JPS6364395A - Plating system for printed board - Google Patents
Plating system for printed boardInfo
- Publication number
- JPS6364395A JPS6364395A JP20903686A JP20903686A JPS6364395A JP S6364395 A JPS6364395 A JP S6364395A JP 20903686 A JP20903686 A JP 20903686A JP 20903686 A JP20903686 A JP 20903686A JP S6364395 A JPS6364395 A JP S6364395A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- plating
- metal
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims description 51
- 239000002184 metal Substances 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 32
- 150000002500 ions Chemical class 0.000 description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 9
- 239000004020 conductor Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 210000000689 upper leg Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概要〕
プリント基板メッキ装置であって、陰極、陽毎λ間に複
数個の孔を有する絶縁板と、該絶縁板の外周部に導体金
属を設けた構成とし、電気メッキにおけるメンキ膜厚の
周端効果を矯正してプリント基板のメッキ膜厚のバラツ
キを最小限に抑えることを可能とする。[Detailed Description of the Invention] [Summary] A printed circuit board plating apparatus comprising an insulating plate having a plurality of holes between a cathode and a positive electrode, and a conductive metal provided on the outer periphery of the insulating plate, To make it possible to minimize variations in plating film thickness of a printed circuit board by correcting the peripheral edge effect of coating film thickness in electroplating.
本発明はプリント基板メッキ装置に係り、特にメッキ膜
厚の周端効果を矯正してプリント基板メメソキ膜厚のバ
ラツキを最小限に抑えるようにしたプリント基板メッキ
装置に関するものである。The present invention relates to a printed circuit board plating apparatus, and more particularly to a printed circuit board plating apparatus that corrects peripheral edge effects in plating film thickness and minimizes variations in the thickness of printed circuit boards.
電子機器等の電気回路に用いられるプリント基板は、電
子機器の小型化に伴ない積層されて多層プリント坂に成
形される。この多層プリント扱を成形するに際し、各プ
リント基板に形成されるパターンのメッキ厚にバラツキ
があると多層プリント板に歪が発生し、各プリント基板
のパターン間の位置精度がわるくなって多層プリント１
ｆｆｌの回路形成が出来なくなる。2. Description of the Related Art Printed circuit boards used in electric circuits of electronic devices and the like are laminated to form a multilayer printed circuit board as electronic devices become smaller. When molding this multilayer printed circuit board, if there are variations in the plating thickness of the patterns formed on each printed circuit board, distortion will occur in the multilayer printed board, and the positional accuracy between the patterns on each printed circuit board will deteriorate, resulting in a multilayer printed circuit board.
ffl circuit formation becomes impossible.
かかるゆえに、プリント基板のメッキ厚を一定とする必
要があり、それがためのプリント基板メッキ装置が必要
とされていた。Therefore, it is necessary to make the plating thickness of the printed circuit board constant, and a printed circuit board plating apparatus for this purpose has been needed.
第３図は従来のメッキ装置の構成断面図、第４図は従来
の絶縁板の斜視図を示している。FIG. 3 is a sectional view of a conventional plating apparatus, and FIG. 4 is a perspective view of a conventional insulating plate.
第３図に示すように、従来のメッキ装置は、メッキ液１
を収納するメッキ槽２と、該メッキ槽２内にプリント基
板３の両面に対向して設けられた金属電極４および５と
、プリント基板３と金属電極４および５との間に設けら
れた、第４図に示す複数個の孔９−１〜９−ｎを有する
絶縁板６および７を配設し、プリント基Ｆｉ３のパター
ン３−１に負電圧（−電圧）を、金属電極４および５に
正電圧（中電圧）を印加する電源部８とより構成してい
る。As shown in Fig. 3, the conventional plating equipment uses plating solution 1.
A plating tank 2 containing a plating tank 2, metal electrodes 4 and 5 provided in the plating tank 2 to face each other on both sides of a printed circuit board 3, and a plating tank 2 provided between the printed circuit board 3 and the metal electrodes 4 and 5. Insulating plates 6 and 7 having a plurality of holes 9-1 to 9-n shown in FIG. and a power supply section 8 that applies a positive voltage (medium voltage) to the power source.
説明を容易とするため、プリント基板半田メッキ装置を
例にとって、その動作を説明する。For ease of explanation, the operation will be explained using a printed circuit board solder plating apparatus as an example.
半田メブキの場合は、金属電極４および５に錫と鉛の合
金の半田電極を用い、メッキ液１中には錫および鉛のイ
オンが存在している。In the case of solder plating, tin and lead alloy solder electrodes are used for the metal electrodes 4 and 5, and tin and lead ions are present in the plating solution 1.
