JPS6377132A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To observe a sectional pattern along a cleaving direction by providing a section observing pattern on a linear line of a direction <110> in a semiconductor wafer made of a pattern array which is directed on its plane direction <100> with the surface disposed in a plane (100). CONSTITUTION:When a plurality of semiconductor chips 1 disposed at its surface in a plane (100) are laterally and longitudinally arrayed in a direction <100> with scribing lines 3, a plurality of section observing patterns 1 are provided on the lines 3 along a cleaving direction <110> formed at 45 deg. from the direction <100>. Thus, when the cleaved surface of the pattern 1 is observed, the cleaving surface of each chip 2 can be presumed. When the actual etching pattern 4, an edge identifying mask pattern 5, an original observing surface 6, an erroneous observing surface 7 at the edge, the section 8 of the surface 6 and the section 9 of the surface 7 are examined, whether the cleaving surface of the pattern 1 is correct or not can be determined.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a semiconductor device having a structure that requires cross-sectional observation.

2. Description of the Related Art In the structures of semiconductor devices developed in recent years, there is an increasing need to look at their cross-sectional structures. Particularly in dynamic RAMs that have been developed in recent years, it is necessary to monitor the cross section of the trench structure. Furthermore, providing a cross-sectional observation pattern over the entire semiconductor wafer is not a good idea in terms of effective use of the chip area.

Therefore, a normal cross-sectional observation pattern is formed on a part of the chip, and when performing cross-sectional observation, the cross-sectional observation pattern is cleaved across the cross-sectional observation pattern to observe the cross-section of the cross-sectional observation pattern.

Problems to be Solved by the Invention However, since cleavage is an unstable process, it is not always possible to traverse the cross-sectional observation pattern. especially,
When the cleavage plane comes to the edge of the cross-sectional observation pattern, the area around the edge is different from the cross-sectional observation pattern that should be observed and gives erroneous information.

Therefore, when cleaving and observing a cross-sectional observation pattern, cross-sectional observation near the edges must be avoided. However, when observing a cross section, it is difficult to determine whether the cross section is an edge of the cross-sectional observation pattern or not.

In addition, in a semiconductor wafer consisting of a pattern array in the (110) direction, it is difficult to cleave in the (110) direction.
Semiconductor wafers commonly used have either a diamond crystal structure or a zincblende structure, and these structures typically have <1
It is likely to be cleaved in the 10> direction. ), 110> directions, all cross-sectional observation patterns of each chip lined up on the cleavage plane can be observed. However, in recent years, 100
Semiconductors with pattern arrays in the > direction are increasing.

Therefore, cross-sectional observation in this case has also become necessary.

In this case, the (100> direction is not an easy direction to cleave, so in order to forcibly expose the (11o) plane, it is necessary to make the wafer thinner to make it easier to cleave it, or to expose the cross section by lapping. Therefore, as a simple method for cross-sectional observation, (110
) direction, and after observation, cross-sectional evaluation is performed by correcting the angle.

However, in this case, the patterns are arranged in the (100) direction and the cleavage is made in the <110> direction, so the cross-sectional observation patterns present on each chip cannot be made to continuously cross the cleavage plane.

The purpose of the present invention is to prevent the edges of a cross-sectional observation pattern from being erroneously observed, and to view all the cross-sectional observation butter/of each chip of the pattern arranged in the <100> direction along the cross-sectional direction. That is.

Means for Solving the Problem In a semiconductor wafer whose surface has a (100) plane and consists of a pattern array in the 100> direction, by providing a cross-sectional observation pattern on a straight line in the (110) direction, it is possible to This allows each cross-sectional observation pattern to be observed along the line.

Furthermore, in semiconductor wafers that require a cross-sectional observation pattern, by providing an edge identification pattern in a direction opposite to the cross-sectional observation pattern from the edge of the cross-sectional observation pattern on a line different from the cross-sectional observation pattern, edge identification patterns can be used to provide information different from the original information. This is to prevent incorrect observation and evaluation by the department.

Even in a semiconductor wafer whose working surface has a (100) plane and a pattern arrangement in the <100> direction, it is difficult to cleave the wafer.
By arranging the cross-sectional observation patterns of each chip on a straight line in the 10> direction, it is possible to observe the cross-section of each chip.

