JPS6366710A - Production of thin film magnetic head - Google Patents
Production of thin film magnetic headInfo
- Publication number
- JPS6366710A JPS6366710A JP21079186A JP21079186A JPS6366710A JP S6366710 A JPS6366710 A JP S6366710A JP 21079186 A JP21079186 A JP 21079186A JP 21079186 A JP21079186 A JP 21079186A JP S6366710 A JPS6366710 A JP S6366710A
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- organic insulating
- coil
- conductor
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000010408 film Substances 0.000 claims abstract description 59
- 239000004020 conductor Substances 0.000 claims abstract description 51
- 239000000463 material Substances 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 6
- 239000000696 magnetic material Substances 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract description 4
- 238000005530 etching Methods 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract 2
- 238000009413 insulation Methods 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Landscapes
- Magnetic Heads (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、薄膜磁気ヘッドの製造方法に関し、特に、有
機絶縁体と導体コイルのリード端子部とが交差する部分
の段切れを防止できる薄膜磁気ヘッドの製造方法に関す
る。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a thin film magnetic head, and in particular to a method for manufacturing a thin film magnetic head, and in particular, a method for manufacturing a thin film magnetic head that can prevent breakage at the intersection of an organic insulator and a lead terminal portion of a conductive coil. The present invention relates to a method of manufacturing a magnetic head.
尚１本明細書において、段切れとは導体コイル下方の有
機絶縁膜がエツチングによって消失し。1. In this specification, a step break means that the organic insulating film below the conductor coil disappears due to etching.
導体コイルが剥離した状態になることをいう。This is when the conductor coil becomes separated.
４膜磁気ヘツドは、磁気ドラム、磁気テープ或いは磁気
ディスク等の磁気記録密度を高くするために薄膜技術で
形成した磁気ヘッドであって、通常、一部に磁気ギャッ
プを有する磁気回路を形成する下部磁性膜及び上部磁性
膜と、両磁性膜間を通り、磁気回路と交差するコイルを
形成する導体膜とを、必要個所に絶縁膜を介して、基板
上に積層した構成になっている。A four-film magnetic head is a magnetic head formed using thin film technology to increase the magnetic recording density of magnetic drums, magnetic tapes, magnetic disks, etc., and usually has a lower part that forms a magnetic circuit with a magnetic gap in part. It has a structure in which a magnetic film, an upper magnetic film, and a conductor film that passes between the two magnetic films and forms a coil that intersects with the magnetic circuit are laminated on a substrate with insulating films interposed in necessary locations.
従来の薄膜磁気ヘッドは、例えば特開昭５８−７７０１
９号公報に示されるように、層間絶縁膜が有機樹脂で形
成されていることで、導体コイルの段切れが防止されて
いた。しかし、有機絶縁膜が多層になった場合のパター
ン形状や配置については考慮されていなかった。A conventional thin film magnetic head is disclosed in Japanese Patent Application Laid-Open No. 58-7701, for example.
As disclosed in Japanese Patent No. 9, the interlayer insulating film is formed of an organic resin, thereby preventing the conductor coil from breaking. However, no consideration was given to the pattern shape and arrangement when the organic insulating film is multilayered.
上記従来の技術においては、導体コイルや有機絶縁膜が
多層になった場合のパターン形状及び配置について配慮
されていないので、そのような場合、第２層導機絶縁膜
のウェットエツチング時に。In the above-mentioned conventional technology, no consideration is given to the pattern shape and arrangement when the conductor coil and organic insulating film are multilayered.
導体コイルの端子引き出し部下方の第１層導機絶縁膜が
同時にエツチングされ、コイル部や素子部保護膜の段切
れを生じる恐れがあった。The first layer conductor insulating film below the terminal draw-out of the conductor coil was etched at the same time, and there was a fear that the coil portion and the element portion protective film would be broken.
本発明は、多層コイル配線、多層有機絶縁膜の形成に際
し、コイルの段切れ及び保護膜の欠陥を発生せず、信頼
性の高い高性能薄膜磁気ヘッドを実現する薄膜磁気ヘッ
ドの製造方法を提供することを目的とする。The present invention provides a method for manufacturing a thin-film magnetic head that does not cause coil disconnection or protective film defects when forming multilayer coil wiring and multilayer organic insulating films, and realizes a highly reliable, high-performance thin-film magnetic head. The purpose is to
本発明の３１戻磁気ヘツドの製造方法は、基板上に下部
磁性体及びギャップ材を形成したのち、下層有機絶縁膜
とその下層有機絶縁膜の端縁にリード端子部を交差させ
て重ねた導体コイルを１層もしくは中間有機絶縁膜を介
して１ｙＰｊ以上積み上げ。The manufacturing method of the 31 return magnetic head of the present invention includes forming a lower magnetic material and a gap material on a substrate, and then stacking a lower organic insulating film and a conductor with lead terminal parts crossing the edges of the lower organic insulating film. Coils are stacked in one layer or more than 1yPj via an intermediate organic insulating film.
