JPS636739U - - Google Patents
Info
- Publication number
- JPS636739U JPS636739U JP10130486U JP10130486U JPS636739U JP S636739 U JPS636739 U JP S636739U JP 10130486 U JP10130486 U JP 10130486U JP 10130486 U JP10130486 U JP 10130486U JP S636739 U JPS636739 U JP S636739U
- Authority
- JP
- Japan
- Prior art keywords
- stamp
- resin
- semiconductor device
- sectional
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 1
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案の第１の実施例の半導体装置の
概略断面図、第２図は液状樹脂を捺印面に塗布す
るための治具の概略断面図、第３図は本考案の第
２の実施例の概略断面図、第４図は本考案の第２
の実施例を実現するために用いた容器の概略断面
図、第５図は第４図の容器に半導体装置を入れた
概略断面図である。
１……半導体装置、２……捺印インク、３……
透明樹脂被膜、４……リード、５……液状樹脂塗
布治具、６……捺印面、７……ゴム、８……液状
樹脂、９……樹脂粉体、１０……容器、１１……
容器の底。
FIG. 1 is a schematic cross-sectional view of a semiconductor device according to a first embodiment of the present invention, FIG. 2 is a schematic cross-sectional view of a jig for applying liquid resin to a stamping surface, and FIG. FIG. 4 is a schematic sectional view of the embodiment of the present invention.
FIG. 5 is a schematic cross-sectional view of a container used to realize the embodiment shown in FIG. 4, and FIG. 5 is a schematic cross-sectional view of the container shown in FIG. 1... Semiconductor device, 2... Stamping ink, 3...
Transparent resin coating, 4...Lead, 5...Liquid resin coating jig, 6...Stamp surface, 7...Rubber, 8...Liquid resin, 9...Resin powder, 10...Container, 11...
bottom of the container.
Claims (1)
において、捺印後の捺印面をおおう透明な樹脂被
膜が形成されていることを特徴とする樹脂封止型
半導体装置。 A resin-sealed semiconductor device in which a stamp is applied to a resin body, characterized in that a transparent resin film is formed to cover the stamping surface after the stamp is stamped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10130486U JPS636739U (en) | 1986-06-30 | 1986-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10130486U JPS636739U (en) | 1986-06-30 | 1986-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS636739U true JPS636739U (en) | 1988-01-18 |
Family
ID=30971925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10130486U Pending JPS636739U (en) | 1986-06-30 | 1986-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS636739U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5830189B2 (en) * | 1976-02-23 | 1983-06-27 | 株式会社小松製作所 | Gear shift steering device for tracked vehicles |
-
1986
- 1986-06-30 JP JP10130486U patent/JPS636739U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5830189B2 (en) * | 1976-02-23 | 1983-06-27 | 株式会社小松製作所 | Gear shift steering device for tracked vehicles |