JPS6363115A - Thin film magnetic head - Google Patents

Abstract

PURPOSE:To increase the adhesive strength between Cu and insulating layer and to prevent the diffusion of Cu to the insulating layer while temp. is high by providing films consisting of one or >=2 kinds of an Mo film, Ta film, Zr film or W film to one or both faces of a coil film. CONSTITUTION:This magnetic head is formed by providing the films of one or >=2 kinds of the Mo film, Ta film, Zr film or W film on one or both faces of the coil film 5 consisting of Cu. The Mo film, Ta film, Zr film and W film to be provided are thermally stable and prevent such a trouble of the diffusion of Cu into the Zr film, Mo film, etc., and deposition between said films and the insulating layer at the time of a heating treatment. The Mo film, Ta film and Zr film have the high adhesive strength to an SiO2 layer which itself is the insulating layer 3 and there is no need for providing another specific adhesive layer to the SiO2 layer. However, the adhesive strength to the insulating layer 3 in the case of the W film is relatively low; therefore, the formation of the thermally stable conductive coil is permitted by interposing the thermally stable adhesive layer of Ti, Mo, Ta, Zr, etc.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to the structure of a thin film magnetic head, and in particular to a structure suitable for high-density recording in which a conductive coil that is microfabricated and thermally stable can be formed. This invention relates to a thin film magnetic head.

Prior Art In recent years, in response to the demands for diversification and higher density of information, magnetic helads that store magnetization on disks and tapes have become smaller, have narrower trunks, and have narrower gaps.

The number of elements is increasing significantly. As an example of such a magnetic head, an insulating layer is provided between a base magnetic core made of a magnetic substrate or a magnetic or non-magnetic substrate coated with a soft magnetic thin film, and a soft magnetic thin film covered with the base magnetic core. ,
In recent years, thin-film magnetic heads formed by sandwiching a conductive coil film made of Cu or the like have achieved the narrower tracks, narrower gaps, and multi-layered magnetic heads compared to magnetic heads manufactured by processing soft magnetic bulk materials. Because it is easy to form elements, it is considered important as a head for high-density recording.

In the above-mentioned i-film magnetic head, in order to achieve even higher density recording, in addition to the above-mentioned narrower trunk, narrower gap, and multi-element structure, higher efficiency is required through multi-turn conductor coils. , there is a need to reduce the space in which the conductor coil is placed. Further, even in magnetic heads with a small number of tracks, microfabrication of conductor coils is required due to the demand for multi-turn magnetic heads.

When carrying out microfabrication of such conductive coils, conventional wet etching and electrodeposition methods cannot be used due to their precision, so dry etching methods such as ion milling are generally employed.

Problems with the conventional technology However, when processing a conductive coil using the ion milling method as described above, the conductive material constituting the coil has a tendency to generate electricity when the coil is energized during the recording operation of the thin film magnetic head. It goes without saying that it is necessary to select a material with low electrical resistivity in order to minimize the gel heat generated by the etching process and to prevent wire breakage due to heat generation. It is necessary that there be. Cu film is used as a semiconductor material that satisfies these conditions, but
The Cu film has a drawback in that it has low adhesion strength to SiO2, which serves as an insulating layer used to electrically insulate the coil.

Conventionally, in order to eliminate such drawbacks, Cu1l and S
A Ti film is sandwiched between the 10271 and 10271 to improve adhesion strength. However, in order to improve the reliability of the f# film magnetic head, when trying to improve the characteristics by using a glass mold for the protective film or using FeAl5i alloy for the soft magnetic thin film as the core material, During the manufacturing process, the III! magnetic head is heated due to heat treatment, etc.
Cu is heated to a high temperature of 00 to 600°C, and in the structure using Tl1l as the adhesive layer as described above, Cu
It has the disadvantage that it diffuses through ilii and precipitates between the Tl film and the 5i02 layer, reducing the adhesion strength of the coil layer.