それらの頂面に上層有機絶９１１２を介して上部磁性体
を形成するものであり、特に導体コイルの下側に位置す
る有機絶縁膜と導体コイルの端子部とが交差する端縁の
位置が、導体コイルの上側の有機絶縁膜によって覆われ
ていることを特徴としている。An upper magnetic material is formed on the top surface of these through an upper organic insulation layer 9112, and in particular, the position of the edge where the organic insulation film located below the conductor coil intersects with the terminal portion of the conductor coil is It is characterized by being covered with an organic insulating film above the conductor coil.
本発明によれば、導体コイルの下側の有機絶縁膜と導体
コイルの端子部とが交差する端縁の位置が、導体コイル
の上側の有機絶縁膜によって覆われるため、エツチング
されない。そのため、導体コイルの段切れが防止できる
。According to the present invention, the edge position where the organic insulating film on the lower side of the conductor coil and the terminal portion of the conductor coil intersect is covered by the organic insulating film on the upper side of the conductor coil, so that it is not etched. Therefore, disconnection of the conductor coil can be prevented.
以下図面を参照して、本発明の一実施例について説明す
る。An embodiment of the present invention will be described below with reference to the drawings.
第１図は、本発明による１暎磁気ヘッド素子部の製造工
程の一例を示す断面図である。第１図（ａ）は、基板１
上に下地膜２．下部磁性体３．ギャップ材４．第１層導
機絶縁膜５がそれぞれ従来と同様な方法で形成された状
態を示している。第１層導機絶縁膜５は１通常、スピン
ナーコーティング。FIG. 1 is a sectional view showing an example of the manufacturing process of a one-step magnetic head element portion according to the present invention. FIG. 1(a) shows the substrate 1
Base film 2 on top. Lower magnetic body 3. Gap material 4. The first layer conductive insulating film 5 is shown formed by a conventional method. The first layer conductive insulating film 5 is usually spinner coating.
熱硬化、ウェットエツチングによりパターニングされ、
図中矢印Ａはそのパターン端縁を示している。次に、第
１図（ｂ）に示すように、導体コイル６が従来と同様な
方法で形成されるが、その際、第１１有機絶縁膜５は、
下部磁性体３上に直接導体コイル６が形成される場合の
段切れの防止や、導体コイル６のイオンエツチング時に
ギャップ材４を保護することを可能にしている。導体コ
イル６は、磁気コアと交差するような位置にスパイラル
状に配設されていて、そのリード端子部は図中右方へ引
き出され、前記パターン端縁を境に、矢印Ｂで示される
部分はギャップ材４上に形成されている。Patterned by heat curing and wet etching,
Arrow A in the figure indicates the edge of the pattern. Next, as shown in FIG. 1(b), a conductor coil 6 is formed in the same manner as in the conventional method, but at that time, the eleventh organic insulating film 5 is
This makes it possible to prevent breakage when the conductor coil 6 is formed directly on the lower magnetic body 3 and to protect the gap material 4 during ion etching of the conductor coil 6. The conductor coil 6 is arranged in a spiral shape at a position where it intersects with the magnetic core, and its lead terminal portion is pulled out to the right in the figure, and extends from the edge of the pattern to the portion indicated by arrow B. is formed on the gap material 4.
更に、第１図（ｃ）に示すように、前記導体コイル６上
に、第２層導機絶縁膜７を第１層導機絶縁１１莫５と同
様な方法で形成する。これは、前記導体コイル６を第１
層導体コイルとして、導体コイルの第２層を形成する場
合に、２つの層間を絶縁するためで、第１層導体コイル
６のコンタクトホールに相当する位置は絶縁を切除され
る。この際、第１層導体コイル６のリード端子部下方の
第１層導機絶縁膜５がエツチングされないように、第２
層導機絶縁膜７の端縁は、第１図（ａ）において矢印Ａ
で示した第１層導機絶縁膜５の端縁位置よりも素子外方
に、図中矢印Ｃで示されるような位置までパターニング
するものとする。Furthermore, as shown in FIG. 1(c), a second layer conductor insulation film 7 is formed on the conductor coil 6 in the same manner as the first layer conductor insulation film 11 and the first layer conductor insulation film 5. As shown in FIG. This causes the conductor coil 6 to
When forming the second layer of the conductor coil as a layered conductor coil, the insulation is removed at the position corresponding to the contact hole of the first layer conductor coil 6 in order to insulate the two layers. At this time, the second layer conductor insulating film 5 below the lead terminal of the first layer conductor coil 6 is not etched.
