JPS6376293A - Panel heater - Google Patents
Panel heaterInfo
- Publication number
- JPS6376293A JPS6376293A JP22011386A JP22011386A JPS6376293A JP S6376293 A JPS6376293 A JP S6376293A JP 22011386 A JP22011386 A JP 22011386A JP 22011386 A JP22011386 A JP 22011386A JP S6376293 A JPS6376293 A JP S6376293A
- Authority
- JP
- Japan
- Prior art keywords
- heater
- substrate
- hollow
- heater element
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 33
- 239000011521 glass Substances 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 239000010410 layer Substances 0.000 description 8
- 239000011247 coating layer Substances 0.000 description 6
- 238000010304 firing Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
Landscapes
- Surface Heating Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は暖房器、調理器、乾燥機器などの電気エネルギ
ーを利用した機器の熱源として使用される面ヒータに関
するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a surface heater used as a heat source for appliances that utilize electrical energy, such as space heaters, cooking appliances, and drying appliances.
従来の技術
近年、面ヒータは機器の薄型化、均一加熱などの要望に
合った発熱体として脚光を浴びるようになり、従来より
１次に示すような各種の面ヒータが開発されている。BACKGROUND OF THE INVENTION In recent years, surface heaters have come into the spotlight as heating elements that meet the demands of thinning devices and uniform heating, and various surface heaters as shown in the following have been developed.
（１）雲母などの絶縁基板にヒータを巻回した構造を有
するもの。(1) One that has a structure in which a heater is wound around an insulating substrate such as mica.
（至））アルミナ基板にタングステンなどの導電ペース
トにより導電パターンを形成し、さらにこの導電パター
ンの上にアルミナ基板を設けて一体化した構造を有する
もの。(To)) An integrated structure in which a conductive pattern is formed on an alumina substrate using a conductive paste such as tungsten, and an alumina substrate is further provided on top of this conductive pattern.
（３） シリコン、ポリイミドなどの有機質フィルム
の間に導電パターンを形成し、ラミネート化した構造を
有するもの。(3) A device with a laminated structure in which a conductive pattern is formed between organic films such as silicon or polyimide.
しかしながら、これらの面ヒータのうち、（１）の面ヒ
ータは、被加熱物への熱伝達が悪く、ヒータが封止され
ていないために耐湿特性に問題があり。However, among these surface heaters, the surface heater (1) has poor heat transfer to the object to be heated and has problems in moisture resistance because the heater is not sealed.
また＠）の面ヒータは、電気取り出し端子部の強度が弱
く、熱容量が大きいために立ち上がり時間が長く、さら
に（３）の面ヒータは、耐熱温度が低く、寿命特性に問
題があった。In addition, the surface heater (@) has a low strength electrical lead-out terminal portion and a large heat capacity, so it takes a long time to rise.Furthermore, the surface heater (3) has a low heat resistance temperature and has a problem with its lifespan.
このため、上記問題を解決するために１特開昭５８−２
２５６９２号公報で示されているように。Therefore, in order to solve the above problem,
As shown in Publication No. 25692.
ホーロ基板の応用による面ヒータが提案されている。ま
た本発明者らは前記ホーロ基板の応用による面ヒータを
さらに改善し１平滑な網目状の金属箔体かもなるヒータ
エレメントの応用による新しい面ヒータを提案している
、本発明者らの提案による面ヒータは、ホーロ基板の上
にホーロ材よりなるヒータ被覆層を設け、このヒータ被
覆層の中に平滑な網目状の金属箔体からなるヒータエレ
メントと１このヒータエレメントに接続された電気取り
出し端子板の一部とを埋設した構造を有していた。A surface heater using a hollow substrate has been proposed. In addition, the present inventors have further improved the surface heater by applying the above-mentioned hollow substrate, and have proposed a new surface heater by applying a heater element which may also be a smooth mesh metal foil body. In the surface heater, a heater coating layer made of hollow material is provided on a hollow substrate, and in this heater coating layer there is a heater element made of a smooth mesh-like metal foil body and an electric lead-out terminal connected to the heater element. It had a structure in which part of the board was buried.