いま、電源部８よりプリント基板３に負電圧が、半田電
極４および５に正電圧が印加されると、メッキ液１に存
在する錫および鉛のイオンがプリント基板３のパターン
３−１上に析出されるとともに、半田電極４および５が
メッキ液１の中に溶解し、錫および鉛のイオンをメッキ
液１中に補給し、常に一定のイオン量に保っている。Now, when a negative voltage is applied from the power supply section 8 to the printed circuit board 3 and a positive voltage is applied to the solder electrodes 4 and 5, tin and lead ions present in the plating solution 1 are applied onto the pattern 3-1 of the printed circuit board 3. As the solder electrodes 4 and 5 are deposited, they are dissolved in the plating solution 1, and tin and lead ions are replenished into the plating solution 1 to maintain a constant ion content.
このようにして順次補給されるメッキ液１中の錫および
鉛のイオンは、金属電極４および５から絶縁板６および
７の孔９−１〜９− ｎを通ってバクーン３−１方向に
移動し、バクーン３−１上に析出される。The tin and lead ions in the plating solution 1, which are sequentially replenished in this way, move from the metal electrodes 4 and 5 through the holes 9-1 to 9-n of the insulating plates 6 and 7 in the direction of the plating solution 3-1. and deposited on Bakun 3-1.
そこで、絶縁板６および７の孔９−１〜９− ｎの数と
その径を変えることによってパターン３−１に析出され
る錫および鉛のイオン量を調整し、パターン３−１上に
所定の厚さの半田メッキを得ている。Therefore, by changing the number and diameter of holes 9-1 to 9-n in insulating plates 6 and 7, the amount of tin and lead ions deposited on pattern 3-1 is adjusted, and a predetermined amount of ions are deposited on pattern 3-1. The thickness of the solder plating is obtained.
上記のプリント基板メッキ方法においては、第３図の点
線で示すように、プリント基板の端部１０に錫および鉛
イオンが多く析出する、いわゆるメッキ厚膜の″周端効
果″が発生し、端部１０が内周部１１よりメブキの厚さ
が厚くなってプリント基板にメッキ膜厚のバラツキが生
じるといった問題が発生する。In the above printed circuit board plating method, as shown by the dotted line in FIG. 3, a so-called "edge effect" of a thick plating film occurs, in which a large amount of tin and lead ions are precipitated at the edge 10 of the printed circuit board. A problem arises in that the plating thickness of the portion 10 is thicker than that of the inner peripheral portion 11, resulting in variations in the plating film thickness on the printed circuit board.
本発明はこのような点に鑑みて創作されたもので、電気
メブキにおけるメッキ厚膜の周端効果を矯正してメッキ
厚のバラツキを少なくすることができるプリント基板メ
ブキ装置を提供することを目的としている。The present invention was created in view of the above points, and an object of the present invention is to provide a printed circuit board coating device that can correct the peripheral edge effect of a thick plating film in electric coating and reduce variations in plating thickness. It is said that
絶縁板の外周部に導体金属を付設し、該導体金属に正電
圧を印加するとともに、前記絶縁板をそれぞれメッキ槽
内のプリント基板と該プリント基板３の両面に対向して
設けられた金属電極との間に配設し、前記導体金、冗に
負電圧を印加するとともに、プリント基板のパターンに
負電圧を、金属電極に正電圧を印加する構成としている
。A conductive metal is attached to the outer periphery of the insulating plate, and a positive voltage is applied to the conductive metal, and the insulating plate is connected to a printed circuit board in the plating bath and metal electrodes provided on both sides of the printed circuit board 3. The structure is such that a negative voltage is applied to the conductive gold, a negative voltage is applied to the pattern of the printed circuit board, and a positive voltage is applied to the metal electrode.
導体金属は負電圧が印加されることによって、メッキ厚
膜の周端効果によってプリント基板の端部に析出しよう
とする正電荷の金属イオン（錫および鉛イオン）の一部
を吸着し、プリント基板の端部へのメッキ厚を矯正して
内周部のメッキ厚とほぼ等しくしている。When a negative voltage is applied to the conductive metal, it adsorbs some of the positively charged metal ions (tin and lead ions) that tend to deposit on the edges of the printed circuit board due to the edge effect of the thick plating film, and The thickness of the plating on the end of the plate is corrected so that it is almost equal to the thickness of the plating on the inner circumference.
