JPS63301482A - Manufacture of ceramic heater - Google Patents
Manufacture of ceramic heaterInfo
- Publication number
- JPS63301482A JPS63301482A JP62137937A JP13793787A JPS63301482A JP S63301482 A JPS63301482 A JP S63301482A JP 62137937 A JP62137937 A JP 62137937A JP 13793787 A JP13793787 A JP 13793787A JP S63301482 A JPS63301482 A JP S63301482A
- Authority
- JP
- Japan
- Prior art keywords
- resistance
- thermal expansion
- coefficient
- paste
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000011521 glass Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- 239000000843 powder Substances 0.000 claims abstract description 9
- 239000011230 binding agent Substances 0.000 claims abstract description 7
- 239000002904 solvent Substances 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 4
- 238000010304 firing Methods 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims 1
- 230000006866 deterioration Effects 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 230000007547 defect Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 229910052878 cordierite Inorganic materials 0.000 description 5
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 5
- 238000000635 electron micrograph Methods 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- CNLWCVNCHLKFHK-UHFFFAOYSA-N aluminum;lithium;dioxido(oxo)silane Chemical compound [Li+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O CNLWCVNCHLKFHK-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 229910000174 eucryptite Inorganic materials 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000006072 paste Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052642 spodumene Inorganic materials 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
Landscapes
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の技術分野１
本発明は、低熱膨張のセラミック基板上に抵抗発熱回路
を設けたセラミックヒータ−の製造方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention 1] The present invention relates to a method of manufacturing a ceramic heater in which a resistance heating circuit is provided on a low thermal expansion ceramic substrate.
［発明の技術的背景とその問題点］
近年、２００°Ｃ前後の温度範囲で使用する中温型パネ
ルヒーターとして、基板材質にセラミックを用い、この
基板上にガラスフリット、バインダー、溶剤と共にペー
スト化した金属粉末を厚膜的手法にて発熱抵抗回路とし
たセラミックパネルヒーターがある。このようなパネル
ヒーター用の基板材料としては、アルミナ、コージエラ
イト等が一般的であるが、アル邦すは熱膨張係数が大き
いため、急加熱や急冷却といった熱衝撃に対する耐性が
充分とはいえない、この点、コージエライトは熱膨張係
数が小さく体熱衝撃性に優れた材料であるが、この基板
上に抵抗発熱層を厚膜的に形成したものについては以下
のような欠点がある。 即ち、抵抗体と基板との接着の
役割を果たす抵抗やペースト中のガラスフリットの熱膨
張係数が基板の熱膨張係数と合わないため、ペーストを
基板に焼き付けた後の冷却過程でペースト中のガラスに
クランクが発生し、形成された膜の欠陥となる。即ち、
本来緻密で均一な構造となるべき抵抗膜が多孔体になっ
ているのである。[Technical background of the invention and its problems] In recent years, as medium-temperature panel heaters used in the temperature range of around 200°C, ceramic has been used as the substrate material, and pastes have been made on this substrate together with glass frit, binder, and solvent. There is a ceramic panel heater that uses metal powder as a heating resistance circuit using a thick film method. Alumina, cordierite, etc. are commonly used as substrate materials for such panel heaters, but since aluminum has a large coefficient of thermal expansion, it cannot be said to have sufficient resistance to thermal shocks such as rapid heating and cooling. In this regard, although cordierite is a material with a small coefficient of thermal expansion and excellent body thermal shock resistance, the following disadvantages arise when a resistive heating layer is formed thickly on this substrate. In other words, the coefficient of thermal expansion of the resistor and the glass frit in the paste, which serve to bond the resistor and the substrate, does not match the coefficient of thermal expansion of the substrate, so the glass in the paste is heated during the cooling process after baking the paste onto the substrate. Crank occurs, resulting in defects in the formed film. That is,
The resistive film, which should originally have a dense and uniform structure, is now porous.