発明が解決しようとする問題点
前述した構造を有する面ヒータにおいては、電気絶縁層
を形成するホーロ基板のホーロ膜厚が１５０〜２００μ
ｍであり、ヒータエレメントを被覆するヒータ被覆層と
の膜層を合わせると３００〜５００μｍ程度の膜厚とな
り、その結果、ホーロ層の膜厚としては非常に厚くなる
。他方、ヒータエレメントが固着されていない面のホー
ロ膜厚は電気絶縁層のみであるため、その膜厚は１５０
〜２００μｍであり、したがってその差は２倍以上とな
る。一般的にホーロの焼成温度は８００″Ｃ前後であり
、ヒータエレメントをホーロ基板に固着するためのヒー
タ被覆層の焼成も８００℃前後である。したがって、ヒ
ータ被覆層の焼成後に基板が大きくそるなどの問題があ
った。さらに、ヒータ被覆層の焼成時にホーロ基板の電
気絶縁層が軟化して、金属基板とヒータエレメントの絶
縁距離を確保できない場合が発生する。これに加えて、
ホーロ基板の電気絶縁層が２度の焼成過程を通るまで絶
縁被膜に欠陥が生じて、電気特性を損うなどの問題があ
った。Problems to be Solved by the Invention In the surface heater having the above-described structure, the hollow film thickness of the hollow substrate forming the electrical insulating layer is 150 to 200 μm.
m, and when the film layers including the heater coating layer that covers the heater element are combined, the film thickness is about 300 to 500 μm, and as a result, the film thickness of the hollow layer is very thick. On the other hand, since the hollow film thickness on the surface to which the heater element is not fixed is only the electrical insulation layer, the film thickness is 150 mm.
~200 μm, so the difference is more than double. Generally, the firing temperature for hollow hollow is around 800"C, and the firing of the heater coating layer for fixing the heater element to the hollow substrate is also around 800"C.Therefore, after firing the heater coating layer, the substrate may warp greatly. There was a problem.Furthermore, when the heater coating layer was fired, the electrical insulating layer of the hollow substrate softened, and the insulation distance between the metal substrate and the heater element could not be secured.In addition to this,
Until the electrical insulating layer of the hollow substrate passes through the firing process twice, defects occur in the insulating coating, which causes problems such as loss of electrical properties.
本発明はこのような問題点を解決した面ヒータを提供す
ることを目的とするものである。An object of the present invention is to provide a surface heater that solves these problems.
問題点を解決するための手段
上記問題点を解決するために本発明は、鉛系の低溶融ガ
ラスフリットを主成分とした電気絶縁被膜でヒータエレ
メントを被覆した転写エレメントを備え、この転写エレ
メントを絶縁性基板に融着したものである。Means for Solving the Problems In order to solve the above problems, the present invention includes a transfer element in which the heater element is coated with an electrically insulating coating mainly composed of lead-based low-melting glass frit. It is fused to an insulating substrate.
作用
上記構成によれば、絶縁性基板に、転写ヒータエレメン
トを融着して構成する面ヒータにおいて、ヒータエレメ
ントを被覆する電気絶縁被膜を鉛系の低溶融ガラスフリ
ットを主成分とした被膜にしているため、融着温度を低
くすることができ、その結果、絶縁性基板のそりが防止
できる。また絶縁性基板としてホーロ基板を用いた場合
、ホーロ基板のホーロ層の軟化点以下でヒータエレメン
トの融着が可能となり、したがって融着時にホーロ基板
のホーロ被膜を損傷することはなく、かつピンホールの
ない電気絶縁層を確保することができるため、電気特性
の大巾な改善がはかれる。Effect According to the above configuration, in the surface heater constructed by fusing the transferred heater element to the insulating substrate, the electrically insulating coating covering the heater element is made of a coating mainly composed of lead-based low-melting glass frit. Therefore, the fusion temperature can be lowered, and as a result, warping of the insulating substrate can be prevented. In addition, when a hollow substrate is used as an insulating substrate, the heater element can be fused below the softening point of the hollow layer of the hollow substrate, so the hollow coating of the hollow substrate will not be damaged during fusion, and there will be no pinholes. Since it is possible to secure an electrically insulating layer free of oxidation, the electrical properties can be greatly improved.
