JPS6362663A - Precise finishing method with grinding wheel overlapped with supersonic and low frequency vibration - Google Patents

Abstract

PURPOSE:To reduce the average grinding temperature rise and to reduce the grinding force remarkably, by fixing a large grinding wheel having diameter D to the tip of a rotary spindle having diameter of (d), where D>>d, and employing such shape as will cause resonance with the inherent vibration of a longitudinal supersonic wave vibration chip fixed to the tail section of said rotary spindle. CONSTITUTION:When the inherent frequency of a longitudinal supersonic vibration chip 32 is 20kHz, there are relations between the diameter and the width of a grinding wheel 1 and the diameter and the length of the spindle. If the diameter of the spindle 31 is 50mm, for example, its length is 260mm for single wavelength while the diameter and the width of the grinding wheel are 165mm and 10mm, respectively. When such shape and dimensions are employed, the grinding wheel 1 can be vibrated radially with supersonic frequency while simultaneously vibrated in the direction of the thickness with supersonic frequency. Consequently, the grinding wheel 1 vibrates radially with supersonic frequency (f) and amplitude (ar) 17 and axially with supersonic frequency (f) and amplitude (as) 18. Said grinding wheel 1 is rotated in the direction of an arrow 3 with a grinding speed V so as to cut (t) into a work 2 thus grinding the work 2 with a feeding speed (v).

Description

Detailed Description of the Invention (Field of Application in Industry-1-) The present invention applies ultrasonic vibration to a grinding wheel that can easily grind rubber, ceramics, etc. that are difficult to grind with conventional grinding methods. This article relates to a composite finishing method in which grinding is performed by superimposing low-frequency vibrations.

(Prior art) In order to perform precision machining 1- with a cutting/grinding tool, it is necessary to process it 31 times + lta by a method that reduces the force applied to the workpiece as much as possible. For example, cutting by rotating a milling cutter at high speed reduces the cutting force.

By grinding by rotating at high speed a grinding wheel with countless abrasive grains distributed on a rotating disk (4-), the cutting depth per abrasive grain becomes even smaller and the force acting on the crop is reduced. This drastically reduced the amount of soil used, and precision field soil began to be used. However, on the other hand, about 2
000m/min for high-speed grinding
It is already well known that the grinding fluid of h(-1, A4 JS and grinding wheel must be cooled d1.1 degrees) increases significantly.As the grinding wheel IT rotates at high speed, Despite this severe heat generation phenomenon, the current situation is that grinding using a grinding wheel is widely used because the effect of drastically reducing the force acting on -11 crops is enormous. Conventional workpieces are mainly made of metal, and even if they generate heat, they have good heat transfer efficiency and a good cooling 1+μ effect, making precision grinding possible by using a large amount of an appropriate grinding fluid.

(Problem to be solved by the invention) However, today, new paper formats have been developed regardless of precision processing theory and technology, and some of them include rubber,
It contains many materials that have poor heat transfer efficiency, such as FRP and ceramics. These materials are also required to have extremely high machining accuracy.

In order to meet these expectations for precision machining, there is a need for a grinding method that can further reduce the average grinding temperature rise and sharply reduce the grinding force. There is a problem in that there is no common precision grinding method for soft and sticky materials such as rubber, hard and brittle materials such as metals and ceramics. The purpose of this machine is to reduce the increase in grinding humidity, further reduce the grinding force, and perform precision grinding on any material with a two-strip feature. A grinding wheel ultrasonic vibration system is constructed by installing a large grinding wheel with a wheel diameter D>) cl, and its shape is attached to the tail of the rotating main shaft. °
The shape is designed to resonate with the natural frequency of the one-wave vibration r-, and the grinding surface of the grinding wheel has the same frequency in the radial direction of the center of the grinding wheel and the grinding wheel 11.
It is characterized by grinding by rotating one wheel and generating pulsed grinding waveforms to generate extremely fine chips without applying complex ultrasonic vibrations in the L-axis direction.

(Example) Hereinafter, a detailed description will be given based on five examples shown in the drawings. Figure 1 shows the grinding mechanism and grinding force waveform in the conventional grinding method. One abrasive grain in the grinding wheel is indicated by diagonal lines in the grinding mechanism when the grinding wheel 1 rotates at high speed in the direction of arrow; Cut area ABC. , the abrasive grains rotate at high speed, so even if the cutting depth of the grinding wheel is t, the abrasive grains
Appearance of the blade's second incision g. becomes extremely small.

The waveform of the grinding force at this time changes periodically due to the high-speed rotation of the abrasive grains distributed at intervals on the cylindrical surface and the elastic vibration of the abrasive grains, and when this is modeled and expressed, the principal force component is shown in Figure 4. Both PC1 thrust force Pj, P mean 10 psi
It is expressed in the form of nω. If the resiliency constant of the workpiece in the direction of the thrust force is , and the angular natural frequency is ω□, then grinding is generally performed with the relationship ω7t<ω. The amount of elastic displacement of the workpiece in the direction of the thrust force, or
-m-. In order to improve machining accuracy, it becomes necessary to reduce this displacement jtx. For this purpose, it is necessary to reduce the force pressing the grinding wheel against the workpiece. That is, it is necessary to reduce the P mean value to improve the sharpness.

Now, the inventor has developed a grinding wheel so far that the direction of grinding is
The grinding wheel in FIG. 2 is indicated by arrow f of 5.

The grinding speed is increased by ultrasonic torsional vibration in the direction of El to 2π.
We have invented a method of vibration grinding at an af grinding speed. With this method, the grinding force waveform becomes a pulsed grinding force waveform 6 as shown in the figure, and if the absolute value of the pulsed grinding force is I]',
The displacement x in the direction of the thrust force is xturbostratic, ,fl-. Here, 0 is the net grinding time in the vibration cycle of the grinding wheel, and I is the vibration period. At this time, 1? Due to the effect of reducing the friction resistance and the shortening of the working time, the apparent depth of cut becomes shallower, so that I-1'<I) 1, that is, the grinding force P I at the grinding wheel contact surface also decreases, - The displacement X of the workpiece in the direction of the back force, which is related to accuracy, is J' in the conventional grinding method.
; compared to the displacement at the same grinding speed tOI l .

Furthermore, as shown in Figure 3, a low vibration of 1·゛<f is superimposed in the direction of arrow 7! j, Eh, when grinding at a grinding speed V<2πAF, the grinding force waveform is an intermittent pulse cutting force waveform 8
and acts on the workpiece.

1l-(Due to the combined effect of the insensitive vibration cutting mechanism and zero-level instantaneous vibration cutting, the grinding force P" on the grinding wheel contact surface is reduced and processed) - The back of the workpiece related to accuracy The displacement X in the component force direction is further reduced compared to the case of continuous pulse grinding force, and precision grinding 1' becomes 11". However, at this time, the grinding speed (2) is low, so 2000 m/
Me τ when the grinding speed is min. If an attempt is made to grind the workpiece by making it equal to , the workpiece feed rate (9) becomes slow, resulting in a drawback that the grinding efficiency is reduced.

Therefore, we considered a grinding method that takes advantage of the features described in -1- and does not lower the grinding efficiency.

As shown in Fig. 4, fine pitch <1. −
Regular fine grooves 11 with the height of C11+ as Rmax
1 is formed, and the workpiece is fed at the feed rate shown in Fig. 1 using a grinding wheel of 3, which rotates simultaneously at high speed with a cutting depth of t<Rmax.
Cut and grind. By doing this, the pulse cutting force waveform that is ideal in mechanical processing such as grinding as shown in No. 4190 can be generated and heat generated without slowing down the feed speed of the workpiece using a high-speed rotating grinding wheel. 3. You will be able to grind more efficiently with less
As shown in Figure 2, the cutting depth is t>Rma)t, and the grinding wheel is -1
- When grinding the curve AC on the grinding surface that comes into contact with the crop as a smooth circular arc, the condition of vibrating the grinding wheel in the grinding direction is V<2πt+1'! j
In order to generate a pulsed cutting force waveform by grinding at a low speed, a fine groove 111 is formed, and a grinding wheel 1 rotating at high speed near the top of the groove 111 is used to reduce g(,) and grind it. However, a feature of the present invention is a method of precision grinding by generating a pulsed cutting force waveform as a grinding mechanism that finely shreds chips.

Next, we will explain in detail how to continuously generate this fine unevenness groove shape on the grinding surface.

