JPH1058179A - Laser beam machine - Google Patents

Laser beam machine

Info

Publication number
JPH1058179A
JPH1058179A JP8219523A JP21952396A JPH1058179A JP H1058179 A JPH1058179 A JP H1058179A JP 8219523 A JP8219523 A JP 8219523A JP 21952396 A JP21952396 A JP 21952396A JP H1058179 A JPH1058179 A JP H1058179A
Authority
JP
Japan
Prior art keywords
laser beam
spot diameter
optical axis
laser
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP8219523A
Other languages
Japanese (ja)
Inventor
Seiya Takahashi
誠也 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Optical Co Ltd filed Critical Olympus Optical Co Ltd
Priority to JP8219523A priority Critical patent/JPH1058179A/en
Publication of JPH1058179A publication Critical patent/JPH1058179A/en
Withdrawn legal-status Critical Current

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  • Laser Beam Processing (AREA)

Abstract

PROBLEM TO BE SOLVED: To continuously increase/decrease a spot diameter without making the irradiating spot periphery of a laser beam out of focus by aligning the optical axis of an optical system, which emits the laser beam for a work, and the optical axis of introducing means, which introduces a laser beam in the optical system and fixing the introducing means to a moving means movable along the optical axis. SOLUTION: A work 100 is set on a XY table 2 and machined by a laser beam. A spot diameter of laser beam is changed in accordance with a pattern width as a machining position of work travels. By operating a zoom motor 15, the spot diameter is changed with changing the focus of a zoom lens 8 through a gear 16 and a focus gear 14. The work 100 is irradiated with the laser beam from an optical fiber 9, which is reflected with a beam splitter 4 in irradiating cylinder 7, through an object lens 3 in a prescribed spot diameter. The laser beam, after irradiating, is reflected and forms a image on a CCD camera 6 through an image forming lens 5, thus, the image is observed by a monitor 17.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明はレーザ加工装置に
関する。
[0001] The present invention relates to a laser processing apparatus.

【0002】[0002]

【従来の技術】従来技術として特開平4−251686
を説明する。この従来技術は被加工物の加工位置及び加
工範囲の確認及び観察を可能にしたレーザ加工装置であ
る。即ち、被加工物上のレーザ光スポット形状と同じ形
状の可視光を被加工物のレーザ光照射位置に照射する様
に、レーザ光と可視光の光路を共通にし、更に光路中に
任意の開口形状に変えることができる開口部を持つ遮光
板を有し、加工部の大きさに合わせて該開口部の形状を
変えることによって、レーザ光スポットと可視光のスポ
ットの大きさを同時に変えることが出来る構造になって
いる。
2. Description of the Related Art As a prior art, Japanese Patent Laid-Open No. 4-251686
Will be described. This conventional technique is a laser processing apparatus which enables confirmation and observation of a processing position and a processing range of a workpiece. That is, the optical path of the laser light and the visible light are made common so that visible light having the same shape as the laser light spot shape on the workpiece is irradiated to the laser light irradiation position of the workpiece, and an arbitrary aperture is provided in the optical path. It has a light-shielding plate with an opening that can be changed into a shape, and by changing the shape of the opening according to the size of the processed part, the size of the laser light spot and the size of the visible light spot can be changed simultaneously. It has a structure that can be used.

【0003】[0003]

【発明が解決しようとする課題】しかし、従来技術の実
施例によれば、平行光線であるレーザ光と可視光が遮光
板の開口部を通過した後に拡散光線となっている。そし
て収差補正器、ミラー、2つの対物レンズを経て被加工
物の加工部に集光する如く開示してある。
However, according to the embodiment of the prior art, the laser light and the visible light, which are parallel rays, are diffused rays after passing through the opening of the light shielding plate. It is disclosed that the light is condensed on a processed portion of a workpiece through an aberration corrector, a mirror, and two objective lenses.

【0004】しかし、遮光板の開口部を通過した光は開
口径分の平行光線と開口部の縁に干渉して拡散する拡散
光からなり、それぞれの焦点距離が異なるので焦点位置
がずれることになる。従って、被加工物上であたかもそ
れぞれの光線が一点で集光している如く図示されている
が、現実にはボンヤリしたスポットとなり、且つ、光量
が不均一なスポットになってしまうのである。
However, the light that has passed through the opening of the light-shielding plate is made up of parallel rays corresponding to the diameter of the opening and diffused light that interferes with the edges of the opening and diffuses. Become. Therefore, although it is illustrated that each light beam is condensed at one point on the workpiece, in reality, it becomes a spot where the light beam is fuzzy and the light amount becomes uneven.

