JPS6370412A - Manufacture of laminated paper-less electrolytic capacitor - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a method of manufacturing a vaporless electrolytic capacitor.

<Conventional technology> In recent years, there have been remarkable advances in technology in electrolytic capacitors. A capacitor element formed by winding a spacer made of kraft paper or Manila paper between a pair of anode and cathode foils is impregnated with a driving electrolyte, and then stored in a case and the opening of the case is closed. By eliminating the spacer in the structure sealed with a sealing body and changing the driving electrolyte to an organic semiconductor made of TCNQ complex, we not only improved various characteristics but also aimed at miniaturization and ease of manufacturing work. is in a situation where further progress is being made.

Therefore, the applicant has previously filed various patent applications, including Japanese Patent Application No. 78649/1983, for the purpose of responding to the above-mentioned orientation. The basic structure of the electrolytic capacitor as the prior art filed by the applicant has a laminated structure, and as shown in FIG. 4, a valve metal film 12 such as aluminum is formed on one surface of a plastic film 11. An anodic oxide film 13 is formed on the surface of the metal film 12, and various TCNQ complexes are vacuum-deposited on the post-oxidation film 13 to form a semiconductor film 14, and then a plurality of multi-film layers 15 are formed in a required number of 8i with the same polarity. The external terminals 17 are attached to the electrode lead-out portions 16 formed on both end faces, and then a resin coating is applied to the exterior (not shown).
was formed.

However, the manufacturing method of the electrolytic capacitor having the above structure takes workability into consideration, and naturally does not use the method of laminating a single multilayer film, but instead uses a multilayer film fabrication method in which a plurality of eight films are formed on a relatively large plastic film. A method is employed in which a required number of bodies are stacked to form a laminate, and the laminate is cut into a single laminate. Therefore, there is a need for a means to integrally fix multiple laminated double-layered footwear, and the means for that purpose is to print and apply epoxy resin on one side of the double-layered footwear, overlap the double-layered footwear, and apply pressure. The epoxy resin is heated in this state to harden it. In FIG. 4, 18 is a cathode electrode film formed on the organic semiconductor film 14, and 19 is an epoxy resin used as an adhesive medium between the multiple R9 layers 15.

However, with the above method, the epoxy resin in a liquid state is brought into contact with the plastic film surface and overlapped, so it is easy to slip and the pressure is not equalized, resulting in large tan δ variations in the product state, and it takes a long time to cure the epoxy resin. There is a problem in that the leakage current characteristics are impaired as a result of heating for a long time.

In addition, in products that require several tens of layers, they tend to slip when stacked, resulting in large misalignment of the layers, and when cut, a different pole part is exposed at the end where the electrode lead part is formed, resulting in a fatal short circuit. However, it has been necessary to consider a method for obtaining this type of laminated vapor-less electrolytic capacitor in an efficient and easy-to-work manner.

(Problems to be Solved by the Invention) By using the electrolytic capacitor structure as described above, it is possible to use a driving capacitor element in which a pair of anode and cathode foil spacer papers, which are conventionally formed into films, are alternately laminated and wound. Compared to electrolytic capacitors impregnated with an electrolytic solution, it is effective in reducing the size and improving characteristics, but in order to make work easier and obtain reliable characteristics, it is necessary to form multiple layers and There were difficulties in laminating the layers, and there were problems that needed to be resolved in terms of practical use.

The present invention has been made in view of the above points, and provides a method for manufacturing a multilayer vapor-less electrolytic capacitor that can facilitate workability and eliminate factors that inhibit various characteristics by improving the matrix structure that constitutes the multilayer film. The purpose is to provide

[Structure of the Invention] (Means for Solving the Problems) The method for manufacturing a laminated vaporless electrolytic capacitor of the present invention includes forming a plurality of valve-acting metal films on one surface of an ionomer resin body, and forming the metal films with positive 4riI. oxidize to form an anodic oxide film, form a zero semiconductor film on the oxide film, form a cathode electrode film on the semiconductor film, and laminate a plurality of multi-film footwear obtained by stacking and heat-pressing to form a laminate. This is characterized in that electrode lead-out portions are formed on both end faces of the 8i-layer element body that has been formed and the subsequent laminated body has been cut.

(Function) According to the manufacturing method of the multilayer paperless electrolytic capacitor described above, the base body forming the valve action metal membrane constituting the double membrane shoe body is an ionomer resin body having heat-fusible properties, which is a premise of the present invention. It is not necessary to print and apply a special epoxy resin for lamination as in the previous invention, and it is possible to integrate the lamination of multi-layer footwear through the ionomer resin body by heating for a short time. are not exposed to heat for long periods of time. Also, unlike the lamination method using liquid epoxy resin as in the prior invention, the ionomer resin body that becomes the laminated surface is solid, and the surface that becomes the contact surface is the cathode electrode film, so it is not easy to separate. It is possible to integrate the V4 layer under relatively uniform pressure with no distortion or displacement.

(Actual drop example) An embodiment of the present invention will be described in detail below.