FIG. 5 is a diagram without showing the grinding area per abrasive blade in conventional grinding. Circumference of grinding wheel 1 1 abrasive grain 11
The tip of the abrasive grain 1 rotates on an approximate arc ΔB, and the abrasive grain 12 located next to the abrasive grain 1'' rotates on an approximate arc AC. Then, the partially formed abrasive grains 12 corresponding to the black area ABC are ground to generate chips. At this time, t;. is the door. <
It is L.

Figure 6 is a model of the distribution of abrasive grains on the grinding surface of the grinding wheel, and is a view of the grinding surface viewed from the side. A straight line that passes through
It is a diagram in which groups of abrasive grains distributed at equal intervals are dotted on - and straight lines including abrasive grains 12 located at the next point. The abrasive grains in the abrasive grain group are respectively 1.3 and 1.4. Abrasive grain] Motion trajectory of 4
When viewed from the production method, its locus becomes a straight line abc.

The area ABC-1-5 in FIG. 7 shows a model of the grinding area at that time. FIG. 8 shows the cutting force waveform 16 of the abrasive grain 12 grinding the area 15, and the maximum grinding force is generated at three points and is P5 kg.

Consider dividing this surface f-15 into small pieces without reducing the grinding speed of the grindstone to generate a pulse-like grinding force. The only concrete way to accomplish this is to cut the chips into extremely small pieces.

One way is to achieve grinding by ultrasonically vibrating a grinding wheel that rotates at high speed in the radial direction. That is, as shown in FIG. 9, the arrow 17, which is the radial direction of the grinding wheel,
This is achieved by applying ultrasonic vibration in the direction of frequency f, amplitude a, and Y-, and then grinding at a grinding speed of 3. At this time, the motion locus of the abrasive grain 1 of the grinding wheel is the 11-row Genba interlocking locus 1-9, and the abrasive grain 2 is a sinusoidal motion locus 2o.
The intermittent black parts in between are the grinding area to be ground in one cycle of vibration.1 This grinding area is intermittent with a period of T-* seconds. In this way, the chips are cut into fine pieces, resulting in a pulsed grinding force waveform. FIG. 10 is a diagram showing the movement of the abrasive grains at this time viewed from above and modeled to correspond to FIG. 6. The depth of cut changes from moment to moment, cutting the chips into pieces before the intermittent grinding machine. This state is modeled and shown in Table A) using a dotted line ah c 22 %, which is a collection of fine dotted lines. The cutting depth of one abrasive grain changes from time to time from 0 to a certain value of tE+, and in order to grind this intermittently at certain intervals (-), the grinding force becomes pulsed 23 as shown in Fig. 11. . to;.

The grinding force shows the maximum value at the maximum point, and this is called l
)9kg (Assume that this Pg is l for IJ5)
:; > T) It becomes.

In contrast to the method of cutting chips by changing the depth of cut as described in 11, a method of cutting chips by dividing the cutting length into extremely fine sections can be considered. In this method, as shown in Figure 1-2, the grinding wheel is ultrasonically vibrated in the direction of the arrow 8, which is its axial direction, at a frequency f and an amplitude a9, and is ground at a grinding speed V3 to make a zigzag motion. It will come true this year.

At this time, the motion locus of the tip of the cutting edge of the abrasive grains 11 for the grindstone shows a sine wave curve 24 drawn by a solid line as shown in FIG. 10 and FIG. shows a sinusoidal curve 25 drawn with a dotted line. These two curves intersect. The shape of each abrasive grain is approximated and considered as a cone. By the abrasive grains 12 moving on another curve 25 without passing through the curve 24-1-, and crossing the curve 24, the uncut portion by the abrasive grains 11 is ground and then processed with the abrasive grains 11. It is a mechanism that cuts 19J Rikusu into pieces with the groove and grinds it. At this time, the cutting depth go changes continuously as shown in FIG. 5, and the difference from FIG. 5 is that the chip length is fine and is cut by 1'. By converting this state f into a delta, the =1 fragment in Figure 12 is the product: (T
, 32°333...

