |
| JPH1112753A (en) | Electroless gold plating method | |
| JPH0250990B2 (en) | ||
| JPS6286171A (en) | Electroless gold plating solution | |
| JP3302512B2 (en) | Electroless gold plating solution | |
| US4167240A (en) | Method of treating an electroplating solution comprising ions of gold and cyanide prior to electroplating and thermocompression bonding |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |