JPS6364351A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPS6364351A JPS6364351A JP20858586A JP20858586A JPS6364351A JP S6364351 A JPS6364351 A JP S6364351A JP 20858586 A JP20858586 A JP 20858586A JP 20858586 A JP20858586 A JP 20858586A JP S6364351 A JPS6364351 A JP S6364351A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- grooves
- resin
- projections
- molding resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 25
- 229920005989 resin Polymers 0.000 claims abstract description 25
- 239000004065 semiconductor Substances 0.000 claims abstract description 11
- 238000007789 sealing Methods 0.000 claims abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 7
- 230000001154 acute effect Effects 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 3
- 238000005219 brazing Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 10
- 238000004873 anchoring Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 2
- 210000003371 toe Anatomy 0.000 description 2
- 241000282326 Felis catus Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の１．１的〕
（産業上の利用分野）
本発明はリードフレームに係り、特にモールド樹脂で封
止される半導体装置に好適なリードル−ムに関する。DETAILED DESCRIPTION OF THE INVENTION [Object 1.1 of the invention] (Field of industrial application) The present invention relates to a lead frame, and particularly to a lead frame suitable for a semiconductor device sealed with a molding resin.
（従来の技術）
第５図は従来の半導体装置を示したもので、リードフレ
ーム１，１と半導体素子２とをボンデイングワイ１７３
で接続し、この半導体素子２の接続部分をモールド樹脂
４で封止して構成されている。(Prior Art) FIG. 5 shows a conventional semiconductor device, in which lead frames 1 and 1 and a semiconductor element 2 are connected by a bonding wire 173.
The connecting portion of the semiconductor element 2 is sealed with a mold resin 4.
一般に、樹脂と金属との密着性はあまり強いしのではな
く、通常、金型との離型性を向上させるため、モールド
樹脂には、離型剤が混入されていることから、樹脂と金
属との密着力はざらに低下することとなる。In general, the adhesion between resin and metal is not very strong, and molding resin usually contains a mold release agent to improve the mold releasability. The adhesion force with the material will be reduced considerably.
そのため、モールド樹脂とリードフレームとの密着性を
向上させるため、従来、第５図および第６図に示すよう
に、リードフレーム１のモールド樹脂４による封止部分
に、断面形状長方形の満５を複数形成して、リードフレ
ーム１の投錨効果を高めるようにしている。Therefore, in order to improve the adhesion between the mold resin and the lead frame, as shown in FIG. 5 and FIG. A plurality of lead frames 1 are formed to enhance the anchoring effect of the lead frame 1.
また、上記リードフレーム１の満５を、第７図に示づよ
うに、断面形状台形状に形成したものも用いられている
。Further, a structure in which the lead frame 1 is formed into a trapezoidal cross-section as shown in FIG. 7 is also used.
（発明が解決しようとする問題点）
しかし、上記いずれの溝形状によっても、」−分な投錨
効果を得ることができず、モールド樹脂４とリードフレ
ーム１との１１止端部が開いてしまい密着性を向上させ
ること１よできなかった。(Problem to be Solved by the Invention) However, with any of the above groove shapes, it is not possible to obtain a sufficient anchoring effect, and the toes of the molded resin 4 and the lead frame 1 open. It was not possible to improve adhesion.
本発明は上記した点に鑑みてなされた乙ので、モールド
樹脂に対する投錨効果を高め、モールド樹脂との密着性
を向上させることのできるリードフレームを１足供する
ことを目的とするものである。The present invention has been made in view of the above points, and an object of the present invention is to provide a pair of lead frames that can enhance the anchoring effect on the mold resin and improve the adhesion with the mold resin.