Therefore, the grinding force waveform has a pulse shape 26 as shown in Fig. 14.
The grinding force number shows the maximum value at point B. Letting this be P□2kgf, 1)□2 digits P7L becomes P,, > p□2. This reduction principle 111 shortens the cutting length and
11. 'i' In order to grind with 1 fll, the grinding force t is greater than P in the case of Fig. 9, in which cutting is performed intermittently over a relatively long cutting time by varying the cutting distance over a relatively long distance.
'lIY can be reduced. Based on this analysis, Figures 9 and 1 show how to reduce the grinding force.
Fig. 2 Grinding force θ1, f fJ:
Specifically, we devised a method for grinding by applying ultra-1' wave vibration to the grinding wheel both in the radial direction and in the axial direction. .

Figure 15 is a superimposition of Figures 9 and 12.
The motion locus of the abrasive grains 12 is modeled as shown in the figure. In Fig. 9, the abrasive grain II is the instep, the diameter is
2 draws a motion locus of a curve 20, and the cutting area therebetween is subdivided into extremely small area groups 27 by superimposing vibrations in the axial direction as shown in FIG. In this way, the chips are shredded into ultra-fine abrasive grains to form a pulsed grinding force waveform. The mechanism shown in Fig. 9 which grinds with a pulsed grinding force waveform by repeatedly increasing the depth of cut from zero to a certain value, and the mechanism shown in Fig. 12 which grinds with a pulsed grinding force waveform by cutting the chip length. A model diagram of the motion trajectory by the superimposed grinding mechanisms is a curve shown by dotted lines 28 and 29 as shown in FIG.

In this way, the abrasive grain 1] and the abrasive grain 2 are
1) The movement trajectories of each abrasive grain intersect more closely, shorten the chip length, and synergize the effect of changing the depth of cut from shallow to deep intermittently, increasing the length of the chip. It becomes an ideal grinding mechanism that grinds by finely dividing the depth of cut, and as shown in Fig. 17, the grinding force waveform is an ideal pulse cutting force waveform 30, and the grinding force is drastically reduced. l 7(I' + , (kt: I'
).

As described in 1-1 below, it is assumed that the abrasive grains are distributed regularly and equally spaced on the center circle t1?1 of the grinding wheel, and the shape of the abrasive grains is circular as considered in the conventional analysis of the grinding mechanism. Rust: Considered as a body, we will explain the details of the present invention by showing the mechanism that creates a pulsed grinding force waveform by intermittent and one-time interruption of l'JJ penetration depth and chip length using one abrasive grain. explained.

. Blade shape 4r9 of each abrasive grain JIY in actual grinding wheel
The grinding and distribution state is irregular and irregular, and by implementing the present invention, the grinding becomes more active (the abrasive grains are crushed and fallen off in II, and the tip shape becomes complex and is ground into an uneven surface. This miniaturization of the chip length by 1νj and the subdivision of the cutting depth result in an extremely fine division at +7.tl.

Description of abrasive grains 11. The movement was carried out using the abrasive grain movement trajectory of +2 and 2, but the white part group between the 27 groups of minute areas drawn in black in Figure 15 was ground by the abrasive grain A1)' following the abrasive grain 12. Since the grinding process is carried out by grinding, the grinding process of the predetermined depth of cut l can be carried out easily, and the grinding process can be processed to a smooth ground surface of 5+l.

In other words, it is possible to precisely grind ceramics, rubber, etc. by applying a pulsed grinding force waveform without generating heat.
.

Next, the main shaft vibration system of the grinding machine and the shape of the grinding wheel used in the present invention will be explained with reference to FIGS. 18, 19, and 20. FIG. 18 shows the vertical ultrasonic transducer 32 >', 'tilt
31 is a diagram showing a grinding machine top 1Illll, 1'9 and a grinding wheel vibration system, which are provided at the tail portion of the grinding wheel 1 and the grinding wheel 1 is provided at the tip thereof. The natural frequency of the vertical ultrasonic transducer 32 is 20 K Il
z, there is a series of relationships between the diameter of the grinding wheel and +j+, and the diameter and length of the main shaft, for example: i:, 1ll
If the diameter of ll131 is 50 mm, its height is 260 mm at one wave j4, and the diameter of the grinding wheel is 1.65 mm.
, the width is lomτI. By having such a shape and dimensions, when ultrasonic vibration is caused in the radial direction of the grinding wheel, ultrasonic vibration can also be caused in the thickness direction of the axial direction by 1° on the same day. The grinding wheel 1 can be attached to and removed from the main shaft 31 by using a threaded portion 33 or a tapered portion 35 provided on the grinding wheel as shown in FIGS. 1-9 and 20. In the case of screw connection, in addition to the screw 35, the fitting part: λ'Ik
Position it with Q and minimize the vibration of the outer circumference of the grinding wheel.