Further, an edge identification pattern is provided in the opposite direction from the edge of the cross-sectional observation pattern. As a result, when the cleaved cross section comes to the edge part during cross-sectional observation, an edge identification pattern existing in the opposite direction appears, indicating that the cleavage has come to the edge part. In this way, erroneous information at the edges can be identified.

Example FIG. 1 shows a first embodiment.

1 is a cross-sectional observation pattern, 2 is a chip, and 3 is a scribe line. In this embodiment, a case is shown in which the front surface has a (10Q) plane and the chips 2 are arranged in the <100> direction. Here, the cross-sectional observation pattern 1 is formed on the scribe line 3. 110 in the cleavage direction
The cross-sectional observation patterns 1 are arranged on a straight line in the > direction. By doing this, each cross-sectional observation pattern 1 can be observed using one cleavage plane. Note that the cross-sectional observation pattern is not limited to one row.

A second embodiment is shown in FIGS. 2 and 3.

4 is the actual etching pattern S is a mask pattern for edge identification, 6 is the original observation surface, 7 is the erroneous observation surface at the edge, 8 is the cross section of the observation surface 6, and 9 is the cross section of the observation surface 7. .

When performing cross-sectional observation, you may mistakenly use pattern 1 for cross-sectional observation.
When cleaved at the edge, it is impossible to determine whether the cross-sectional shape is the original correct shape or not. However, this problem can be solved by forming the edge identification mask pattern S in a direction opposite to that of the cross-sectional observation pattern 1 and in a different ridge shape with a different width.

In this way, if an edge is cleaved by mistake, the cross section of the cross section observation pattern 1 and the edge identification mask pattern 5 will appear as shown in 1Q.

Furthermore, when the edge identification mask pattern 5 is cleaved, a cross section with a width different from that of the cross-sectional observation pattern 1 appears,
It can be distinguished from the original pattern 1 for cross-sectional observation. In this way, the original cross-sectional pattern appears only in case 9 and can be easily identified.

FIG. 4 shows a third embodiment.

The chips are arranged in the ku100〉 direction, and the ku110〉
The case of cleavage in the direction is shown.

This is a combination of the first and second embodiments.

Effects of the Invention As described above, according to the present invention, in a semiconductor wafer having a (1oO) surface and a pattern array in the (100) direction, by providing a cross-sectional observation pattern on a straight line in the <110> direction, Each cross-sectional observation pattern can be observed along the cleavage direction.

In addition, for semiconductor wafers that require a cross-sectional observation pattern, by providing an edge identification pattern in the opposite direction and on a different line from the edge of the cross-sectional observation pattern, it is possible to avoid incorrect edges at the edge, which may give information different from the original. This prevents observational evaluation.

[Brief explanation of the drawing]

FIG. 1 is a partial schematic plan view of a semiconductor substrate in the first embodiment method of the present invention, FIG. 2 is a partial plan view of the semiconductor substrate in the second embodiment, and FIG. 3 is the substrate of FIG. 2. FIG. 4 is a partial schematic plan view of a semiconductor substrate in the third embodiment. 1... pattern for cross-sectional observation, 2... chip, 3... scribe line. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure f--Pattern for one-morning service 2-chi, 7.

Claims (3)

[Claims] (1) In a semiconductor wafer having a (100) surface and a pattern array in the <100> direction, the <110>
A method for manufacturing a semiconductor device, characterized in that a cross-sectional observation pattern is provided on a straight line in a direction. (2) Manufacturing a semiconductor device in which an edge identification pattern is provided on a line different from the cross-section observation pattern in a direction opposite to the cross-section observation pattern from the edge of the cross-section observation pattern in a semiconductor wafer requiring cross-section observation. Method. (3) In a semiconductor wafer having a (100) surface and a pattern array in the <100> direction, the <110>
A method of manufacturing a semiconductor device, comprising: providing a cross-sectional observation pattern on a straight line in a direction; and providing an edge identification pattern having a width different from that of the cross-sectional observation pattern in a direction opposite to the cross-sectional observation pattern.