（問題点を解決するための手段）
上記目的を達成するため本発明に係るリードフレームは
、半導体索子にボンディングワイＡ７で１ａ続され、こ
の半導体素子接続部分をモールド樹脂で封止して固定さ
れるリードフレームにＪ７いて、上記モールド樹脂によ
る封止部分に、傾斜面を石する？Ｕ数の突起または溝を
形成して五号成されている。(Means for Solving the Problems) In order to achieve the above object, a lead frame according to the present invention is connected to a semiconductor cable with a bonding wire A7, and the semiconductor element connecting portion is sealed and fixed with a mold resin. J7 is attached to the lead frame to be used, and the sloped surface is formed on the part sealed with the mold resin. It is formed by forming U number of protrusions or grooves.
（作 用）
本発明によれば、上記突起または溝を、リードフレーム
の軸線に対して鋭角に傾斜するように形成したごとによ
り、１・２錨効宋が呂しく向１し、その結果、リードフ
レームとモールド樹脂との密着性を高めることができる
。(Function) According to the present invention, by forming the protrusions or grooves so as to be inclined at an acute angle with respect to the axis of the lead frame, the 1/2 anchor effect is effectively improved, and as a result, Adhesion between the lead frame and mold resin can be improved.
（実施例）
以下、本発明の実施例を第１図乃至第１図を参照し、第
５図乃至第７図と同一部分には同−符＞３を付して説明
する。(Example) Hereinafter, an example of the present invention will be described with reference to FIGS. 1 to 1, and the same parts as in FIGS. 5 to 7 are marked with the same symbol ">3".
第１図は本発明の一実施例を示し／Ｃらので、リードフ
レーム１のモールド樹脂４封止部分にｔよ、リードフレ
ーム１の＠線に対して同一ノノ向に鋭角的に傾斜する？
！２数の突起６・・・が形成されて−いる。FIG. 1 shows an embodiment of the present invention. Therefore, the molded resin 4 sealing portion of the lead frame 1 is inclined at an acute angle in the same direction with respect to the @ line of the lead frame 1.
! Two protrusions 6... are formed.
この突起６・・・は、その形状の突起部材をリードフレ
ーム１に、溶接またはろうト」（）等で固着づ−ること
により形成される。The protrusions 6 are formed by fixing a protrusion member having the shape to the lead frame 1 by welding or soldering.
また、第２図１５よび第１４は本発明の他の実施例を示
したもので、第２図はリードフレーム１に、同一方向に
傾斜する複枚の溝５・・・を形成９るようにしたもので
ある。そして、第３図はリードフレーム１に、外方に拡
がる断面逆台形状のｉｈの突起６・・・を形成するよう
にしたものである。15 and 14 show other embodiments of the present invention, in which a plurality of grooves 5 inclined in the same direction are formed in the lead frame 1. This is what I did. FIG. 3 shows a lead frame 1 formed with protrusions 6 . . . having an inverted trapezoidal cross section extending outward.
上記第３図に示すリードフレーム１の突起６は、トン第
１図に示すリードフレーム１どｆｉ’ｉｌ ｌ＆に、逆
台形状の突起部材を溶接あるいはろう匈けにより固着す
ることにより形成することができ、第２図に示１リード
フレーム１のｉＭ ５は、溝形成用の刃を傾斜さゼーＣ
用いることにより容易に形成することができる。ざらに
、上記第１図および第３図のリードフレーム１は、上記
第６図に示す従来のリードフレーム１のｉＭ ５を、斜
め方向からポンチで叩くことによってｂ形成することが
できる。The protrusion 6 of the lead frame 1 shown in FIG. 3 above may be formed by fixing an inverted trapezoidal protrusion member to the lead frame 1 shown in FIG. 1 by welding or soldering. The iM 5 of the lead frame 1 shown in Fig. 2 has an inclined blade for groove formation.
It can be easily formed by using. Roughly speaking, the lead frame 1 shown in FIGS. 1 and 3 can be formed by hitting the iM 5 of the conventional lead frame 1 shown in FIG. 6 from an oblique direction with a punch.
