JPS6372493A - Laser beam machine - Google Patents
Laser beam machineInfo
- Publication number
- JPS6372493A JPS6372493A JP61217744A JP21774486A JPS6372493A JP S6372493 A JPS6372493 A JP S6372493A JP 61217744 A JP61217744 A JP 61217744A JP 21774486 A JP21774486 A JP 21774486A JP S6372493 A JPS6372493 A JP S6372493A
- Authority
- JP
- Japan
- Prior art keywords
- aperture
- workpiece
- laser
- laser beam
- condenser lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000003754 machining Methods 0.000 abstract description 3
- 230000006978 adaptation Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
[発明の目的]
(産業上の利用分野)
この発明はレーザ加工装置に係り、特にその照射エネル
ギ及びスポット径の制御に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a laser processing apparatus, and particularly to control of irradiation energy and spot diameter thereof.
(従来の技術)
従来、レーザ加工装置は第3図に示すように構成され、
レーザ発振器1から出たレーザ光2は折返しミラー3に
よって集光レンズ4側に導かれる。そして、途中の光路
に設置された一定の孔径を有するアパーチャ13により
、レーザ光2の一部は反射光14となり、アパーチャ1
3の孔の中を通過したレーザ光15は集光レンズ4によ
って集光され、被加工物17へ照射されて加工が行なわ
れる。(Prior Art) Conventionally, a laser processing device is configured as shown in FIG.
A laser beam 2 emitted from a laser oscillator 1 is guided to a condensing lens 4 side by a reflection mirror 3. Then, a part of the laser beam 2 becomes reflected light 14 due to an aperture 13 having a constant hole diameter installed in the optical path midway, and the aperture 1
The laser beam 15 that has passed through the hole 3 is condensed by the condenser lens 4, and is irradiated onto the workpiece 17 to perform machining.
尚、この場合のアパーチャ13の孔径は、被加工物17
の加工条件、即ち、照射エネルギ及びスポット径により
決定される。Note that the hole diameter of the aperture 13 in this case is the same as that of the workpiece 17.
It is determined by the processing conditions, that is, the irradiation energy and spot diameter.
(発明が解決しようとする問題点)
上記のような従来のレーザ加工装置では、異なる加工条
件の2つの被加工物のレーザ加工を行なう場合には、加
工条件に応じて異なる孔径のアパーチャを設置する必要
がある。又、連続的に加工条件を変化させることが困難
であるため、ち密なレーザ加工が出来ない。(Problems to be Solved by the Invention) In the conventional laser processing apparatus as described above, when performing laser processing on two workpieces with different processing conditions, apertures with different hole diameters are installed depending on the processing conditions. There is a need to. Furthermore, since it is difficult to continuously change the processing conditions, detailed laser processing is not possible.
この発明は、ある一定の孔径を有するアパーチャを上下
に駆動させ、照射エネルギ又はスポット径を連続的に変
化させることによりち密な加工条件にも対応出来、且つ
自動化に適したレーザ加工装置を提供することを目的と
する。The present invention provides a laser processing device that can cope with dense processing conditions by driving an aperture having a certain diameter up and down and continuously changing the irradiation energy or spot diameter, and is suitable for automation. The purpose is to
[発明の構成]
(問題点を解決するための手段)
この発明は、ある一定の孔径を有するアパーチャを集光
レンズと被加工物との間に設け、このアパーチャを例え
ばステッピングモータ等の駆動装置で単に上下方向に駆
動させることにしたレーザ加工装置である。[Structure of the Invention] (Means for Solving the Problems) This invention provides an aperture having a certain diameter between a condensing lens and a workpiece, and the aperture is connected to a driving device such as a stepping motor. This is a laser processing device that is simply driven in the vertical direction.
(作用)
一般に集光レンズによって集光されたレーザ光のビーム
径は、集光レンズからの距離に比例して次第に小さくな
り、焦点位置にて最小となる。(Function) Generally, the beam diameter of the laser beam focused by the condenser lens gradually decreases in proportion to the distance from the condenser lens, and reaches its minimum at the focal position.