In addition, it is possible to provide a fitting part and connect it with the pin 1- of the bookmark. In the case of Taper adhesive, this is not necessary as the Taper part also serves as the positioning and removal part, but when attaching and detaching, make a hole in the center and screw the bolt into the socket [) provided on the end face of the main shaft. Tighten the screws and bring the Taber Shirawa 1'l'1 into close contact, and then place the grinding wheel 1 on the main shaft; 3I.

After installation, even if poles 1 to 1 are removed, the present invention can be carried out by causing sonic vibration in the grindstone. .

Next, the present invention 1 using this grinding wheel. , T, J: Explain various grinding methods. East face grinding force θ, 'i 2nd
This will be explained using Figure 1. Ultrasonic vibration in the direction of the ``IL diameter horn'' with 1-3 sonic frequency f and amplitude aT17! 1011.
, a grinding wheel that vibrates ultrasonically in the axial direction at an ultrasonic frequency of vibration and an amplitude of tI of 318 is rotated at a grinding speed of V in the direction of arrow; Surface grinding according to the present invention is carried out by applying the feed rate ① in the direction of the arrow 9 and grinding.

The cylindrical grinding method will be explained with reference to FIG. Ultrasonic vibration in the radial direction with ultrasonic frequency 'and amplitude a117!til
l L, axially ultrasonic frequency f and 4hli'I'
The grinding wheel 1, which vibrates ultrasonically at 61; Cylindrical grinding according to the invention is carried out by:

The internal grinding method will be explained with reference to FIG.

The target diameter of the grindstone can be reduced by increasing the natural frequency of the vertical ultrasonic vibrator. Therefore, the present invention can be easily applied to internal grinding of holes with small inner diameters. Ultrasonic vibration in the radial direction with an ultrasonic wave of 4I14 nit+number f and an amplitude aY-17, and an ultrasonic frequency f in the axial direction.
Then, rotate the abrasive iTI℃1 which vibrates ultrasonically with an amplitude as18 in the direction of arrow 3, - rotate the crop 2 in the direction of arrow 9 at rotational speed ■, and grind by giving cutting depth and feed rate 53 (3). Internal grinding according to the present invention is carried out in each case.The present invention can be carried out in the same manner for other processes such as thread grinding and south-center grinding.

The group of circumferentially curved abrasive grains of the grinding wheel according to the present invention refines the grinding length and narrows the cutting depth, and at the same time contacts the workpiece to perform grinding. Even in the Niatsuro end face abrasive grain group, the chip length is made finer and the IJ+inclusion depth is subdivided, which eliminates the generation of grinding heat and reduces the grinding force.
- Grinding Inno 1 A revolutionary precision grinding effect can be obtained by turning the grinding angle 1°.

In addition to the above, there are methods of grinding using the grinding wheel of the present invention, such as back surface grinding and tool grinding. Grinding workpieces with relatively small shapes that can be held in the hand, such as tools such as 1. Grinding workpieces with a relatively small shape that can be held in the hand.1.
Same +: II, , grinding lJθ, will be explained. Main shaft 34
Set in the tail of +1 no, W (chord θl/4J+J !I
+r to arrow the main axis; super '7'j in the direction of 37
Wave IJ+3 moves. The middle shape of the whetstone is taken on this axis.
When kissing, the grinding wheel generates a vertical ultrasonic wave 1b←l'lj's force (i4) 14 (t) - 14, and in the radial direction the amplitude ε
1Y, IJlhJ %, la5 in the axial direction so that it has a vibration state of ultrasonic vibration. .

[Arrow designed and manufactured in this way] 7. Rotate the grinding wheel 1 that vibrates ultrasonically in the direction of arrow 18 at a grinding speed ■ in the direction of arrow 3, and cut the carbide bi 1 on its side surface. A constant load P of crop 2 on a tool or ceramics, etc.
By pressing and grinding in the direction of the arrow 38, surface grinding of a small piece workpiece according to the present invention or pressurizing with a conventional bench grinder or the like is carried out.