実施例
以下１本発明の実施例を添付図面にもとづいて説明する
。第１図は本発明の面ヒータを構成する転写ヒータニレ
メントムの製造方法を示したもので、乙に示すように、
まず、吸水性の基紙に樹脂フィルムを貼シ合わせ、この
樹脂フィルムの表面にポリビニルアルコール等の水溶性
高分子を糊引した台紙１を用意し、この台紙１の上に、
ｂに示すように、鉛系の低溶融ガラスフリット（１ＷＦ
−７５７０，イワキ硝子（株）製）とスキージ−オイル
を必要に応じて添加する微量成分とを混練したペースＩ
ｆシルクスクリーン印刷法などの手段を用いて印刷する
ことにより、電気絶縁被膜２を形成する。そしてこれを
乾燥した後、Ｃに示すように、電気絶縁被膜２の上に接
着剤層３を印刷し、そして未乾燥の状態でヒータエレメ
ント４を載せる。このヒータエレメント４は金属の箔体
を網目状に形成したものを用いた。なお、接着剤層３は
電気絶縁被膜２と同一組成のペーストを用いた０
そしてＣのように構成されたものを、ｄに示すように、
ヒータエレメント４が移動しないように台紙１側からマ
グネット６を当てて磁力により、ヒータエレメント４を
固定する。次にヒータエレメント４の上に電気絶縁被膜
２′を形成し、そしてこれを乾燥してｅに示すような転
写ヒータニレメントムを作成した。Embodiments Below, one embodiment of the present invention will be described based on the accompanying drawings. FIG. 1 shows a method of manufacturing a transfer heater nilemet constituting the surface heater of the present invention, and as shown in B,
First, a resin film is laminated onto a water-absorbing base paper, a mount 1 is prepared by pasting a water-soluble polymer such as polyvinyl alcohol on the surface of this resin film, and on top of this mount 1,
As shown in b, lead-based low melting glass frit (1WF
-7570, manufactured by Iwaki Glass Co., Ltd.) and a trace component of squeegee oil added as necessary.
f) The electrically insulating coating 2 is formed by printing using a method such as silk screen printing. After drying this, as shown in C, an adhesive layer 3 is printed on the electrically insulating film 2, and a heater element 4 is placed on it in an undried state. The heater element 4 used was a metal foil formed into a mesh shape. Note that the adhesive layer 3 is made of a paste having the same composition as the electrical insulating film 2, and the adhesive layer 3 is constructed as shown in C, as shown in d.
A magnet 6 is applied from the mount 1 side so that the heater element 4 does not move, and the heater element 4 is fixed by magnetic force. Next, an electrically insulating film 2' was formed on the heater element 4, and this was dried to produce a transfer heater element as shown in e.
第２図は絶縁性基板Ｂの実施例を示すもので。FIG. 2 shows an example of the insulating substrate B.
これは金属基板（材質５ＰＰ）６に普通ホーロ７を施し
てなるホーロ基板を用いた。This used a hollow substrate made by applying a normal hollow hole 7 to a metal substrate (5PP material) 6.