The edge of the layer conductor insulating film 7 is indicated by arrow A in FIG. 1(a).
It is assumed that the patterning is performed to a position shown by arrow C in the figure, which is further outward from the element than the edge position of the first layer conductive insulating film 5 shown in .
次に、第１図（ｄ）に示すように、第２層導体コイル８
を形成する。第２層導体コイル８は、前記コンタクトホ
ール部８ａで、第１層導体コイル６と接続される。コン
タクトホールは、導体コイルが更に多層にわたる場合、
所要に応じて連通されても差し支えない。Next, as shown in FIG. 1(d), the second layer conductor coil 8
form. The second layer conductor coil 8 is connected to the first layer conductor coil 6 at the contact hole portion 8a. When the conductor coil spans multiple layers, the contact hole
There is no problem in communicating as required.
続いて、第１図（ｅ）に示すように、前記第２層導体コ
イル８を覆って、第３層導機絶縁膜９を形成する。この
第３層導機絶縁膜９は、第２層導体コイル８と上部磁性
体との間の絶縁を目的とするもので、第３層が絶縁膜の
最上層である場合には。Subsequently, as shown in FIG. 1(e), a third layer conductor insulating film 9 is formed to cover the second layer conductor coil 8. This third layer conductor insulating film 9 is for the purpose of insulating between the second layer conductor coil 8 and the upper magnetic body, and when the third layer is the uppermost layer of the insulating film.
第１図（ａ）で示した下部磁性体３の所望部分に対して
、第１層、第２層、第３層の有機絶Ｘゑ膜を一括エッチ
ングできるように、第３層導機絶縁膜９の頂面にマスキ
ング９ａが施される。また、リード端子部は、ウェット
エツチング時に各導体コイル下方の有機絶縁膜がエツチ
ングされないように、各導体コイルが有機絶縁膜と交差
する部分の最外方端縁１例えば第１図（ｃ）において矢
印Ｃで示された位置を完全に覆う矢印りの位置まで、第
３層有機絶縁′ｆ！２９を形成する。The third conductive insulating film is etched onto the desired portion of the lower magnetic body 3 shown in FIG. A masking 9a is applied to the top surface of the membrane 9. In addition, the lead terminal portion is formed at the outermost edge 1 of the portion where each conductor coil intersects with the organic insulating film, for example, as shown in FIG. The third layer of organic insulation 'f! Form 29.
最後に、第１図（ｆ）に示すように、上部磁性体１０及
び端子１１を配設し、頂部を保護膜１２で充足して、薄
膜磁気ヘッド素子が完成する。そして、該素子を更に鎖
ｔＡＥで示されるような所定の位置でヘッドチップに切
断し、薄膜磁気ヘッドに加工する。Finally, as shown in FIG. 1(f), the upper magnetic body 10 and the terminals 11 are provided, and the top portion is filled with a protective film 12 to complete the thin film magnetic head element. Then, the element is further cut into head chips at predetermined positions as indicated by chain tAE, and processed into a thin film magnetic head.
本実施例では、２層コイル構造の薄膜磁気ヘッドとして
説明したが、多層コイル構造や逆に単層コイル構造であ
っても、本実施例と同様な製造方法を用いることにより
、導体コイルの段切れ、素子保護膜の欠陥を防止するこ
とができる。In this example, a thin film magnetic head with a two-layer coil structure was explained, but even with a multi-layer coil structure or conversely a single-layer coil structure, by using the same manufacturing method as in this example, the steps of the conductor coil can be used. Cutting and defects in the element protective film can be prevented.
以上説明したとおり１本発明によれば、多層コイル配線
、多層有機絶縁膜の形成に際し、導体コイルのリード端
子部と有機：＠ Ｊ３： ＩＪとが交差する端縁部分を
エツチングすることがないので、コイルの段切れや保護
；摸の欠陥を発生せず、信頼性の高い高性能薄膜磁気ヘ
ッドを実現する優れた効果を奏するものである。As explained above, according to the present invention, when forming a multilayer coil wiring and a multilayer organic insulating film, there is no need to etch the edge portion where the lead terminal portion of the conductor coil intersects with the organic IJ. This method has excellent effects in realizing a highly reliable, high-performance thin-film magnetic head without causing defects in coil breakage or protection.
