JPS6367239U - - Google Patents
Info
- Publication number
- JPS6367239U JPS6367239U JP16276486U JP16276486U JPS6367239U JP S6367239 U JPS6367239 U JP S6367239U JP 16276486 U JP16276486 U JP 16276486U JP 16276486 U JP16276486 U JP 16276486U JP S6367239 U JPS6367239 U JP S6367239U
- Authority
- JP
- Japan
- Prior art keywords
- heating
- fluid
- bernoulli chuck
- heating device
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16276486U JPH0341461Y2 (xx) | 1986-10-22 | 1986-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16276486U JPH0341461Y2 (xx) | 1986-10-22 | 1986-10-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6367239U true JPS6367239U (xx) | 1988-05-06 |
| JPH0341461Y2 JPH0341461Y2 (xx) | 1991-08-30 |
Family
ID=31090339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16276486U Expired JPH0341461Y2 (xx) | 1986-10-22 | 1986-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0341461Y2 (xx) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0475328A (ja) * | 1990-07-18 | 1992-03-10 | Toshiba Corp | 半導体の処理方法およびその装置 |
| JP2009088222A (ja) * | 2007-09-28 | 2009-04-23 | Tokyo Electron Ltd | 基板保持装置、基板保持方法、半導体製造装置及び記憶媒体 |
| KR20180127390A (ko) * | 2016-03-18 | 2018-11-28 | 에이씨엠 리서치 (상하이) 인코포레이티드 | 기판 열처리 장치 |
-
1986
- 1986-10-22 JP JP16276486U patent/JPH0341461Y2/ja not_active Expired
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0475328A (ja) * | 1990-07-18 | 1992-03-10 | Toshiba Corp | 半導体の処理方法およびその装置 |
| JP2009088222A (ja) * | 2007-09-28 | 2009-04-23 | Tokyo Electron Ltd | 基板保持装置、基板保持方法、半導体製造装置及び記憶媒体 |
| JP4616873B2 (ja) * | 2007-09-28 | 2011-01-19 | 東京エレクトロン株式会社 | 半導体製造装置、基板保持方法及びプログラム |
| KR20180127390A (ko) * | 2016-03-18 | 2018-11-28 | 에이씨엠 리서치 (상하이) 인코포레이티드 | 기판 열처리 장치 |
| CN109075102A (zh) * | 2016-03-18 | 2018-12-21 | 盛美半导体设备（上海）有限公司 | 衬底热处理装置 |
| JP2019510375A (ja) * | 2016-03-18 | 2019-04-11 | エーシーエム リサーチ （シャンハイ） インコーポレーテッド | 基板熱処理装置 |
| CN109075102B (zh) * | 2016-03-18 | 2022-07-12 | 盛美半导体设备(上海)股份有限公司 | 衬底热处理装置 |
| US11854842B2 (en) | 2016-03-18 | 2023-12-26 | Acm Research (Shanghai), Inc. | Substrate heat treatment apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0341461Y2 (xx) | 1991-08-30 |