上記実施例に３３いては、リードフレーム１に突起６あ
るいは満５を形成したいずれの場合であっても、突起６
あるいは：：？ｒ ５が傾斜面をイｉしているため、リ
ードフレーム］のモールド樹脂４に対する投錨効果が向
上する。In the above embodiment 33, regardless of whether the lead frame 1 is formed with the protrusions 6 or 5, the protrusions 6
or::? Since r 5 has an inclined surface, the anchoring effect of the lead frame on the mold resin 4 is improved.
この投錨効果が低い場合、第１１図に示づように、モー
ルド樹脂４のリードフレーム１村止端部に開きが生じて
しまう。If this anchoring effect is low, as shown in FIG. 11, an opening will occur at the toe of one village of the lead frame of the molded resin 4.
この聞き部分の幅ト」法をＸ、長さ＝１法をｙとした場
合、従来のリードフレームＪ３よび本実施例のリードフ
レームの測定結果を下表に示づ。Assuming that the width of this listening portion is defined as X, and the length = 1 is defined as y, the measurement results for the conventional lead frame J3 and the lead frame of this example are shown in the table below.
これによれば、本実施例においては、投！′ＩＩｌ効宋
が向トし、先端部におりる密着性が高まったことがわか
る。According to this, in this embodiment, throw! It can be seen that the 'IIl effect has improved and the adhesion at the tip has increased.
（発明の効果〕
以上述べたように本弁明に係るリードフレームは、その
軸線に対して傾斜づる而を行づる突起まＩこは猫を形成
づるようにしたので、モールド樹脂に対する投錨効果が
高まり、その結末、し−ルド樹脂との密６ ｔ’ｌが向
上する′、、＋７の効果を奏づる。(Effects of the Invention) As described above, the lead frame according to the present invention has a protrusion or cat that tilts with respect to its axis, so that the anchoring effect on the mold resin is enhanced. As a result, the density with the shielded resin is improved, resulting in an effect of +7.
第１図は本発明の一実施例を示ず縦断面図、第２図Ｊ３
よひ第３図は本発明のリードフレームの他の実施例を示
すそれぞれ側面図、第４図はリードフレームとモールド
樹脂との密着性を示す説明図、第５図は従来の半導体装
置の一部を示す縦断面図、第６図４３よび第７図は従来
のリードフレームを示１それぞれ側面図である。
１・・・リードフレーム、２・・・半導体素子、３・・
・ボンディングワイヤ、４・・・モールド樹脂、５・・
・溝、６・・・突起。
出願人代理人 仏 藤 −離
乳 Ｉ Ｚ
６２ 図
も３ 図Fig. 1 is a vertical cross-sectional view, not showing an embodiment of the present invention, Fig. 2 is a longitudinal cross-sectional view, and Fig. 2 J3
Fig. 3 is a side view showing another embodiment of the lead frame of the present invention, Fig. 4 is an explanatory view showing the adhesion between the lead frame and the molding resin, and Fig. 5 is a side view of a conventional semiconductor device. FIGS. 6 and 7 are side views of a conventional lead frame. 1...Lead frame, 2...Semiconductor element, 3...
・Bonding wire, 4...Mold resin, 5...