第１図（ａ）〜（ｆ）は、本発明の一実施例の製造工程
を示す断面図である。
１・・・基板、２・・・下地膜、３・・・下部磁性体、
４・・・ギャップ材、５・・・第１層有機絶縁膜、６・
・・第１層重体コイル、７・・・第２層有機絶縁膜、８
・・・第２周溝体コイル、９・・・第３層有機絶縁膜、
１０・・・上部磁性体、１１・・・端子、１２・・・保
護膜。FIGS. 1(a) to 1(f) are cross-sectional views showing the manufacturing process of an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Base film, 3... Lower magnetic body,
4... Gap material, 5... First layer organic insulating film, 6.
...First layer heavy coil, 7...Second layer organic insulating film, 8
... second circumferential groove body coil, 9 ... third layer organic insulating film,
10... Upper magnetic body, 11... Terminal, 12... Protective film.
Claims (1)
ち、下層有機絶縁膜とその下層有機絶縁膜の端縁にリー
ド端子部を交差させて重ねた導体コイルを１層もしくは
中間有機絶縁膜を介して２層以上積み上げ、それらの頂
面に上層有機絶縁膜を介して上部磁性体を形成する薄膜
磁気ヘッドの製造方法において、導体コイルの下側に位
置する有機絶縁膜と導体コイルの端子部とが交差する端
縁の位置が、導体コイルの上側の有機絶縁膜によって覆
われていることを特徴とする薄膜磁気ヘッドの製造方法
。1. After forming the lower magnetic material and the gap material on the substrate, a single layer of a lower organic insulating film and a conductor coil stacked on the edge of the lower organic insulating film with the lead terminals crossed, or an intermediate organic insulating film is formed. In a method for manufacturing a thin-film magnetic head in which two or more layers are stacked up through a conductive coil and an upper magnetic body is formed on the top surface of the two or more layers through an upper organic insulating film, the organic insulating film located below the conductor coil and the terminal portion of the conductor coil are 1. A method of manufacturing a thin-film magnetic head, characterized in that a position of an edge where the two intersect with each other is covered with an organic insulating film on the upper side of the conductor coil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21079186A JPS6366710A (en) | 1986-09-09 | 1986-09-09 | Production of thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21079186A JPS6366710A (en) | 1986-09-09 | 1986-09-09 | Production of thin film magnetic head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6366710A true JPS6366710A (en) | 1988-03-25 |
Family
ID=16595191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21079186A Pending JPS6366710A (en) | 1986-09-09 | 1986-09-09 | Production of thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6366710A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08180324A (en) * | 1994-12-26 | 1996-07-12 | Nec Corp | Thin-film magnetic head |
-
1986
- 1986-09-09 JP JP21079186A patent/JPS6366710A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08180324A (en) * | 1994-12-26 | 1996-07-12 | Nec Corp | Thin-film magnetic head |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2006011291A1 (en) | Method for manufacturing electronic component, parent board and electronic component | |
| US5539227A (en) | Multi-layer wiring | |
| KR100253352B1 (en) | Fabrication method of stackable semiconductor chip and stacked semiconductor chip moudle | |
| JPS6366710A (en) | Production of thin film magnetic head | |
| US20080061918A1 (en) | Inductive Component Fabrication Process | |
| JP2001176975A (en) | Semiconductor device and producing method therefor | |
| JP7424157B2 (en) | Electronic components and their manufacturing methods | |
| JPS63240045A (en) | Semiconductor device | |
| JPS5935165B2 (en) | Manufacturing method of multilayer thin film coil | |
| KR20010003523A (en) | Method for forming a fuse in a semiconductor device | |
| JP2020136467A (en) | Coil component and manufacturing method thereof | |
| KR100340912B1 (en) | Fuse region in semiconductor device and method thereof | |
| JP3227828B2 (en) | Connection method between multilayer thin film device and thin film | |
| WO2024047926A1 (en) | Coil component | |
| JPH05121242A (en) | Divided lamination type coil | |
| TW557458B (en) | Laminated electric parts | |
| JP3039163B2 (en) | Method for manufacturing semiconductor device | |
| JP2536174B2 (en) | Thin film magnetic head | |
| JP2551030B2 (en) | Semiconductor device and manufacturing method thereof | |
| KR100247911B1 (en) | Semiconductor device and method of fabricating the same | |
| JP2809466B2 (en) | Thin film magnetic head | |
| KR100256799B1 (en) | Method of forming contact in semiconductor device | |
| JPS6029117Y2 (en) | magnetic bubble transfer structure | |
| JPS5885550A (en) | Manufacture of laminated integrated circuit element | |
| JPH1153712A (en) | Planer-shaped thin film magnetic head |