第１図は本発明の一実施例のプリント基板メッキ装置の
構成断面図、第２図は本発明の絶縁板の斜視図を示して
おり、前記第３図および第４図と同一部位は同一符号を
もって示している。FIG. 1 is a cross-sectional view of the structure of a printed circuit board plating apparatus according to an embodiment of the present invention, and FIG. 2 is a perspective view of an insulating board according to the present invention. The same parts as in FIGS. 3 and 4 are the same. It is indicated by a symbol.
第２図に示すように、本発明の絶縁Ｆｉ６および７は、
複数個の孔９−１〜９．を有するとともに、その外形を
プリント板と同等寸法とし、外周部にステンレスＧＶＩ
又は鋼材で形成された金属導体１２を設けている。As shown in FIG. 2, the insulation Fi6 and 7 of the present invention are
A plurality of holes 9-1 to 9. It has the same external dimensions as a printed board, and has stainless steel GVI on the outer periphery.
Alternatively, a metal conductor 12 made of steel is provided.
この絶縁板６および７は、第１図に示すように、メッキ
槽２内のプリント基板３と該プリント基板３の両面に対
向して設けられた金属電極４および５との間・に、それ
ぞれの金属導体１２が金属電極４および５に対向した状
態で配設するとともに、金属導体１２には負電圧が印加
される。As shown in FIG. 1, the insulating plates 6 and 7 are provided between the printed circuit board 3 in the plating bath 2 and the metal electrodes 4 and 5 provided oppositely on both surfaces of the printed circuit board 3, respectively. A metal conductor 12 is disposed facing the metal electrodes 4 and 5, and a negative voltage is applied to the metal conductor 12.
また、プリント基板３のパターン３−１には負電圧が、
金属電極４および５には正電圧が印加される。Further, a negative voltage is applied to the pattern 3-1 of the printed circuit board 3.
A positive voltage is applied to metal electrodes 4 and 5.
いま、電源部８よりプリント基板３に負電圧が、半田電
極４および５に正電圧が印加されると、メッキ液１中の
金属（錫および鉛）イオンは、金属電極４および５から
絶縁板６および７の孔９−１〜９−ｎを通ってパターン
３−１方向に移動し、パターン３−１上に析出される。Now, when a negative voltage is applied from the power supply section 8 to the printed circuit board 3 and a positive voltage is applied to the solder electrodes 4 and 5, metal (tin and lead) ions in the plating solution 1 are transferred from the metal electrodes 4 and 5 to the insulating plate. It moves toward pattern 3-1 through holes 9-1 to 9-n of holes 6 and 7, and is deposited on pattern 3-1.
このパターン３−１上への金属イオンの析出において、
メッキ厚膜の周端効果によってプリント基板３の端部１
０に集中する金属イオンは、プリント基板３の端部１０
と対向位置に設けられた絶縁板６および７の金属導体１
２によって一部が吸着されて端部１０への析出が少なく
なる。In depositing metal ions onto this pattern 3-1,
The edge 1 of the printed circuit board 3 due to the peripheral edge effect of the thick plated film
Metal ions concentrated at the edge 10 of the printed circuit board 3
The metal conductor 1 of the insulating plates 6 and 7 provided in a position facing the
2, a portion is adsorbed and precipitation on the end portion 10 is reduced.
なお、プリント基板３の端部１０への析出イオン量の調
整は、金属導体１２の面積を変えることによって行ない
、又プリント基板３の内周部１１の析出イオン量の調整
は、絶縁板６および７の孔９−１〜９−ｎの数とその径
を変えることによって行なってプリント基Ｆｊ、３のパ
ターン３−１上に一定した厚さの金属メッキを得ている
。The amount of precipitated ions on the end portion 10 of the printed circuit board 3 is adjusted by changing the area of the metal conductor 12, and the amount of precipitated ions on the inner peripheral portion 11 of the printed circuit board 3 is adjusted by changing the area of the metal conductor 12. By changing the number of holes 9-1 to 9-n of No. 7 and their diameters, a uniform thickness of metal plating is obtained on the pattern 3-1 of print base Fj, No. 3.
以上説明したように本発明によれば、電気メッキにおけ
るメッキ厚膜の周端効果によるプリント基板端部のメッ
キ厚を調整して内周部の鍍金属と同等の厚さとすること
により、バラツキのないメッキ厚を持った高品質のプリ
ント基板を得ることが可能となる。As explained above, according to the present invention, the plating thickness at the end of the printed circuit board due to the peripheral edge effect of the thick plating film in electroplating is adjusted to have the same thickness as the plating metal on the inner peripheral part, thereby reducing the variation. It becomes possible to obtain a high-quality printed circuit board with a plating thickness that is extremely thin.