このような欠陥が膜中に多く存在し、膜の多孔性が著し
くなるほど、抵抗体中に電流が通りにくくなると同時に
、抵抗体に通電したときに抵抗体の一部だけに局所的な
発熱が起こり、抵抗体の変質、劣化、更には断線を引き
起こす原因となる。The more such defects exist in the film, and the more porous the film becomes, the more difficult it becomes for current to pass through the resistor, and at the same time, when electricity is applied to the resistor, local heat generation occurs only in a part of the resistor. This can cause deterioration, deterioration, and even disconnection of the resistor.
言い換えれば、従来の厚膜抵抗回路はその膜構造のため
、長時間の通電により劣化を起こし、その寿命特性、信
頬性が充分とはいえないものであった。In other words, due to the film structure of the conventional thick film resistor circuit, it deteriorates when energized for a long time, and its life characteristics and reliability cannot be said to be sufficient.
［発明の目的］
本発明は、熱膨張係数が３ Ｘ １０−’／ ’Ｃ以下
の低膨張率のセラミンク基板上に１、金属粉末、熱膨張
係数が４ Ｘ １０−’／ ’Ｃ以下の低膨張ガラスフ
リット、バインダー、溶剤を混合してペースト化した抵
抗ペーストを塗布して抵抗発熱体層を設けたことを特徴
とするセラミックヒータ−の製造方法である。[Purpose of the Invention] The present invention is based on a ceramic substrate having a low expansion coefficient of 3 x 10-'/'C or less, a metal powder, and a metal powder having a thermal expansion coefficient of 4 x 10-'/'C or less. This method of manufacturing a ceramic heater is characterized in that a resistance heating layer is provided by applying a resistance paste made by mixing a low-expansion glass frit, a binder, and a solvent.
［発明の詳細な
説明は、熱膨張係数が３ Ｘ １０−’／ ’Ｃ以下の
低膨張率のセラミック基板上に、金属粉末、熱膨張係数
が４Ｘ１０−’／”Ｃ以下の低膨張ガラスフリット、バ
インダー、溶剤を混合してペースト化した抵抗ペースト
を塗布して抵抗発熱体層を設け、こうすることにより抵
抗膜の欠陥を減少させ長時間の通電によっても劣化を生
じないような寿命特性の優れたセラミックヒータ−を提
供するものである。[Detailed description of the invention is that a metal powder and a low-expansion glass frit with a thermal expansion coefficient of 4 X 10-'/''C or less are placed on a low-expansion ceramic substrate with a thermal expansion coefficient of 3 X 10-'/'C or less. A resistive heating element layer is formed by applying a resistive paste made by mixing paste, binder, and solvent.This reduces defects in the resistive film and improves its lifespan so that it does not deteriorate even when energized for a long time. This provides an excellent ceramic heater.
この点について具体的に説明すると、セラミック基板と
してはヒーター用として充分な耐熱衝撃性を有する３
Ｘ １０−’／ ’Ｃ以下の材料、具体的にはコージエ
ライト、スポジューメン、ユークリプタイト、石英ガラ
スなどをドクターブレード法、押し出し法、抄紙法など
の方法によって成形し焼結させたものが用いられる。To explain this point specifically, the ceramic substrate has sufficient thermal shock resistance for use in heaters.
X 10-'/'C or less material, specifically cordierite, spodumene, eucryptite, quartz glass, etc., formed and sintered by methods such as the doctor blade method, extrusion method, and papermaking method is used. .
抵抗ペーストの金属粉末としては、銀、パラジウム、白
金、金及びこれらの混合物が用いられるが、この他の物
質でも抵抗体として用いる際にはその抵抗温度特性が正
の特性を持つもの即ち温度の上昇に伴いその抵抗値が増
加する性質のものであればとくに制限はない。Silver, palladium, platinum, gold, and mixtures thereof are used as the metal powder in the resistance paste, but when using other materials as resistors, it is necessary to use materials that have positive resistance-temperature characteristics, that is, those that have positive resistance-temperature characteristics. There is no particular restriction as long as the resistance value increases as the resistance increases.