Purpose of the Invention The present invention aims to solve the problems in the structure of the conventional thin film magnetic head as described above. The superiority of the coil layer and the 5i02 insulating layer → thermally stable i with no Cu precipitation etc. in the close contact area
An object of the present invention is to provide a structure for a film magnetic head.

Structure of the Invention In order to achieve the above object, the main means employed by the present invention is to provide a base magnetic core made of a magnetic substrate or a magnetic or rhinomagnetic substrate coated with a soft magnetic i-film; In a thin film magnetic head in which a coil film made of Cu is sandwiched between a soft magnetic material *m covered with a base magnetic core and an insulating layer interposed therebetween, one or both sides of the coil film are coated with MoI1% Ta1ll, Z. This is a thin film magnetic head in which one or more films of R film or WIN are provided along the film.

Effect of the Invention The Mo film, Ta1li, Zr film, and W film provided along one or both sides of the coil film made of Cu are thermally stable, and Cu becomes Z+45 during heat treatment! This eliminates the inconvenience of diffusion into the interior of the Mo film or the like and precipitation between the insulating layer and the like.

In addition, the Mo film, Ta film, and 2r film themselves have strong adhesion strength to 5I02N, which is an insulating layer.
However, in the case of a W film, since the adhesion strength with the insulating layer is relatively weak, the Ti,
By interposing a thermally stable adhesive layer of Mo, Ta, Zr, etc., it is possible to form a thermally stable conductor coil.

EMBODIMENT OF THE INVENTION Next, embodiments embodying the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention. Here is Figure 1+a1. (bl and tc+ are explanatory diagrams showing the manufacturing process of a thin film magnetic head according to an embodiment of the present invention, respectively.The following embodiments are only specific examples of the present invention, and the technology of the present invention It is not in the nature of limiting the scope.

FIG. 1 (C1 shows a cross-sectional structure of a thin film magnetic head according to an embodiment of the present invention. 1 is a substrate made of ferrite, alumina, or glass plate with excellent wear resistance, and a base plate is placed on the substrate 1. A magnetic core 2 is formed in a layered manner. This base magnetic core 2 is made of a magnetic substrate or a magnetic or non-magnetic substrate coated with a soft magnetic thin film. Examples of the soft magnetic film material include F.
eAj! Examples include St alloy, Nl alloy, gold, and Co-based amorphous alloy.

The base magnetic core 2 has a soft magnetic groove 1! ! ! 9 is placed over the soft magnetic groove 1119 and the base magnetic core 2.
A coil Fi5 made of Cu is sandwiched through the colored line N3.8, and M is provided on the upper and lower surfaces of the coil film 5, respectively.
oHL Ta1L Zr film Ift,
Alternatively, diffusion prevention films 4 and 6, which are laminated with these and a W film, are extended to prevent the Cu material of the coil film 5 from diffusing in a high-temperature atmosphere.

Next, the manufacturing procedure of the thin film magnetic head shown in FIG. 1(c) will be explained with reference to FIGS. 1(al to IcI).

As shown in FIG. 1 (5), a base magnetic core 2 made of a soft magnetic thin film such as FeAnt+ alloy, NiFe alloy, or Co-based amorphous alloy is mounted on a substrate 1 made of ferrite, alumina, or glass material with excellent wear resistance. Laminated by sputtering method. Furthermore, an insulating layer 3 made of SiO□ is deposited on the base magnetic core 2 by P-CVD or sputtering. At the same time, a diffusion prevention film 114 made of a Mo film and a coil film 5 made of Cu are formed using an electron beam evaporation method or the like. A diffusion prevention film 6 made of Mo is sequentially laminated on the insulating layer 3.

The coil film 5 is set to have a thickness in the range of 0.5 μm to 5.0 μm, and in this example, is set to 1.5 μm, for example. For the diffusion prevention films 4 and 6, it is sufficient to have a thickness of 200 Å or more from the viewpoint of their diffusion prevention function; on the other hand, if they are too thick, processing problems will occur, so they are usually set to 2000 Å or less. In this example, there are 500 people.

A photoresist film 7 is further formed on the diffusion prevention film 6, which is the uppermost film of the stack as shown in FIG. 1(a).

