JPS6375038U - - Google Patents
Info
- Publication number
- JPS6375038U JPS6375038U JP1986170504U JP17050486U JPS6375038U JP S6375038 U JPS6375038 U JP S6375038U JP 1986170504 U JP1986170504 U JP 1986170504U JP 17050486 U JP17050486 U JP 17050486U JP S6375038 U JPS6375038 U JP S6375038U
- Authority
- JP
- Japan
- Prior art keywords
- guide
- upper mold
- lower mold
- resin sealing
- sealing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986170504U JPS6375038U (enExample) | 1986-11-06 | 1986-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986170504U JPS6375038U (enExample) | 1986-11-06 | 1986-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6375038U true JPS6375038U (enExample) | 1988-05-19 |
Family
ID=31105296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986170504U Pending JPS6375038U (enExample) | 1986-11-06 | 1986-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6375038U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01297229A (ja) * | 1988-05-25 | 1989-11-30 | T & K Internatl Kenkyusho:Kk | 樹脂封止成形用金型装置 |
-
1986
- 1986-11-06 JP JP1986170504U patent/JPS6375038U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01297229A (ja) * | 1988-05-25 | 1989-11-30 | T & K Internatl Kenkyusho:Kk | 樹脂封止成形用金型装置 |