JPS636966B2 - - Google Patents
Info
- Publication number
- JPS636966B2 JPS636966B2 JP60266004A JP26600485A JPS636966B2 JP S636966 B2 JPS636966 B2 JP S636966B2 JP 60266004 A JP60266004 A JP 60266004A JP 26600485 A JP26600485 A JP 26600485A JP S636966 B2 JPS636966 B2 JP S636966B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- acid anhydride
- mica tape
- epoxy resin
- coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010445 mica Substances 0.000 claims description 31
- 229910052618 mica group Inorganic materials 0.000 claims description 31
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 239000003822 epoxy resin Substances 0.000 claims description 16
- 229920000647 polyepoxide Polymers 0.000 claims description 16
- 150000008065 acid anhydrides Chemical class 0.000 claims description 12
- 125000002723 alicyclic group Chemical group 0.000 claims description 6
- 239000002966 varnish Substances 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 229920003986 novolac Polymers 0.000 claims description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 3
- 125000004018 acid anhydride group Chemical group 0.000 claims 1
- 238000002156 mixing Methods 0.000 claims 1
- 239000003960 organic solvent Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 18
- 238000009413 insulation Methods 0.000 description 16
- 238000001723 curing Methods 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 10
- 239000004020 conductor Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 238000005470 impregnation Methods 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000010754 BS 2869 Class F Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Landscapes
- Insulating Of Coils (AREA)
- Insulating Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26600485A JPS61142614A (ja) | 1985-11-28 | 1985-11-28 | プリプレグマイカテープ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26600485A JPS61142614A (ja) | 1985-11-28 | 1985-11-28 | プリプレグマイカテープ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61142614A JPS61142614A (ja) | 1986-06-30 |
JPS636966B2 true JPS636966B2 (fr) | 1988-02-15 |
Family
ID=17425028
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26600485A Granted JPS61142614A (ja) | 1985-11-28 | 1985-11-28 | プリプレグマイカテープ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61142614A (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0326655U (fr) * | 1989-07-26 | 1991-03-18 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4599063B2 (ja) * | 2004-01-15 | 2010-12-15 | 株式会社東芝 | コイル巻回用絶縁テープ |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS509100A (fr) * | 1973-05-30 | 1975-01-30 | ||
JPS5018998A (fr) * | 1973-06-22 | 1975-02-27 |
-
1985
- 1985-11-28 JP JP26600485A patent/JPS61142614A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS509100A (fr) * | 1973-05-30 | 1975-01-30 | ||
JPS5018998A (fr) * | 1973-06-22 | 1975-02-27 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0326655U (fr) * | 1989-07-26 | 1991-03-18 |
Also Published As
Publication number | Publication date |
---|---|
JPS61142614A (ja) | 1986-06-30 |
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