・Groove, 6...protrusion. Applicant's representative Fuji Fuji - Weaning IZ 62 Figure also Figure 3
Claims (1)
体素子接続部分をモールド樹脂で封止して固定されるリ
ードフレームにおいて、上記モールド樹脂による封止部
分に、傾斜面を有する複数の突起または溝を形成したこ
とを特徴とするリードフレーム。In a lead frame that is connected to a semiconductor element with a bonding wire and fixed by sealing the semiconductor element connection part with a mold resin, a plurality of protrusions or grooves having an inclined surface are formed in the part sealed by the mold resin. A lead frame characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20858586A JPS6364351A (en) | 1986-09-04 | 1986-09-04 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20858586A JPS6364351A (en) | 1986-09-04 | 1986-09-04 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6364351A true JPS6364351A (en) | 1988-03-22 |
Family
ID=16558624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20858586A Pending JPS6364351A (en) | 1986-09-04 | 1986-09-04 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6364351A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04124864A (en) * | 1990-09-14 | 1992-04-24 | Matsushita Electric Works Ltd | Lead frame |
| WO1995024732A1 (en) * | 1994-03-09 | 1995-09-14 | National Semiconductor Corporation | A molded lead frame and method of making same |
| WO1999000826A3 (en) * | 1997-06-27 | 1999-05-27 | Matsushita Electronics Corp | Resin molded type semiconductor device and a method of manufacturing the same |
| US6861735B2 (en) | 1997-06-27 | 2005-03-01 | Matsushita Electric Industrial Co., Ltd. | Resin molded type semiconductor device and a method of manufacturing the same |
| WO2015012188A1 (en) * | 2013-07-24 | 2015-01-29 | 株式会社日立製作所 | Bonding structure and semiconductor device using same |
| JP2016058611A (en) * | 2014-09-11 | 2016-04-21 | 富士通セミコンダクター株式会社 | Manufacturing method of semiconductor device and semiconductor device |
| JP2018064051A (en) * | 2016-10-14 | 2018-04-19 | 株式会社トーキン | Electric double-layer capacitor |
| CN111448653A (en) * | 2017-12-13 | 2020-07-24 | 三菱电机株式会社 | Semiconductor device and power conversion device |
| WO2024135227A1 (en) * | 2022-12-19 | 2024-06-27 | 株式会社村田製作所 | Layered ceramic electronic component |
-
1986
- 1986-09-04 JP JP20858586A patent/JPS6364351A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04124864A (en) * | 1990-09-14 | 1992-04-24 | Matsushita Electric Works Ltd | Lead frame |
| WO1995024732A1 (en) * | 1994-03-09 | 1995-09-14 | National Semiconductor Corporation | A molded lead frame and method of making same |
| US5518684A (en) * | 1994-03-09 | 1996-05-21 | National Semiconductor Corporation | Method of making a molded lead frame |
| WO1999000826A3 (en) * | 1997-06-27 | 1999-05-27 | Matsushita Electronics Corp | Resin molded type semiconductor device and a method of manufacturing the same |
| US6861735B2 (en) | 1997-06-27 | 2005-03-01 | Matsushita Electric Industrial Co., Ltd. | Resin molded type semiconductor device and a method of manufacturing the same |
| US6900524B1 (en) | 1997-06-27 | 2005-05-31 | Matsushita Electric Industrial Co., Ltd. | Resin molded semiconductor device on a lead frame and method of manufacturing the same |
| US7538416B2 (en) | 1997-06-27 | 2009-05-26 | Panasonic Corporation | Resin molded type semiconductor device and a method of manufacturing the same |
| WO2015012188A1 (en) * | 2013-07-24 | 2015-01-29 | 株式会社日立製作所 | Bonding structure and semiconductor device using same |
| JP2016058611A (en) * | 2014-09-11 | 2016-04-21 | 富士通セミコンダクター株式会社 | Manufacturing method of semiconductor device and semiconductor device |
| JP2018064051A (en) * | 2016-10-14 | 2018-04-19 | 株式会社トーキン | Electric double-layer capacitor |
| US10566146B2 (en) | 2016-10-14 | 2020-02-18 | Tokin Corporation | Electric double-layer capacitor including a terminal having a protruding portion in an exterior body thereof |
| CN111448653A (en) * | 2017-12-13 | 2020-07-24 | 三菱电机株式会社 | Semiconductor device and power conversion device |
| CN111448653B (en) * | 2017-12-13 | 2024-05-24 | 三菱电机株式会社 | Semiconductor device and power conversion device |
| WO2024135227A1 (en) * | 2022-12-19 | 2024-06-27 | 株式会社村田製作所 | Layered ceramic electronic component |
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