【0005】この様な状態では加工部が微小であったり
加工部近傍に照射不可の部分があった場合には正確な加
工ができなくなる等の欠点が生じると共に、絞りの役目
をする開口部によりレーザ光の一部がカットされるので
加工エネルギーを一定にするためには開口の大きさに合
わせて出力を変化させねばならず、装置が複雑化すると
いう欠点を有している。
[0005] In such a state, when the processing portion is minute or there is a portion that cannot be irradiated in the vicinity of the processing portion, there arises a drawback that accurate processing cannot be performed and the like. Since a part of the laser beam is cut, the output must be changed in accordance with the size of the aperture in order to keep the processing energy constant, which has a disadvantage that the apparatus becomes complicated.

【0006】また、他の実施例には遮光板を解放して平
行光線のみを対物レンズを介して被加工物の加工部に集
光させる旨開示してあるが、この場合はスポット径が一
定のものしかできないので加工部の面積が一定でない場
合は、対物レンズと被加工物の距離を可変にしてスポッ
ト径を変えるか、スポット径を一定にしたまま2次元的
に走査しなくてはならず、装置全体が複雑になり且つ加
工時間も長くなるという欠点を有している。
Another embodiment discloses that the light-shielding plate is released and only parallel rays are condensed on the processed portion of the workpiece through the objective lens. In this case, the spot diameter is constant. If the area of the processed part is not constant, the spot diameter must be changed by changing the distance between the objective lens and the workpiece, or two-dimensional scanning must be performed with the spot diameter kept constant. However, it has the drawback that the whole apparatus becomes complicated and the processing time becomes long.

【0007】本発明は、前記不具合に鑑みてなされたも
のであり、簡単な構成でレーザ光効率的に利用できるレ
ーザ加工装置を提供することを目的とする。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has as its object to provide a laser processing apparatus which can use laser light efficiently with a simple configuration.

【0008】[0008]

【課題を解決するための手段】本発明におけるレーザ加
工装置は、レーザ発振器と、該レーザ発振器から出射さ
れるレーザ光を被加工物に向けて出射する光学系と、前
記レーザ光を前記光学系に導入する導入手段と、加工状
態を観察する観察手段を有し、前記導入手段の光軸は前
記光学系の光軸と一致していると共に、前記導入手段は
光軸に沿って移動可能な移動手段に固定されていること
を特徴とする。
According to the present invention, there is provided a laser processing apparatus, comprising: a laser oscillator; an optical system for emitting laser light emitted from the laser oscillator toward a workpiece; And an observation means for observing a processing state, wherein an optical axis of the introduction means coincides with an optical axis of the optical system, and the introduction means is movable along the optical axis. It is characterized by being fixed to the moving means.

【0009】(作用)上記構成によれば、導入手段を光
軸に沿って光学系に対して離接することによって被加工
物上のスポット径をピントが合った状態で任意に且つ連
続的に拡大縮小することができるので、レーザ発振器か
ら出射されたレーザ光の損失がなく、且つ光量が均一な
スポットが得られるのである。
(Operation) According to the above configuration, the spot diameter on the workpiece is arbitrarily and continuously enlarged in a focused state by moving the introducing means toward and away from the optical system along the optical axis. Since it is possible to reduce the size, a spot having a uniform light amount without loss of the laser light emitted from the laser oscillator can be obtained.

【0010】[0010]

【発明の実施の形態】以下、本発明の実施の形態を図面
とともに説明する。 (実施の形態1)図1及び図2を用いて実施の形態1を
説明する。図1は部分的に断面で示した実施の形態1の
全体図である。
Embodiments of the present invention will be described below with reference to the drawings. (Embodiment 1) Embodiment 1 will be described with reference to FIGS. FIG. 1 is an overall view of the first embodiment partially shown in cross section.

