JPS63192293A - Method of forming conductive film on insulating substrate - Google Patents
Method of forming conductive film on insulating substrateInfo
- Publication number
- JPS63192293A JPS63192293A JP2537187A JP2537187A JPS63192293A JP S63192293 A JPS63192293 A JP S63192293A JP 2537187 A JP2537187 A JP 2537187A JP 2537187 A JP2537187 A JP 2537187A JP S63192293 A JPS63192293 A JP S63192293A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- conductive film
- heating
- insulating substrate
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims description 23
- 238000000034 method Methods 0.000 title claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 16
- 230000006698 induction Effects 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims 2
- 239000002904 solvent Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical group [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 3
- 238000009429 electrical wiring Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000003763 carbonization Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
「発明の利用分野」
この発明は、低コスト化を図るために、プリント基板等
の電気配線用導体膜、またサーマルヘッド、イメージセ
ンサ、液晶表示装置において電気配線用導体膜を作成す
ることを提案するにある。DETAILED DESCRIPTION OF THE INVENTION Field of Application of the Invention The present invention is directed to the use of conductive films for electrical wiring such as printed circuit boards, thermal heads, image sensors, and liquid crystal display devices in order to reduce costs. It is proposed to create a membrane.
「従来の技術」
従来のプリント基板は、ガラスエポキシ等の絶縁基板上
にfI箔を貼りつけ、公知であるフォトリソグラフィ一
工程を用いて、ウェットエツチング法により電気配線を
形成する手法がとられていた。"Conventional technology" Conventional printed circuit boards are produced by pasting fI foil onto an insulating substrate such as glass epoxy, and forming electrical wiring by wet etching using a single step of well-known photolithography. Ta.
またサーマルヘッド等の装置の場合においては絶縁体で
あるセラミック基板上にAu等を代表とする導電金属を
基板表面全体にイオンブレーティング法等により蒸着し
、同様にフォトリソグラフィー法を用いてウェットエツ
チング法により電気配線を形成する手法が採られていた
。In the case of a device such as a thermal head, a conductive metal such as Au is deposited on the entire surface of an insulating ceramic substrate by ion blasting, etc., and wet etching is performed similarly using photolithography. The method used was to form electrical wiring using a method.
「発明が解決しようとする問題点」
コスト低減のために、スクリーン印刷等の印刷法により
配線パターンを直接導電インクを用いて形成する方法も
考えられるが、密着性の向上と導電率の向上のためには
その導電インクを高温で焼成する必要があった。そのた
めに、ガラス基板、ガラスエポキシ基板等導電インクを
焼結ために必要な高温では歪むもの、炭素化するような
低コストな基板がつかえないという問題点があった。``Problems to be solved by the invention'' In order to reduce costs, it is possible to form wiring patterns directly using conductive ink using printing methods such as screen printing, but it is difficult to improve adhesion and conductivity. In order to do this, it was necessary to bake the conductive ink at a high temperature. For this reason, there is a problem in that low-cost substrates such as glass substrates and glass epoxy substrates that are distorted or carbonized at the high temperatures necessary for sintering the conductive ink cannot be used.
「問題を解決するための手段」
導電性インクを用いて導電膜を形成する方法において、
加熱が必要なのは焼成すべき金属部分だけであり、絶縁
基板ではない。"Means for solving the problem" In the method of forming a conductive film using conductive ink,
Only the metal part to be fired requires heating, not the insulating substrate.
そこで本発明では渦電流損によるジュール熱を利用して
導体層のみを加熱することで焼成することを特徴とする
。しかし、導体部のみを加熱したことで、基板部との熱
による膨張差により基板に熱歪みが生じるという新たな
問題が発生するので本発明ではさらに、赤外ヒータによ
る基板加熱を加えて基板単体の物性として熱歪または炭
化を発生させる温度よりも50℃程低い温度まで加熱を
行った上で、高周波誘導加熱により導体層のみをさらに
加熱し導体層の焼成を行った。Therefore, the present invention is characterized in that firing is performed by heating only the conductor layer using Joule heat caused by eddy current loss. However, by heating only the conductor part, a new problem arises in that thermal distortion occurs in the board due to the difference in thermal expansion between the conductor part and the board part. After heating to a temperature approximately 50° C. lower than the temperature at which thermal strain or carbonization occurs as a physical property, only the conductor layer was further heated by high-frequency induction heating to sinter the conductor layer.
以下実施例に従い、説明を行う。An explanation will be given below based on examples.
「実施例」 第1図に本発明で使用する焼成装置を示す。"Example" FIG. 1 shows a firing apparatus used in the present invention.