第３図は本発明の面ヒータの製造方法の一実施例を示す
もので、ａＵ絶縁性基板（基板形状９゜×６０．厚さ１
．０）ＢＫ、水に浸漬した転写ヒータニレメントムの台
紙を剥離させながら転写する工程を図示したもので、転
写後、布などで上から押さえて、水分を取り、自然乾燥
で２４時間放置後、６２０℃で８分間焼成して、ｂに示
すような面ヒータを作成した。その後、Ｃに示すように
、ｂで示した面ヒータにリード線８を固定して完成面ヒ
ータを構成したものである。Figure 3 shows an embodiment of the method for manufacturing a surface heater of the present invention, in which an aU insulating substrate (substrate shape: 9° x 60°, thickness: 1
．． 0) BK, this diagram shows the process of transferring while peeling off the backing paper of the transfer heater element dipped in water. After transfer, press from above with a cloth to remove moisture, and leave to air dry for 24 hours. , and baked at 620° C. for 8 minutes to produce a surface heater as shown in b. Thereafter, as shown in C, the lead wires 8 were fixed to the surface heater shown in b to construct a completed surface heater.
以上のような方法で、ｎ＝１０のサンプルを作成し％特
性評価を行なった。Using the method described above, n=10 samples were prepared and their % characteristics were evaluated.
測定項目としては、（１）絶縁性基板のそり、（２１冷
時絶縁抵抗、（３１熱時絶縁抵抗、（４１冷時限界耐圧
、（６）熱時限界耐圧の各項目を測定した。The following items were measured: (1) Warpage of the insulating substrate, (21) Insulation resistance when cold, (31) Insulation resistance when hot, (41) Limit withstand voltage when cold, (6) Limit withstand voltage when hot.
測定結果は次表の通りである。The measurement results are shown in the table below.
（以下 余 白）
以上の結果から本発明の面ヒータは基板のそりが少なく
、安定した電気特性が得られることがあきらかになった
。さらに本発明者らは電気絶縁被膜２．２′の低溶融ガ
ラスフリットについて、種種検討した結果、焼成温度が
４００’Ｃ〜６００’Ｃで、熱膨張係数が９０〜１１ｏ
×１０−７１／℃の範囲のガラスフリットが適している
ことを見いだした。焼成温度が４００℃以下のガラスフ
リストはアルカリ成分が多いため、電気特性に問題があ
り、また被膜強度も弱く、リード線の引張り強度を確保
できないなどの問題があった。また、焼成温度が６００
℃以上になると安定した電気特性が得にくかった。一方
、熱膨張係数が９０Ｘ１０’１／℃以下になると基板の
そりが大きくなったり、被膜にヒケが発生するなどの問
題があった。熱膨張係数が１１０Ｘ１０’１／”Ｃ以上
になると熱衝撃温度が極端に低下するなどの問題点があ
った。(Hereinafter, blank) From the above results, it is clear that the surface heater of the present invention has less warpage of the substrate and stable electrical characteristics can be obtained. Furthermore, the present inventors investigated various types of low-melting glass frit for the electrical insulation coating 2.2', and found that the firing temperature was 400'C to 600'C and the thermal expansion coefficient was 90 to 11o.
It has been found that a glass frit in the range x10-71/°C is suitable. Glass frist fired at a temperature of 400° C. or lower has a high alkali content, which causes problems in electrical properties, and also has a weak coating strength, making it impossible to ensure the tensile strength of lead wires. In addition, the firing temperature is 600
When the temperature exceeds ℃, it is difficult to obtain stable electrical characteristics. On the other hand, when the coefficient of thermal expansion is less than 90×10'1/° C., there are problems such as increased warping of the substrate and occurrence of sink marks on the coating. When the thermal expansion coefficient exceeds 110×10′1/”C, there are problems such as an extremely low thermal shock temperature.
発明の効果
以上のように、本発明の面ヒータば、鉛系の低溶融ガラ
スフリットを主成分とした電気絶縁破膜でヒータエレメ
ントを被覆した転写エレメントを備え、この転写エレメ
ントを絶縁性基板に融着して構成しているため、基板の
そりを防止し、安定した電気特性を得ることができるも
のである。Effects of the Invention As described above, the surface heater of the present invention includes a transfer element in which the heater element is covered with an electrically insulating rupture film mainly composed of lead-based low-melting glass frit, and this transfer element is attached to an insulating substrate. Since it is constructed by fusion bonding, it is possible to prevent the substrate from warping and obtain stable electrical characteristics.