【0011】図2は図1中の被加工物の部分拡大図であ
る。図1において、装置本体1には被加工物100を載
置しXY方向に移動自在なXYテーブル2が配設されて
いる。また、被加工物100にレーザ光を照射する対物
レンズ3とビームスプリッター4からなる光学系と、加
工状態を観察するための結像レンズ5及びCCDカメラ
6からなる観察手段を有する照射筒7が被加工物100
に対向して配設してある。
FIG. 2 is a partially enlarged view of the workpiece shown in FIG. In FIG. 1, an XY table 2 on which a workpiece 100 is placed and which is movable in the XY directions is provided in an apparatus main body 1. Further, an irradiation system 7 having an optical system including an objective lens 3 and a beam splitter 4 for irradiating the workpiece 100 with laser light, and an observation unit including an imaging lens 5 and a CCD camera 6 for observing a processing state is provided. Workpiece 100
It is arranged facing.

【0012】装置本体1にはビームスプリッター4にレ
ーザ光を導入する位置に導入手段が配設してある。導入
手段はズームレンズ8と、ズームレンズ8の光軸に同軸
的にレーザ光を出射する光ファイバー9からなり、ズー
ムレンズ8は焦点距離を移動させる移動手段Aとして焦
点ギヤ14を有し、装置本体1に固定されているズーム
モータ15のギヤ16と噛み合っている。
The apparatus main body 1 is provided with an introduction means at a position where laser light is introduced into the beam splitter 4. The introduction means comprises a zoom lens 8 and an optical fiber 9 for emitting laser light coaxially with the optical axis of the zoom lens 8. The zoom lens 8 has a focus gear 14 as a moving means A for moving the focal length. 1 is engaged with the gear 16 of the zoom motor 15 which is fixed at 1.

【0013】光ファイバー9はズームレンズ8の光軸に
沿って移動自在な移動手段Bに固定されている。この移
動手段Bは、光ファイバー9を固定し光軸に沿って移動
する移動台10と、移動台10をガイドするベース11
と、ベース11に固定され移動台10に設けられたメネ
ジに螺合する回転軸12を有するモータ13から構成さ
れる。
The optical fiber 9 is fixed to a moving means B movable along the optical axis of the zoom lens 8. The moving means B includes a moving table 10 that fixes the optical fiber 9 and moves along the optical axis, and a base 11 that guides the moving table 10.
And a motor 13 having a rotating shaft 12 fixed to the base 11 and screwed into a female screw provided on the movable base 10.

【0014】光ファイバー9の他端は装置本体内の図示
されていないレーザ発振器に接続されている。またモニ
ター17は図示せぬ撮像信号処理装置を介してCCDカ
メラ6の信号を画像として観察するために設置してあ
る。XYテーブル2、モータ13、ズームモータ15の
作動およびレーザ発振器のレーザ光出射タイミングは装
置本体1内の図示せぬ制御装置にて演算され制御され
る。
The other end of the optical fiber 9 is connected to a laser oscillator (not shown) in the apparatus main body. The monitor 17 is provided for observing a signal of the CCD camera 6 as an image via an image signal processing device (not shown). The operation of the XY table 2, the motor 13, the zoom motor 15, and the laser beam emission timing of the laser oscillator are calculated and controlled by a control device (not shown) in the apparatus main body 1.

【0015】次に本実施の形態を用いたレーザ加工を説
明する。図2は被加工物100(本実施の形態では電子
回路基板)の一部と、予備半田されている回路パターン
101と、回路パターン101に半田固定するリード線
102の一部を示す図である。パターン101は図2に
おいて右方向に向かって徐々にパターン巾が拡大してい
く形状を示してある。
Next, laser processing using this embodiment will be described. FIG. 2 is a diagram showing a part of a workpiece 100 (an electronic circuit board in the present embodiment), a circuit pattern 101 that is pre-soldered, and a part of a lead wire 102 that is fixed to the circuit pattern 101 by soldering. . The pattern 101 has a shape in which the pattern width gradually increases toward the right in FIG.

【0016】また、破線の円103及び破線の円104
は、被加工物100を矢印A方向に移動させた時にパタ
ーン巾の変化に合わせて変えたレーザ光のスポット径の
状態を示す。装置本体1内の制御装置には予め被加工物
100の回路パターン加工条件情報をインプットしてお
く。
A broken-line circle 103 and a broken-line circle 104
Indicates the state of the spot diameter of the laser beam changed according to the change in the pattern width when the workpiece 100 is moved in the direction of arrow A. Circuit pattern processing condition information of the workpiece 100 is input to a control device in the apparatus main body 1 in advance.