Next, a second embodiment of a vibrating cylindrical grinder implementing the present invention will be described.
5 and 26 will be explained.

20 K IIZ vertical ultralongitudinal ultrasound - transducer 32 in the tail,
A diamond grindstone 1 having the shape shown in FIG. 18 is attached to the tip, and a main shaft 31 is formed.

Then, a sleeve 39 spanning two vibration nodes generated on the main shaft is inserted and fixed with silver soldering (J) at a predetermined vibration node position, and the sleeve is attached to two high-precision rolling bearings 40.
This allows the main shaft to rotate with less friction. 1
(2)) The lever bearing 40 is fixed in the housing 41 to constitute the axle stand 42 for the grinding machine. A pulley 43 is attached to the sleeve 39, and a slip ring 44 is attached to this pulley 43. Brush on slip ring 44
5 should be in contact with each other with minimal friction. The plush 45 and the output terminal of the ultrasonic oscillator 46 are connected.

The headstock 42 is equipped with a -f-phase induction electric motor (44
7 and transmit the rotational power to 1 using the belt 48.Then, rotate the main shaft Attach this headstock to the grinding machine flat υ table 4≦1 3. Attach the workpiece 2 to the chuck 50 of the grinding machine, support the other end with the center 51, and rotate it in the direction of arrow 9 at the rotational speed V. By sending the carriage 48 in the direction of the arrow 52 at a feed rate S, the amplitude ar-F8 μrn in the radial direction and ++ in the axial direction with the same ultrasonic frequency 1°
Precision vibrating cylindrical grinding is performed using a diamond electrodeposited grindstone that vibrates ultrasonically at +SF+0 μm. A feature of this machine is that it exhibits a revolutionary precision grinding effect that cannot be obtained with conventional grinding methods, especially on hard materials such as ceramics. The board will be explained with reference to FIG. 27. 20 K Hy, a headstock 53 for a vibrating surface grinder consisting of a vertical ultrasonic vibrator 32, a main shaft 31, and a grinding wheel 1 is fixed to a surface grinder column 54, and the upper shaft 31 is fixed to a bell 1. A slip ring 56 is attached to the main shaft, and an excitation voltage from the ultrasonic oscillator 46 is applied to the rotating vibrator via a plush 57. A cover 58 is attached to the vibrator 32 for safety.In this way, the grinding wheel 1 is given a radial amplitude ξlj of 8 μm at the same frequency f.
, the surface grinder table 5 was subjected to ultrasonic vibration with an axial amplitude as of 10 μIn and simultaneously rotated smoothly.
The workpiece 2 mounted on the top of the workpiece 9 can be subjected to heavy grinding, and the present invention can be carried out. Similar to the above-mentioned cylindrical grinding, this machine is characterized by its revolutionary precision i1/heavy grinding effect on hard and brittle materials such as ceramics, which cannot be obtained with conventional grinding methods. We have described a W-surface grinder that uses the circumferential surface of the grindstone as the surface to be used north of a certain 1 degree, but when surface grinding is performed using the end surface of the grindstone of the present invention as the surface to be used, it is necessary to machine one 1:, 1Illll. This is carried out using a 1b←1s1 surface grinder that stands upright in the normal direction of the surface of the object. Abrasive particles] The effect of the present invention is particularly remarkable in the case of surface grinding where the cutting length per blade is long. The cutting resistance is drastically reduced, heat generation on the grinding wheel surface is eliminated, and the life of the grinding wheel is extended.

Finally, the vibratory top grinding machine or vibrating wheel according to the invention.
The ni grinder will be explained in detail at the 281st point.

In the case of the above-mentioned vibrating cylindrical grinder, the 20KIk longitudinal ultrasonic vibrator 32 and the main +l
i+lI3] Fix the headstock 65 for tool grinding or <L upper grinder consisting of 1 year old and grindstone 1 to the collar 11 or mounting base 601-, and
Rotation 1 of a three-phase induction motor by Bell 1-61
! ! + Rotate using force. A slip ring 62 is attached to the main shaft, and an excitation voltage from the ultrasonic oscillator 46 is applied to the rotating vibrator via a plush 63. A cover 64 is attached to the vibrator 32 to ensure safety. The workpiece 2 is fixed to a table 67 on a jig body 66 using a tightening jig 68 so that its end face can be ground.