次に抵抗ペーストのガラスフリットとしては、熱膨張係
数が４Ｘ１０−７／℃以下望ましくは、３ Ｘ １０−
’／ ”Ｃ以下のアルミ硅酸塩、ホウケイ酸鉛、石英ガ
ラス等のフリットが用いられる。 このようにペースト
中のガラスフリット基板との熱膨張係数を合わせること
により抵抗ペーストを基板に印刷、焼成後に起きるペー
スト中のガラスフリントのクランク発生を抑え、欠陥の
ない均一な抵抗膜を具現することができる。なお、上記
の金属粉末と低膨張ガラスフリットとの混合割合は、必
要とされらシート抵抗値に基づいて決定されるものであ
り特に制限はない。ペーストのバインダーとしてはセル
ロース系樹脂、アクリル系樹脂等ペーストの印刷適性を
損なわず、またペースト焼成時に容易に脱バインダーが
行われるものであれば特に制限はない。Next, the glass frit of the resistance paste should have a coefficient of thermal expansion of 4X10-7/°C or less, preferably 3X10-
Frits made of aluminum silicate, lead borosilicate, quartz glass, etc. with a temperature below C are used. In this way, by matching the coefficient of thermal expansion with the glass frit substrate in the paste, the resistance paste can be printed on the substrate and fired. It is possible to suppress the cranking of glass flint in the paste that occurs later, and realize a uniform resistance film without defects.The mixing ratio of the metal powder and low expansion glass frit described above is determined according to the required sheet resistance. It is determined based on the value and there are no particular restrictions.The binder for the paste may be cellulose resin, acrylic resin, etc., as long as it does not impair the printability of the paste and can be easily removed during paste baking. There are no particular restrictions.
溶剤としては、ブチルカルピトールアセテート、テルピ
ネオールなどの印刷適性を損なわず適当な乾燥速度のも
のであれば特に制限はない。The solvent is not particularly limited as long as it does not impair printability and has an appropriate drying rate, such as butylcarpitol acetate and terpineol.
ペースト基板への焼き付は温度は低膨張ガラスフリット
の融点及び金属粉末の抵抗値の焼成温度特性によって決
定されるが、−Ｃ的には７００〜９００°Ｃ望ましくは
８００〜８５０°Ｃの温度で行われる。The temperature for baking the paste substrate is determined by the melting point of the low expansion glass frit and the firing temperature characteristics of the resistance value of the metal powder, but in terms of -C, the temperature is 700 to 900°C, preferably 800 to 850°C. It will be held in
［実 施 例１ 本発明を具現するものとして以下に実施例を説明する。[Implementation Example 1] Examples will be described below as embodiments of the present invention.
（実施例 １）
粒度調整を行った銀粉末５５重量部、パラジウム粉末３
０重量部、膨張係数３３Ｘ１０−７／℃の低膨張ガラス
フリット１５重量部を均一に混合し、エチルセルロース
系バインダー及びブチルカルピトールアセテートにより
ペースト化を行った。(Example 1) 55 parts by weight of silver powder and 3 parts by weight of palladium powder with particle size adjustment
0 parts by weight and 15 parts by weight of a low expansion glass frit with an expansion coefficient of 33 x 10-7/°C were uniformly mixed and made into a paste using an ethyl cellulose binder and butyl carpitol acetate.
このペーストを用いてコージュライト基板上にスクリー
ン印刷により抵抗回路を印刷し、酸化雰囲気中に８００
″ＣＩＯ分間の焼成を行い抵抗回路Ａを一方、比較のた
め、７ ｘ １０−’／ ’ｃのガラスフリットを用い
て、上記と同様に銀−パラジウムペーストを作成し、同
じコージュライト基板上に印刷、焼成を行い抵抗回路Ｂ
を得た。Using this paste, a resistor circuit was printed on a cordierite substrate by screen printing, and
On the other hand, for comparison, a silver-palladium paste was prepared in the same manner as above using a 7 x 10-'/'c glass frit, and it was baked on the same cordierite substrate. Print and bake to create resistance circuit B
I got it.