【0017】先ず被加工物100をXYテーブル2にセ
ットし、図示せぬ加工スタートスイッチを入れる。予め
インプットされた加工条件情報に基づきXYテーブル2
が移動し、レーザ光照射位置例えば図2の円103の位
置に来た時、円103の破線で示すスポット径に照射
し、続いて被加工物100が矢印A方向に移動するのに
伴い例えば円104の破線で示すスポット径の様にパタ
ーン巾に合わせてスポット径を変えていく。
First, the workpiece 100 is set on the XY table 2, and a processing start switch (not shown) is turned on. XY table 2 based on processing condition information input in advance
Moves to the laser beam irradiation position, for example, the position of the circle 103 in FIG. 2, and irradiates the spot diameter indicated by the broken line of the circle 103. Then, as the workpiece 100 moves in the arrow A direction, for example, The spot diameter is changed according to the pattern width like the spot diameter indicated by the broken line of the circle 104.

【0018】この様にスポット径を拡大する場合は、ズ
ームモータ15を作動しギヤ16と焦点ギヤ14を介し
てズームレンズ8の焦点距離を変えることによりスポッ
ト径を拡大し、かつ、モータ13を駆動して移動台10
を介して光ファイバー9のレーザ光出射端をズームレン
ズ8に近づけることにより拡大したスポット径のピント
を合わせる。
When the spot diameter is increased in this manner, the zoom motor 15 is operated to change the focal length of the zoom lens 8 via the gear 16 and the focusing gear 14, thereby increasing the spot diameter. Drive to move table 10
By bringing the laser light emitting end of the optical fiber 9 closer to the zoom lens 8 through the lens, the enlarged spot diameter is focused.

【0019】この一連の動作を装置本体1内の制御装置
でパターン101の巾の変化に合わせて連続的に制御す
るものである。また、スポット径を縮小する場合は、ズ
ームレンズ8でスポット径を縮小し、光ファイバー9の
レーザ光出射端をズームレンズ8から遠ざけることによ
り縮小したスポット径のピントをあわせる。
This series of operations is continuously controlled by a control device in the apparatus main body 1 in accordance with a change in the width of the pattern 101. When the spot diameter is reduced, the spot diameter is reduced by the zoom lens 8 and the laser beam emitting end of the optical fiber 9 is moved away from the zoom lens 8 so that the reduced spot diameter is focused.

【0020】尚、光ファイバー9のレーザ光出射端から
出射されたレーザ光は、照射筒7内のビームスプリッタ
ー4にて被加工物100方向に反射し、対物レンズ3を
介して被加工物100を所定のスポット径で照射した
後、反射し、ビームスプリッタ4を透過して結像レンズ
5を介してCCDカメラ6面に像を結ぶ。CCDカメラ
6からの信号は装置本体1内に設置されている撮像信号
処理装置によって処理され、モニター17で画像として
観察が可能になる。
The laser beam emitted from the laser beam emitting end of the optical fiber 9 is reflected by the beam splitter 4 in the irradiation tube 7 in the direction of the workpiece 100 and passes through the objective lens 3 so that the workpiece 100 is reflected. After irradiation with a predetermined spot diameter, the light is reflected, transmitted through the beam splitter 4, and forms an image on the surface of the CCD camera 6 via the imaging lens 5. Signals from the CCD camera 6 are processed by an imaging signal processing device installed in the apparatus main body 1 and can be observed as an image on the monitor 17.

【0021】[0021]

【発明の効果】以上述べたようにこの発明は、レーザ光
を照射筒に導入する導入手段を移動可能にし、且つ導入
手段の移動を制御する制御装置を有するので、被加工物
の加工対象部の大きさが一定形状でなくても、レーザ光
の照射スポット周縁がボケルことなくスポット径を連続
的に拡大縮小が可能となり、必要な部分のみを正確に照
射することができ、レーザ光を損失することなくスポッ
ト径を縮小することができるので、効率的な利用ができ
るものである。
As described above, the present invention has a control device for making the introduction means for introducing the laser beam into the irradiation tube movable and for controlling the movement of the introduction means. Even if the size of the laser beam is not constant, the spot diameter can be continuously enlarged and reduced without blurring the periphery of the irradiation spot of the laser beam. Since the spot diameter can be reduced without performing, efficient use is possible.

【図面の簡単な説明】[Brief description of the drawings]

【図1】発明の実施の形態におけるレーザ加工装置の全
体図である。
FIG. 1 is an overall view of a laser processing apparatus according to an embodiment of the present invention.