本実施例に使用した絶縁基板(1)は歪点が511℃で
あるソーダガラスである。使用する導電性インク(2)
は0.1 μmを平均粒径とする銀粉を55重量%、低
融点(480℃)のガラスフリフトを30重量%、アマ
ニ油を15重景%の組成比となるインクを使用して導電
膜をソーダガラス基板上にオフセット印刷法により、巾
50μm厚さ10μmの配線パターンを印刷した。その
後、第1図に示した焼成装置により赤外線ランプ(3)
による基板加熱の加熱温度を460℃さらに電極部(4
)により高周波誘導加熱法により導体部のみは焼成に必
要な550℃に加熱を行った。The insulating substrate (1) used in this example is soda glass having a strain point of 511°C. Conductive ink used (2)
is conductive using an ink with a composition ratio of 55% by weight of silver powder with an average particle size of 0.1 μm, 30% by weight of glass flift with a low melting point (480°C), and 15% by weight of linseed oil. A wiring pattern having a width of 50 μm and a thickness of 10 μm was printed on a soda glass substrate using an offset printing method. After that, the infrared lamp (3) is heated using the baking device shown in Figure 1.
The heating temperature of the substrate heating was increased to 460℃, and the electrode part (4
), only the conductor portion was heated to 550° C., which is necessary for firing, using a high-frequency induction heating method.
その場合に印加する高周波の周波数は20011 z以
上が適当であり、本実施例では500Hzを使用した。In this case, the appropriate frequency of the high frequency to be applied is 20011 Hz or more, and in this example, 500 Hz was used.
この高周波誘導加熱法を用いることにより、ソーダガラ
ス基板自身の温度は、それほど上昇せず導電部のみ焼結
に必要な550℃まで加熱できた。By using this high frequency induction heating method, the temperature of the soda glass substrate itself did not rise much, and only the conductive portion could be heated to 550° C., which is necessary for sintering.
「効果」
赤外線加熱と高周波誘導加熱を併用することにより、基
板の熱歪及び炭化を避けることができ、絶縁表面を有す
る基板上に導電膜を形成する際の低コスト化を実現する
ことができた。"Effect" By using infrared heating and high-frequency induction heating together, thermal distortion and carbonization of the substrate can be avoided, and costs can be reduced when forming a conductive film on a substrate with an insulating surface. Ta.
さらに、導電膜と基板の間の熱歪による導電膜の密着不
良も解決することができたものである。Furthermore, poor adhesion of the conductive film due to thermal strain between the conductive film and the substrate can be solved.
第1図は本発明で使用した焼結装置の概略図を示す。 FIG. 1 shows a schematic diagram of the sintering apparatus used in the present invention.
Claims (1)
種類以上の導電金属粉をその合計値の組成比が20重量
%以上を有する溶剤を用いて導電膜を形成する方法にお
いて、基板上に前記金属粉を有する溶剤を塗布した後に
基板加熱を行い、この基板加熱工程と同時または後に前
記塗布物に対し高周波誘導加熱を行うことを特徴とする
絶縁基板上の導電膜の作成方法。 2、特許請求の範囲第1項において、基板加熱の際の加
熱温度は基板の熱歪み点以下であることを特徴とする絶
縁基板上の導電膜の作成方法。[Claims] 1. On an insulating substrate or a substrate having an insulating surface, 1.
In a method of forming a conductive film using a solvent having a total composition ratio of 20% by weight or more of conductive metal powder of more than 1 type, heating the substrate after applying the solvent having the metal powder on the substrate; A method for forming a conductive film on an insulating substrate, characterized in that high-frequency induction heating is performed on the coated material at the same time as or after the substrate heating step. 2. A method for forming a conductive film on an insulating substrate according to claim 1, wherein the heating temperature during substrate heating is below the thermal strain point of the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2537187A JPS63192293A (en) | 1987-02-04 | 1987-02-04 | Method of forming conductive film on insulating substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2537187A JPS63192293A (en) | 1987-02-04 | 1987-02-04 | Method of forming conductive film on insulating substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63192293A true JPS63192293A (en) | 1988-08-09 |
Family
ID=12163975
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2537187A Pending JPS63192293A (en) | 1987-02-04 | 1987-02-04 | Method of forming conductive film on insulating substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63192293A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007027487A (en) * | 2005-07-19 | 2007-02-01 | Dowa Holdings Co Ltd | Method for forming conductive film or wiring |
JP2009004482A (en) * | 2007-06-20 | 2009-01-08 | Olympus Corp | Method for manufacturing wiring board |
JP2013522026A (en) * | 2010-03-19 | 2013-06-13 | オウェンス ブロックウェイ グラス コンテナー インコーポレイテッド | Hardened coating on glass container |
-
1987
- 1987-02-04 JP JP2537187A patent/JPS63192293A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007027487A (en) * | 2005-07-19 | 2007-02-01 | Dowa Holdings Co Ltd | Method for forming conductive film or wiring |
JP2009004482A (en) * | 2007-06-20 | 2009-01-08 | Olympus Corp | Method for manufacturing wiring board |
JP2013522026A (en) * | 2010-03-19 | 2013-06-13 | オウェンス ブロックウェイ グラス コンテナー インコーポレイテッド | Hardened coating on glass container |
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