That is, as shown in FIG. 2, high-purity aluminum 1 cum metal is vapor-deposited or laminated on one surface of an ionomer resin body 1 of an appropriate size to form a plurality of valve metal films 2, and then the metal films 2 are chemically formed. An anodic oxide film 3 is formed, and on the surface of the post-oxidized film 3, for example, 2,2'-bipyridinium (TCNQ), 4-hydroxine-N-penzylanilinium (TCNQ) is formed.
2.4-Amino-2,3,5゜6-thitramethylanilinium (TCNQ) 2, lysinium (TCNQ)
, 4-cyano-N-methyl-pyridinium (TCNQ)
, N-ethylquinolinium (TCNQ)2, N-(
A TCNQ complex made of 2-phenethyl)quinolinium (TCNQ) 2 or the like is vacuum deposited to form an organic semiconductor film 4. Next, a cathode electrode film 5 is formed on the surface of the organic semiconductor film 4 using a metal such as silver or copper by means such as screen printing, vapor deposition, or sputtering to obtain a composite film body 6. As shown in FIG. 3, the composite membrane body 6 is laminated in a required number of layers by overlapping one part of the valve metal membrane, and heated at a temperature of 12 degrees from above and below.
Heat and pressure bonding is carried out at 0 to 180[deg.] C. for 1 hour and 10 to 60 seconds to obtain a laminate 7 in which the ionomer resin body 1 is integrated by thermal fusion. Then, the laminated body 7 is cut along the dotted line and as shown in FIG. Apply and dry the paint to form the N-pole lead-out part 9, attach the external terminal 10 to the electrode lead-out part 9, and store it in a case or cover it with resin or the like to cover it (not shown). It is used to form a finished product.

According to the manufacturing method of the multilayer paperless electrolytic capacitor configured as described above, what is the process? ! Since the base material for forming the valve action metal R membrane 2 that constitutes the membrane membrane layer body sound is the ionomer resin body 1, no special adhesive medium is required when laminating the composite membrane body 6, which has the advantage of improving work by reducing the number of man-hours. By heating for a short time, the ionomer resin body 1 acts as an adhesive medium, and without being exposed to heating for a long time, the cause of leakage current characteristic deterioration is eliminated and stable leakage current characteristics are obtained. In addition, since the adhesive medium for laminating and integrating the composite membrane body 6 is the ionomer resin 1, which is the base material of the composite membrane body 6, there is little lamination deviation, and the pressure is relatively uniform over the entire laminated surface, resulting in excellent The initial objectives can be achieved, such as being able to obtain tan δ characteristics and at the same time eliminating the risk of short-circuit failures.

Next, an example of comparison between Example A obtained by the method of the present invention and the reference date of the earlier application will be described.

Example Δ An aluminum laminate sheet with a 10 μm thick aluminum foil laminated on one side of the ionomer sheet was used, and 2,2'-bipyridinium (TC) was used as an organic semiconductor.
NQ) 2 complex formed by vacuum evaporation and screen printing of the cathode electrode film AQ paste! A rated 25WV0 product made by laminating a plurality of layers, heat-pressing them at 130°C for 30 seconds, and then cutting, forming metallicon electrodes made of aluminum metal on both end faces of the laminated element body, and covering it with epoxy resin as an exterior. .22μF multilayer paperless electrolytic capacitor.

Reference Example B Using a laminate film in which aluminum foil with a thickness of 10 μm was laminated on one side of a polyester film, organic semiconductor, negative Vi! A plurality of multi-layer electrode films formed by the same method as in the above embodiments were laminated with liquid epoxy resin, heated and pressed at 150°C for 45 minutes, and then cut to form a blue-colored laminated element body on both end faces made of aluminum metal. A laminated paperless electrolytic capacitor with a rating of 25WV and 0.22μF, formed of Metallicon mVM and coated with epoxy resin as the exterior.

The leakage current distribution and tan δ distribution in Example A and Reference Example B were investigated, and the results were as shown in FIGS. 5 and 6. There are 300 samples for both A and B.

As is clear from FIGS. 5 and 6, in comparison with Reference Example B, leakage current and tan δ characteristics were stabilized in Example A, demonstrating the excellent effect of the present invention. In the above embodiments, aluminum metal is used as the valve metal am. However, for example, tantalum, tantalum,
Of course, titanium, niobium, etc. can be used. Further, it goes without saying that the shape of the composite membrane body and the shape of the laminate are not limited to those shown in FIGS. 2 and 3 in view of the gist of the present application.

[Effects of the Invention] As described above, according to the structure of the present invention, it is possible to obtain a method for manufacturing a multilayer paperless electrolytic capacitor that is easy to work with, provides stable leakage current characteristics and tanδ characteristics, and has high practical value. be able to.

[Brief explanation of the drawing]

1 to 3 relate to one embodiment of the present invention; FIG. 1 is an enlarged front sectional view showing a laminated paperless electrolytic capacitor, FIG. 2 is a partially enlarged perspective view showing a multi-gI layered body, and FIG. 3
4 is a front sectional view (not showing a multilayer paperless electrolytic capacitor) according to a reference example, FIG. 5 is a leakage current characteristic distribution diagram, and FIG. 6 is a tan δ characteristic distribution diagram. 1... Ionomer resin body 2... Valve metal coating 3... Anodic oxide film 4...
... Organic semiconductor film 5 ... Cathode electrode film 6
...Double membrane body 7...Laminated body
8... Laminated element body 9... Electrode lead-out portion patent application Marukon Electronics Co., Ltd. Enlarged front sectional view showing a capacitor. Oblique? ! Figure 2
Figure 3 Figure 4

Claims (1)

[Claims] Means for forming a plurality of valve metal films on one surface of the ionomer resin body, means for generating an anodized film on the surface of the metal film, and means for forming an organic semiconductor film by vacuum evaporating a TCNQ complex on the oxide film. a means for forming a cathode electrode film on the semiconductor film to obtain a multilayer body; a means for laminating a plurality of the multilayer bodies to form a laminate; and a means for cutting the laminate to obtain a laminate element body. 1. A method for manufacturing a multilayer paperless electrolytic capacitor, comprising: a means for forming an electrode lead-out portion on both end surfaces of the multilayer element body.