, in this way, the amplitude Fl in the radial direction at the same frequency f
y: 871 m, the crop 2 can be precisely ground by ultrasonic vibration in the axial direction with an amplitude as: 1107z and at the same time a pulsed grinding force waveform is applied by rotating at high speed. The feature of this machine is that it precisely grinds hard and brittle materials such as carbide tools and ceramics without generating heat (2 to 5 times more efficient than conventional grinding methods).

(Effects) Next, specific effects obtained by implementing the present invention will be explained. The present invention is characterized in that a particularly remarkable effect appears in the grinding process of ceramics and rubber. In other words, by carrying out the present invention, there will be no drooping, missing numbers, or cracks on the end surface of the machined surface, and the grinding of the comb will be less
The grinding surface does not bulge at the periphery and collapse in the center as seen when grinding, and the grinding surface is flat, eliminating chipping and cracking when grinding ceramics. The grinding surface of ceramics has no scratch eaves, and the depth of cracks is about 11 mm on the surface.By lapping, the cracks can be removed into the cylinder, allowing precision grinding without reducing product functionality5. The ground surface is smooth and the scale-like grinding surface that was seen on conventional grinding surfaces is eliminated, and its quality is improved. When grinding ceramics, the grinding table is lowered. The life of the grinding wheel is extended. 1. Grinding can be done according to the set depth of cut. 3. Grinding efficiency is improved. The above grinding effects can be obtained. .

Is it possible to grind one surface of IL shown in Figure 27? Yes, 20KH
Earmont grinding wheel #
6 (10 f = 20 KHz, ay: F8 μm
, aS: 10μ 1, ultrasonic vibration, grinding speed V = 1.500m/m, i n, 130X 1
The surface of a 30X 5 nun plate-shaped silicone Nylon I~Light was wet-surface-ground using a large amount of water-soluble grinding fluid at a cutting depth of 0.3 nyn and a feed rate of 1 m/min, and the grinding table was lowered to achieve conventional grinding. The grinding resistance has been drastically reduced to about 10 to 100 degrees, resulting in a uniformly smooth grinding surface across the entire surface, without chipping or cracking around the area, and extending the life of the grinding wheel. Succeeded in precision surface grinding.

In addition, in the vibrating wheel-1 grinder shown in Fig. 28, using a 20 KHz vertical ultrasonic vibrator for the diamond grinding wheel #200, f = 20 KHz, al-:
By holding a 5 mm square zirconia in your hand and grinding its surface with ultrasonic vibration at 8 μrn, 10 μm in ag, and a grinding speed of V = 800 m/mjn, there is no heat generation compared to the conventional grinding method that does not use vibration. It was discovered that the revolutionary effect of making the grinding table smaller was that it not only improved the sharpness but also improved the grinding efficiency by about 2 to 5 times. Then, the grinding surface is polished to
0.Successfully reduced the surface roughness to 4 μm.

[Brief explanation of drawings]