第１図には本発明によって得られた抵抗回路Ａ、第２図
には比較の為の抵抗回路Ｂの表面電子顕微鏡写真を示し
た。この図からも分かるように第２図の抵抗発熱体層は
、Ｈ横にクランク欠陥が走るのに対して第１図の抵抗発
熱体＋５は欠陥のない抵抗膜が形成されていることが分
かる。FIG. 1 shows a surface electron micrograph of a resistor circuit A obtained according to the present invention, and FIG. 2 shows a surface electron micrograph of a resistor circuit B for comparison. As can be seen from this figure, the resistance heating element layer in Fig. 2 has a crank defect running along the H side, whereas the resistance heating element +5 in Fig. 1 has a resistive film with no defects. .
又それぞれの回路Ａ、Ｂに１００Ｖの直流電圧を印加し
、約ＩＡの電流の連続通電をおこなったところ、欠陥の
多い回路Ｂでは比較的短時間の内に抵抗体の劣化、断線
がみられたが、一方の回路Ａでは長時間の連続通電にお
いても殆ど抵抗体の劣化は生ぜず、本発明によるセラミ
ンクヒーターは実用土掻めてそ３れたものである。In addition, when a DC voltage of 100V was applied to each circuit A and B, and a current of about IA was continuously passed, deterioration of the resistor and disconnection were observed in circuit B, which had many defects, within a relatively short period of time. However, in circuit A, there was almost no deterioration of the resistor even after continuous energization for a long time, and the ceramic heater according to the present invention has surpassed this in practical use.
第１図は、本発明の製造方法により得られた抵抗発熱体
層の表面を示す電子顕微鏡写真であり、第２図は比較例
の抵抗発熱体層の表面を示す電子顕微鏡写真である。
特 許 出 願 人
凸版印刷株式会社
代表者 鈴木和夫
第 １図FIG. 1 is an electron micrograph showing the surface of a resistive heating element layer obtained by the manufacturing method of the present invention, and FIG. 2 is an electron micrograph showing the surface of a resistive heating element layer of a comparative example. Patent application: Toppan Printing Co., Ltd. Representative: Kazuo Suzuki Figure 1
Claims (1)
ラミック基板上に、少なくとも、金属粉末、熱膨張係数
が４×１０＾−＾７／℃以下の低膨張ガラスフリット、
バインダー、溶剤を混合してペースト化した抵抗ペース
トを塗布し、焼成することにより焼結した抵抗発熱体層
を設けたことを特徴とするセラミックヒーターの製造方
法。At least a metal powder, a low expansion glass frit with a thermal expansion coefficient of 4 x 10^-^7/°C or less, on a ceramic substrate with a low expansion coefficient of 3 x 10^-^7/°C or less,
A method for manufacturing a ceramic heater, characterized in that a resistance heating element layer is provided by applying a resistance paste made by mixing a binder and a solvent and sintering it by firing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62137937A JPS63301482A (en) | 1987-06-01 | 1987-06-01 | Manufacture of ceramic heater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62137937A JPS63301482A (en) | 1987-06-01 | 1987-06-01 | Manufacture of ceramic heater |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63301482A true JPS63301482A (en) | 1988-12-08 |
Family
ID=15210188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62137937A Pending JPS63301482A (en) | 1987-06-01 | 1987-06-01 | Manufacture of ceramic heater |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63301482A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02126390U (en) * | 1989-03-29 | 1990-10-18 | ||
| JPH02150797U (en) * | 1989-05-25 | 1990-12-27 | ||
| KR100710679B1 (en) | 2005-10-25 | 2007-04-23 | 아프로시스템 주식회사 | Expansion method of heater board |
-
1987
- 1987-06-01 JP JP62137937A patent/JPS63301482A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02126390U (en) * | 1989-03-29 | 1990-10-18 | ||
| JPH02150797U (en) * | 1989-05-25 | 1990-12-27 | ||
| KR100710679B1 (en) | 2005-10-25 | 2007-04-23 | 아프로시스템 주식회사 | Expansion method of heater board |
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