そこで、この発明では集光レンズと被加工物の間に設け
たある一定の孔径を有するアパーチャを上下方向に駆動
させているので、連続的に被加工物への照射エネルギあ
るいはスポット径を制御することが可能となる。Therefore, in this invention, an aperture with a certain hole diameter provided between the condenser lens and the workpiece is driven in the vertical direction, so that the irradiation energy or spot diameter on the workpiece can be continuously controlled. becomes possible.
(実施例)
以下、図面を参照して、この発明の一実施例を詳細に説
明する。(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.
この発明のレーザ加工装置は第1図及び第2図に示すよ
うに構成され、従来例(第3図)と同一箇所は同一符号
を付すことにすると、レーザ発振器1の出力側には所定
間隔をおいて折返しミラー3が配設されている。この折
返しミラー3に対向して、集光レンズ4、一定の孔径を
有するアパーチャ5、被加工物へ6が順次所定間隔をお
いて配設されている。The laser processing apparatus of the present invention is configured as shown in FIGS. 1 and 2, and the same parts as in the conventional example (FIG. 3) are given the same reference numerals. A folding mirror 3 is disposed at a distance. A condenser lens 4, an aperture 5 having a constant diameter, and a workpiece 6 are arranged in sequence at predetermined intervals to face the folding mirror 3.
この場合、アパーチャ5は例えばステッピングモータ等
の駆動装置9により上下方向に移動自在になっており、
この発明の特徴となっている。又、被加工物へ〇は自動
位置決め装置8上に載置されているが、この自動位置決
め装置8上にはもう1つの被加工物B7が載置されてお
り、この被加工vIJA6と被加工物B7とは異なる加
工条件を持っている。そして、アパーチャ5を駆動装W
9により上下に駆動し、同一ラインにて被加工物へ6と
被加工物B7のレーザ加工を行なうように構成されてい
る。In this case, the aperture 5 is movable in the vertical direction by a driving device 9 such as a stepping motor, for example.
This is a feature of this invention. Further, the workpiece 〇 is placed on the automatic positioning device 8, but another workpiece B7 is placed on this automatic positioning device 8, and this workpiece vIJA6 and the workpiece B7 are placed on the automatic positioning device 8. It has processing conditions different from object B7. Then, drive the aperture 5 with the W
9 is driven up and down, and laser processing is performed on the workpiece 6 and the workpiece B7 in the same line.
さて、上記のようなこの発明のレーザ加工R[において
、動作時には、レーザ発振器1から出射されたレーザ光
2は折返しミラー3により集光レンズ4側へ導かれ、集
光レンズ4によって集光され、アパーチャ5を通して被
加工物へ6へ照射される。この時、第2図に示すように
集光レンズ4におけるレーザビーム径をD1集光レンズ
4の焦点距離をf、アパーチャ5の孔径をa、集光レン
ズ4の焦点位置から7バーチヤ5までの距離をbとする
と、bくa/D−fとなるような位置にアパーチャ5を
配置しておけば、集光レンズ4によって集光されたレー
ザ光10は、全てアパーチャ5の孔の中を通過し、被加
工物へ〇へ照射される。Now, in the laser processing R[ of the present invention as described above, during operation, the laser beam 2 emitted from the laser oscillator 1 is guided to the condensing lens 4 side by the folding mirror 3, and is condensed by the condensing lens 4. , is irradiated through the aperture 5 to the workpiece 6. At this time, as shown in FIG. 2, the laser beam diameter in the condenser lens 4 is D1, the focal length of the condenser lens 4 is f, the hole diameter of the aperture 5 is a, and the distance from the focal position of the condenser lens 4 to 7 vertices 5 is If the aperture 5 is placed at a position such that b = a/D-f, where b is the distance, all of the laser beam 10 focused by the condensing lens 4 will pass through the hole of the aperture 5. It passes through and is irradiated to the workpiece.