FIG. 1 is a model diagram for explaining a conventional grinding mechanism, FIG. 2 is a model diagram for explaining a vibration grinding mechanism, and FIG. 3 is a model diagram for explaining a superimposed vibration grinding mechanism. Fig. 4 is a model diagram illustrating a grinding mechanism that applies a pulsed cutting force waveform by grinding only the vicinity of the mouth of the peak ``i1'' of the uneven ridge-shaped surface, and Fig. 5 shows one grinding mechanism in a conventional grinding mechanism. Depth of cut g as the grinding area where the grain is ground
Figure 6 is a model diagram showing the motion trajectory of one abrasive grain at that time. Figure 7 is a model diagram showing the grinding area that one abrasive grain grinds in a conventional grinding mechanism.
The figure shows the grinding force waveform when one grinding wheel t and γ grinds in a conventional grinding mechanism. Fig. 10 is an explanatory diagram showing changes in the cutting area that the grains grind. Figure 11 is an explanatory diagram showing the change in the cutting area that is ground by one abrasive grain when the grinding force per abrasive grain changes with the change in the depth of cut. is a diagram showing that the motion trajectories of the abrasive grains intersect at that time, and the chip length is subdivided by 1F. Figure 14 shows that the chip length is subdivided, resulting in a pulsed grinding force waveform. ,
In addition, Fig. 15, a diagram showing that the maximum grinding force decreases, shows the result when radial vibration and axial vibration are combined and superimposed.
Figure 16 is an explanatory diagram showing the fine cutting area ground by two abrasive grains and its changes. Figure 16 is a diagram showing how each straight line is cut into dotted lines and the chip length becomes extremely fine by modeling this. , Fig. 17 shows that as the chip length becomes extremely fine, the period of the Hell's cutting force waveform, which is the interval between them, becomes even shorter, and the grinding force also increases! Figure 18 shows that the reduced grinding force is at its lowest when the natural frequency of the vibrator is 20 K.
Assuming IIZ, the width view and diameter and width dimensions of the main spindle and the grinding wheel to vibrate in the lower radial direction and in the axial direction at the same time as 't + 20 K fly. The diagram shown in Fig. 19 shows the grinding wheels tl (, il, facet) 1 and 2, which can be attached and detached from the iy 1lill+ by screw connection.
Figure 0 is a front view of a grinding wheel that is attached to and detached from the spindle using a Taber bath, Figure 21 is an explanatory diagram showing the qi surface grinding method according to the present invention, and Figure 22 is a circular grinding method according to the present invention. Explanatory diagram showing 7th: i l □;・lx surface, Figure 26 is a diagram of a grinding machine in which the present invention is put into practice. One embodiment side view 1, Figure 28 (J the present invention H2J
'j, An embodiment of a grinder with a width of 9 and a width of 1'
, axis and 1. The JL table is 1 side near 1 and 1 square. 1. Ultrasonic vibration Ill (stone; 3 Grinding speed 6.10. Pulse grinding force waveform 8... Intermittent pulse grinding force waveform 17... Radial direction ultrasonic vibration of grinding wheel 18... Axial direction sonic vibration of grinding wheel rnj : 30... Ultra-fine refinement 31 Grinding force 32 ・Super-1′ 1-wave vibration main shaft 733・IN 7″ 1-wave longitudinal oscillator; 34・Top coupling; Momme 5・Wa----pa coupling Surface 47...For ultrasonic vibration cylindrical grinder-1:, Axle head 51,
■Sonic wave generation 111 (machine 55, 11) Sonic wave 41. (for dynamic surface grinder) Mouth IQI
I stand (:0・A good sonic vibration-■, spindle stand for tool grinding machine 4
・、"f Applicant Jun Kumabe Figure 3 kg? Engraving of the drawing (no changes to the content) Figure 4: α Distributor Book Figure 19 Figure 20 Near 8 ・) ・ Mu f, a5 Of course r h ・ Procedural amendment December 8, 1988 Commissioner of the Patent Office Black 1) Akio Yu 1, Indication of the case 1985 Patent Application No. 208514 2, Name of the invention Superimposing ultrasonic vibration and low frequency vibration Precision finishing method using a grinding wheel 3, relationship with the case of the person making the amendment Patent applicant address: Minami Odori, Utsunomiya City, Tochigi Prefecture], -4-20 Chisun Mansion Room 701 Name: Jun Kumabe Part 4, Agent address: Port of Tokyo Fujishima Building 3M, 2-2-5 Shinbashi, Ward
5 Name (7,672) Patent attorney Sadao Ito
11 Telephone Tokyo (03) 50.4-2728~95
Katana-15, date of amendment order 6, January 25, 1985, power of attorney subject to amendment and drawing 7, contents of amendment. (2) Correct f'6 in Figures 1 to 4 of the drawings as shown in the attached sheet.
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Claims (1)

[Claims] A grinding wheel ultrasonic vibration system is constructed by attaching a large grinding wheel with a grinding wheel diameter D >> d to the tip of a rotating main shaft with a diameter d, and the shape and dimensions of the vertical ultrasonic vibrator attached to the tail of the rotating main shaft are The shape is designed to resonate with the natural frequency, and the grinding wheel is rotated while subjecting the grinding surface to compound ultrasonic vibrations at the same frequency in the radial direction and axial direction of the grinding wheel, generating a pulsed grinding waveform to produce ultra-fine grinding. A precision finishing method using a grinding wheel that uses ultrasonic vibrations and low-frequency vibrations to generate and grind thin chips.