After etching this photoresist film 7 into a desired pattern, the above-mentioned diffusion prevention FJ6.
When the coil film 5 and the diffusion prevention film 4 are etched at the same time, a coil pattern covered with a photoresist film 7 as shown in FIG. 1 is formed.

In this case, as the photoresist film 7, for example, AZ1
By using 350J and appropriately setting the ion milling conditions, the etching rate ratio between the coil film 5 and the photoresist film 7 can be set to 3 or more. Therefore, even considering the milling time for a diffusion prevention film made of Mo, for example, it is sufficient that the photoresist film 7 has a thickness of about 2 μm, and with this thickness, a resist pattern can be formed with high precision. can do.

Next, after removing the photoresist film 7 shown in FIG. 1 (bl), FeAj!St alloy, NiFe alloy, or C
Soft magnetic groove 1 of o-based amorphous alloy, etc. By laminating I9 by sputtering or the like, the thin film magnetic head shown in FIG. 1fc) can be obtained.

In this example, Mo was used as the material for the diffusion prevention film 4.6, but in the thin film magnetic head obtained in this way, even after heat treatment at 600°C for 3 hours, the coil film 4.6
(u passes through the above-mentioned diffusion prevention film 4 or 6 to the insulating layer 3.8)
Therefore, the adhesion strength of the coil film 5 to the insulating layer 3.8 does not decrease. For example, 450kgf/cII! Since the above adhesion strength is exhibited, it is possible to obtain a four-electric coil structure of a thin film magnetic head that is thermally stable and allows fine processing.

In addition to the above-mentioned Mo film, the materials of the diffusion prevention film 4.6 include TayI, Zr1Q, and wIl! Regardless of which of these materials is used, it is expected that the effect of compensating for the lack of adhesion strength between the coil film and the insulating layer in the present invention and the effect of ensuring the above adhesion by preventing Cu from diffusing due to heat treatment etc. can.

However, for T a [9 and Zr1l, the above Mo
The adhesion strength of the Membrane-like 3102 layer is 450krf/aj or more, which itself has sufficient adhesion strength, but in the case of the W film, the adhesion strength with the 5i02 layer is slightly lower.
In addition, it is desirable to provide a layer for improving adhesion such as the above-mentioned Ti layer, Mo layer, TaJii, and Zr1i in parallel.

Effects of the Invention As described above, the present invention provides a magnetic base magnetic core made of a magnetic substrate or a magnetic or non-magnetic substrate coated with a soft magnetic thin film, and a soft magnetic WI# film covered with this base magnetic core. In the ii* magnetic head in which a coil film made of Cu is sandwiched between an insulating layer, MoI! is applied to one or both sides of the coil film. l! , Ta1LZr film or wB
Since this is a thin film magnetic head characterized by having one of the following or a film of 2fi or more along the film, the adhesion strength between the Cu and the insulating layer is high, and at high temperatures, Cu does not diffuse into the insulating layer. This is a thermally stable IE film that prevents the problem of reduced adhesion strength due to Cu precipitation between the adhesion layer and the insulating layer, and does not reduce the adhesion strength of the coil film even after various heat treatments. A magnetic head can be obtained.

[Brief explanation of drawings]

FIG. 1 (al, bl, (C1) are explanatory diagrams each showing the manufacturing process of a thin film magnetic head according to an embodiment of the present invention. (Explanation of symbols) 1...Substrate 2...Base magnetism core 3.8
...Insulating layer 4.6...Diffusion prevention film 5...Coil 11! ? ...Photoresist film.

Claims (1)

[Claims] A coil film made of Cu is sandwiched between a base magnetic core made of a magnetic substrate or a magnetic or non-magnetic substrate coated with a soft magnetic thin film, and a soft magnetic thin film covered with the base magnetic core, with an insulating layer interposed therebetween. A thin film magnetic head comprising a thin film magnetic head, characterized in that one or more films of a Mo film, a Ta film, a Zr film, or a W film are provided on one or both sides of the coil film. head.