【図2】図1中の被加工物の部分拡大図である。FIG. 2 is a partially enlarged view of a workpiece in FIG. 1;

【符号の説明】[Explanation of symbols]

1 装置本体 3 対物レンズ 4 ビームスピリッタ 5 結像レンズ 6 CCDカメラ 7 照射筒 8 ズームレンズ 9 光ファイバ 10 移動台 12 回転軸 13 モータ 15 ズームモータ DESCRIPTION OF SYMBOLS 1 Apparatus main body 3 Objective lens 4 Beam splitter 5 Imaging lens 6 CCD camera 7 Irradiation cylinder 8 Zoom lens 9 Optical fiber 10 Moving stand 12 Rotation axis 13 Motor 15 Zoom motor

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】レーザ発振器と、該レーザ発振器から出射
されるレーザ光を導入後、被加工物に向けて出射する光
学系と、前記レーザ光を前記光学系に導入する導入手段
と、加工状態を観察する観察手段を有し、前記導入手段
の光軸は前記光学系の光軸と一致していると共に、前記
導入手段は光軸に沿って移動可能な移動手段に固定され
ていることを特徴とするレーザ加工装置。
1. A laser oscillator, an optical system for introducing a laser beam emitted from the laser oscillator and emitting the laser beam toward a workpiece, an introduction unit for introducing the laser beam into the optical system, and a processing state. Having an observation means for observing the optical system, wherein the optical axis of the introduction means coincides with the optical axis of the optical system, and the introduction means is fixed to a moving means movable along the optical axis. Characteristic laser processing equipment.
JP8219523A 1996-08-21 1996-08-21 Laser beam machine Withdrawn JPH1058179A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8219523A JPH1058179A (en) 1996-08-21 1996-08-21 Laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8219523A JPH1058179A (en) 1996-08-21 1996-08-21 Laser beam machine

Publications (1)

Publication Number Publication Date
JPH1058179A true JPH1058179A (en) 1998-03-03

Family

ID=16736821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8219523A Withdrawn JPH1058179A (en) 1996-08-21 1996-08-21 Laser beam machine

Country Status (1)

Country Link
JP (1) JPH1058179A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003282674A (en) * 2002-03-26 2003-10-03 Dainippon Screen Mfg Co Ltd Positioning device for substrate used for laser working
KR100597948B1 (en) 2005-06-03 2006-07-07 주식회사 이오테크닉스 Apparatus for cutting electrides using laser and cutting method using the same
KR100704225B1 (en) 2005-09-23 2007-04-06 한국기계연구원 Apparatus for processing using laser-beam
JP2008149339A (en) * 2006-12-15 2008-07-03 Sumitomo Heavy Ind Ltd Laser beam machining apparatus and method
JP2008296256A (en) * 2007-05-31 2008-12-11 Sunx Ltd Laser beam machining apparatus
US7696452B2 (en) * 2003-09-24 2010-04-13 Kuka Systems Gmbh Process for the laser beam machining, especially laser beam welding, of components
US8030593B2 (en) * 2006-03-23 2011-10-04 Nissan Motor Co., Ltd. Laser welding apparatus and method utilizing replaceable beam guide and calibration system
JP2014042916A (en) * 2012-08-24 2014-03-13 Mitsuboshi Diamond Industrial Co Ltd Laser processing apparatus

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003282674A (en) * 2002-03-26 2003-10-03 Dainippon Screen Mfg Co Ltd Positioning device for substrate used for laser working
US7696452B2 (en) * 2003-09-24 2010-04-13 Kuka Systems Gmbh Process for the laser beam machining, especially laser beam welding, of components
KR100597948B1 (en) 2005-06-03 2006-07-07 주식회사 이오테크닉스 Apparatus for cutting electrides using laser and cutting method using the same
KR100704225B1 (en) 2005-09-23 2007-04-06 한국기계연구원 Apparatus for processing using laser-beam
US8030593B2 (en) * 2006-03-23 2011-10-04 Nissan Motor Co., Ltd. Laser welding apparatus and method utilizing replaceable beam guide and calibration system
JP2008149339A (en) * 2006-12-15 2008-07-03 Sumitomo Heavy Ind Ltd Laser beam machining apparatus and method
JP2008296256A (en) * 2007-05-31 2008-12-11 Sunx Ltd Laser beam machining apparatus
JP2014042916A (en) * 2012-08-24 2014-03-13 Mitsuboshi Diamond Industrial Co Ltd Laser processing apparatus

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