第１図は本発明の面ヒータに用いられる転写ヒータエレ
メントの製造方法を示す断面図、第２図は本発明の面ヒ
ータに用いられる絶縁性基板の断面図、第３図は同面ヒ
ータの製造方法を示す断面図である。
１・・・・・・台紙、２．２’・・・・・・電気絶縁被
膜、４・・・・・・ヒータエレメント、ム・・・・・・
転写エレメントｂ Ｂ・・・・・・絶縁性基板。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
ハ
第２図FIG. 1 is a sectional view showing a method of manufacturing a transfer heater element used in the surface heater of the present invention, FIG. 2 is a sectional view of an insulating substrate used in the surface heater of the present invention, and FIG. 3 is a sectional view of the same surface heater. It is a sectional view showing a manufacturing method. 1... Mounting paper, 2.2'... Electrical insulation coating, 4... Heater element, Mu...
Transfer element b B...Insulating substrate. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2
Claims (3)
絶縁被膜でヒータエレメントを被覆した転写エレメント
を備え、この転写性エレメントを絶縁性基板に融着して
構成したことを特徴とする面ヒータ。(1) A surface characterized by comprising a transfer element in which a heater element is coated with an electrically insulating film mainly composed of a lead-based low-melting glass frit, and the transferable element is fused to an insulating substrate. heater.
が４００℃〜６００℃の範囲であることを特徴とする特
許請求の範囲第１項記載の面ヒータ。(2) The surface heater according to claim 1, wherein the temperature at which the transfer element is fused to the insulating substrate is in the range of 400°C to 600°C.
１１０×１０＾−＾７１／℃であることを特徴とする特
許請求の範囲第１項記載の面ヒータ。(3) The coefficient of thermal expansion of the low melting glass frit is 90~
The surface heater according to claim 1, characterized in that the temperature is 110×10^-^71/°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22011386A JPS6376293A (en) | 1986-09-18 | 1986-09-18 | Panel heater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22011386A JPS6376293A (en) | 1986-09-18 | 1986-09-18 | Panel heater |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6376293A true JPS6376293A (en) | 1988-04-06 |
Family
ID=16746116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22011386A Pending JPS6376293A (en) | 1986-09-18 | 1986-09-18 | Panel heater |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6376293A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58225592A (en) * | 1982-06-24 | 1983-12-27 | 松下電器産業株式会社 | Panel heater |
| JPS60143584A (en) * | 1983-12-28 | 1985-07-29 | 松下電器産業株式会社 | Method of producing heat generator |
| JPS612290A (en) * | 1984-06-14 | 1986-01-08 | 松下電器産業株式会社 | Panel heater |
| JPS6129090A (en) * | 1985-02-14 | 1986-02-08 | 松下電器産業株式会社 | Article having panel heater |
| JPS61128487A (en) * | 1984-11-26 | 1986-06-16 | 松下電器産業株式会社 | Manufacture of heat generating body |
-
1986
- 1986-09-18 JP JP22011386A patent/JPS6376293A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58225592A (en) * | 1982-06-24 | 1983-12-27 | 松下電器産業株式会社 | Panel heater |
| JPS60143584A (en) * | 1983-12-28 | 1985-07-29 | 松下電器産業株式会社 | Method of producing heat generator |
| JPS612290A (en) * | 1984-06-14 | 1986-01-08 | 松下電器産業株式会社 | Panel heater |
| JPS61128487A (en) * | 1984-11-26 | 1986-06-16 | 松下電器産業株式会社 | Manufacture of heat generating body |
| JPS6129090A (en) * | 1985-02-14 | 1986-02-08 | 松下電器産業株式会社 | Article having panel heater |
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