この時の焦点位置における照射エネルギ密度F1は
Fl −4P1 /πd2 [J/m21とな
る。ここで、Plは照射エネルギ[J]、dは焦点位置
におけるスポット径でレーザ光2の広がりθ[rad]
、及び集光レンズの焦点距離f[層]に依存し、
d−fa [虜]
で示される。又、デフォーカス員をfo [si]と
した時のスポット径COOは
do =o * fa /f [x]で示され
、その時の照射エネルギ密度F1’ はFl ’ =4
Px /πda 2
−4P1/π[)2 、 i’2 /f、 2[J/+
s+21となる。The irradiation energy density F1 at the focal position at this time is Fl −4P1 /πd2 [J/m21. Here, Pl is the irradiation energy [J], d is the spot diameter at the focal position, and the spread of the laser beam 2 θ [rad]
, and the focal length f [layer] of the condenser lens, and is expressed as d-fa [layer]. Also, when the defocusing member is fo [si], the spot diameter COO is expressed as do = o * fa / f [x], and the irradiation energy density F1' at that time is Fl' = 4.
Px /πda 2 -4P1/π[)2, i'2 /f, 2[J/+
It becomes s+21.
次に、自動位置決め装置8により、被加工物へ6とは異
なった加工条件を持つ被加工ThB7が加工点へ導かれ
る。同時に、アパーチャ5が駆動装置9により集光レン
ズ4側へ駆動される。この時、b>a/D−fとなるよ
うな位置にアパーチャ5を駆動すると、集光レンズ4に
よって集光されたレーザ光10は、アパーチャ5により
一部は反射光となり、残りはアパーチャ5の孔の中を通
過し、被加工物B7へ照射される。この時の焦点位置に
おける照射エネルギ密度P2は、レーザ光2のエネルギ
分布がマルチモードでほぼ円柱状であるならば
P2−Pl (a−f/b−D)2 [J]とな
る。従って、照射エネルギ密度F2はF2=4P2/π
d2
−4 (a −f/b −D)2Pr /πd2=
4 (a −f/b−D)2F!
[J/履21
となる。Next, the automatic positioning device 8 guides the workpiece ThB7 having different processing conditions from the workpiece 6 to the processing point. At the same time, the aperture 5 is driven toward the condenser lens 4 by the drive device 9. At this time, when the aperture 5 is driven to a position where b>a/D-f, a part of the laser beam 10 focused by the condenser lens 4 becomes reflected light by the aperture 5, and the rest is reflected by the aperture 5. The light passes through the hole and is irradiated onto the workpiece B7. The irradiation energy density P2 at the focal position at this time is P2-Pl (a-f/b-D)2 [J] if the energy distribution of the laser beam 2 is multimode and approximately cylindrical. Therefore, the irradiation energy density F2 is F2=4P2/π
d2 −4 (a −f/b −D)2Pr /πd2=
4 (a-f/b-D)2F! [J/shoe 21.
又、デフォーカス量をfa [sw]とした時のスポ
ット径は
cja ’ = f ロ −a/ b
[s]であり、照射エネルギ密度F2’ は
F2 ’ =4P2 /πdo’ ”
= 4 P/π D 2 ・ f2 /f ロ 2
=Ft’ [J/s+2コ
となる。Also, when the defocus amount is fa [sw], the spot diameter is cja' = f lo -a/b
[s], and the irradiation energy density F2' is F2' = 4P2 / πdo''' = 4 P/π D 2 ・ f2 / f ro 2
=Ft' [J/s+2.
尚、上記実施例によるレーザ加工装置において、集光レ
ンズ4のほぼ焦点位置でレーザ加工を行なう場合には、
焦点位置く加工点)からアパーチャ5までの距mbを連
続的に変化させると、加工点における照射エネルギP2
及び照射エネルギ密度F2はbの2乗に反比例して連続
的に変化し、スポット径dOは変化しない。In the laser processing apparatus according to the above embodiment, when laser processing is performed at approximately the focal point of the condenser lens 4,
By continuously changing the distance mb from the focal point (processing point) to the aperture 5, the irradiation energy P2 at the processing point
The irradiation energy density F2 changes continuously in inverse proportion to the square of b, and the spot diameter dO does not change.
又、デフォーカスしてレーザ加工を行なう場合には、距
離すを連続的に変化させると、照射エネルギP2はbの
2乗に反比例、又、スポット径d、l はbに反比例し
て変化し、照射エネルギ密度F2’ に変化しない。In addition, when performing defocused laser processing, if the distance is continuously changed, the irradiation energy P2 will change in inverse proportion to the square of b, and the spot diameters d and l will change in inverse proportion to b. , the irradiation energy density F2' remains unchanged.