第１図は本発明の一実施例のプリント基板メンキ装置の
構成断面図、
第２図は一実施例の絶縁板の斜視図、
第３図は従来のプリント基板メッキ装置の構成断面図、
第４図は従来の絶縁板の斜視図を示している。
図において、１はメッキ液、２はメッキ槽、３はプリン
ト基板、３−１はパターン、４．５は金属電極、６．７
は絶縁板、８は電源部、９−１〜９−ｎは孔、１０は端
部、１１は内周部、１２は金属導体を示している。
第１図
一史力ら１月の腿薦Ｇ乱べ牢再り刀
第２図FIG. 1 is a cross-sectional view of a printed circuit board plating apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of an insulating plate according to an embodiment, and FIG. 3 is a cross-sectional view of a conventional printed circuit board plating apparatus. FIG. 4 shows a perspective view of a conventional insulating plate. In the figure, 1 is a plating solution, 2 is a plating tank, 3 is a printed circuit board, 3-1 is a pattern, 4.5 is a metal electrode, 6.7
8 is an insulating plate, 8 is a power supply part, 9-1 to 9-n are holes, 10 is an end part, 11 is an inner peripheral part, and 12 is a metal conductor. Figure 1: Shiriki et al.'s thigh recommendation G disorder in January Figure 2:
Claims (1)
）を配設するとともに、前記プリント基板（３）と前記
金属電極（４、５）との間に複数個の孔を有する絶縁板
（６、７）を配設し、これらをメッキ槽（２）内に浸漬
すると共に、前記プリント基板（３）のパターン（３−
１）に負電圧を、前記金属電極（４、５）に正電圧を印
加して前記プリント基板（３）のパターン（３−１）に
金属メッキを行うプリント基板メッキ装置において、前
記絶縁板（６、７）の外周部に導体金属（１２）を付設
し、該導体金属（１２）に正電圧を印加するようにした
ことを特徴とするプリント基板メッキ装置。Metal electrodes (4, 5) are placed opposite both sides of the printed circuit board (3).
), and insulating plates (6, 7) having a plurality of holes are provided between the printed circuit board (3) and the metal electrodes (4, 5), and these are placed in the plating tank (2). ) and the pattern (3-) of the printed circuit board (3).
In a printed circuit board plating apparatus that applies metal plating to the pattern (3-1) of the printed circuit board (3) by applying a negative voltage to the metal electrode (4, 5) and applying a positive voltage to the metal electrode (4, 5), the insulating plate ( A printed circuit board plating apparatus characterized in that a conductive metal (12) is attached to the outer periphery of the parts 6 and 7), and a positive voltage is applied to the conductive metal (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20903686A JPS6364395A (en) | 1986-09-04 | 1986-09-04 | Plating system for printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20903686A JPS6364395A (en) | 1986-09-04 | 1986-09-04 | Plating system for printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6364395A true JPS6364395A (en) | 1988-03-22 |
Family
ID=16566190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20903686A Pending JPS6364395A (en) | 1986-09-04 | 1986-09-04 | Plating system for printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6364395A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102383169A (en) * | 2011-10-31 | 2012-03-21 | 东莞生益电子有限公司 | Assistant plate bar of vertical plating line and method for vertical electroplating of PCB plate |
| CN102747400A (en) * | 2012-07-06 | 2012-10-24 | 新疆西部宏远电子有限公司 | Uniform-current-density electrode foil formation method and uneven mesh type insulation board |
| JP2015086444A (en) * | 2013-10-31 | 2015-05-07 | 凸版印刷株式会社 | Electrolytic plating apparatus |
| CN109496080A (en) * | 2018-10-08 | 2019-03-19 | 江苏长电科技股份有限公司 | A kind of circuit board plating process method |
-
1986
- 1986-09-04 JP JP20903686A patent/JPS6364395A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102383169A (en) * | 2011-10-31 | 2012-03-21 | 东莞生益电子有限公司 | Assistant plate bar of vertical plating line and method for vertical electroplating of PCB plate |
| CN102747400A (en) * | 2012-07-06 | 2012-10-24 | 新疆西部宏远电子有限公司 | Uniform-current-density electrode foil formation method and uneven mesh type insulation board |
| JP2015086444A (en) * | 2013-10-31 | 2015-05-07 | 凸版印刷株式会社 | Electrolytic plating apparatus |
| CN109496080A (en) * | 2018-10-08 | 2019-03-19 | 江苏长电科技股份有限公司 | A kind of circuit board plating process method |
| CN109496080B (en) * | 2018-10-08 | 2021-04-09 | 江苏长电科技股份有限公司 | Circuit board electroplating process method |
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