[発明の効果]
この発明によれば、集光レンズ4と被加工物A6(被加
工物87)の間に配設されたアパーチャ5が上下方向に
移動可能に構成されているので、連続的に照射エネルギ
又はスポット径を制御することが出来る。この結果、ち
密な加工条件にも対応出来、且つ異なる加工条件を持つ
2つの被加工物を同一ラインにて加工が出来るので、自
動化に適したレーザ加工装置を提供することが可能とな
る。[Effects of the Invention] According to the present invention, since the aperture 5 disposed between the condenser lens 4 and the workpiece A6 (workpiece 87) is configured to be movable in the vertical direction, continuous The irradiation energy or spot diameter can be controlled. As a result, it is possible to provide a laser processing device suitable for automation because it can handle precise processing conditions and can process two workpieces with different processing conditions on the same line.
第1図はこの発明の一実施例に係るレーザ加工装置を示
す概略構成図、第2図は第1図の要部を拡大して示す概
略構成図、第3図は従来のレーザ加工装置を示す概略構
成図である。
1・・・レーザ発振器、4・・・集光レンズ、5・・・
アパーチャ、6.7・・・被加工物。
出願人代理人 弁理士 鈴江武彦
第3図FIG. 1 is a schematic configuration diagram showing a laser processing device according to an embodiment of the present invention, FIG. 2 is a schematic configuration diagram showing an enlarged main part of FIG. 1, and FIG. 3 is a schematic configuration diagram showing a conventional laser processing device. FIG. 1... Laser oscillator, 4... Condensing lens, 5...
Aperture, 6.7... Workpiece. Applicant's agent Patent attorney Takehiko Suzue Figure 3
Claims (1)
集光し、アパーチャを介して被加工物へ照射し加工を行
なうレーザ加工装置において、上記アパーチャを上下に
移動可能にしたことを特徴とするレーザ加工装置。A laser processing device for processing a workpiece by focusing laser light emitted from a laser oscillator by a condensing lens and irradiating it to a workpiece through an aperture, characterized in that the aperture is movable up and down. Laser processing equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61217744A JPS6372493A (en) | 1986-09-16 | 1986-09-16 | Laser beam machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61217744A JPS6372493A (en) | 1986-09-16 | 1986-09-16 | Laser beam machine |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6372493A true JPS6372493A (en) | 1988-04-02 |
Family
ID=16709071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61217744A Pending JPS6372493A (en) | 1986-09-16 | 1986-09-16 | Laser beam machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6372493A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0634884U (en) * | 1992-09-30 | 1994-05-10 | オリンパス光学工業株式会社 | Laser processing equipment |
JP2009288101A (en) * | 2008-05-29 | 2009-12-10 | Mitsubishi Heavy Ind Ltd | Ultrasonic inspection device, and nondestructive inspection method of nuclear power plant |
US20120097652A1 (en) * | 2010-10-20 | 2012-04-26 | Claude Battheu | Combined machine for punching and laser cutting of flat sheet metal |
JP2013026433A (en) * | 2011-07-21 | 2013-02-04 | Toyota Motor Corp | Laser anneal device |
-
1986
- 1986-09-16 JP JP61217744A patent/JPS6372493A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0634884U (en) * | 1992-09-30 | 1994-05-10 | オリンパス光学工業株式会社 | Laser processing equipment |
JP2009288101A (en) * | 2008-05-29 | 2009-12-10 | Mitsubishi Heavy Ind Ltd | Ultrasonic inspection device, and nondestructive inspection method of nuclear power plant |
US20120097652A1 (en) * | 2010-10-20 | 2012-04-26 | Claude Battheu | Combined machine for punching and laser cutting of flat sheet metal |
US8563894B2 (en) * | 2010-10-20 | 2013-10-22 | Salvagnini Italia S.P.A. | Combined machine for punching and laser cutting of flat sheet metal |
JP2013026433A (en) * | 2011-07-21 | 2013-02-04 | Toyota Motor Corp | Laser anneal device |
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