JPS6361966A - Board circuit inspecting method for continuity of wired utilizing pressurized conductive rubber - Google Patents

Board circuit inspecting method for continuity of wired utilizing pressurized conductive rubber

Info

Publication number
JPS6361966A
JPS6361966A JP61207579A JP20757986A JPS6361966A JP S6361966 A JPS6361966 A JP S6361966A JP 61207579 A JP61207579 A JP 61207579A JP 20757986 A JP20757986 A JP 20757986A JP S6361966 A JPS6361966 A JP S6361966A
Authority
JP
Japan
Prior art keywords
gold
conductive rubber
plated
terminals
plated terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61207579A
Other languages
Japanese (ja)
Inventor
Hiroji Yokosuka
横須賀 洋児
Sakae Tsukada
塚田 栄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP61207579A priority Critical patent/JPS6361966A/en
Publication of JPS6361966A publication Critical patent/JPS6361966A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To eliminate the flawing of a gold-plated terminal part made of a conductive pin by placing pressurized conductive rubber on a gold-plated terminal, fitting metallic projections on their top surfaces corresponding to the respective gold-plated terminals, and inspecting the top and reverse surfaces of the gold-plated terminals at the same time. CONSTITUTION:The metallic projections 8 are fitted on the top surface of the pressurized conductive rubber 6 matching with the pitch of the gold-plated terminals 2, and placed on the top surfaces of the gold-plated terminals 2 and pressed by a press plate so that the pressure is increased locally. Consequently, the terminals and projections 8 conduct to each other to take a continuity test. When the gold-plated terminals 2 on the top and reverse surfaces are inspected at the same time, two jigs for fitting the conductive rubber 6 to the top and reverse surfaces of the wired board by the same system are used; and a conduction pin 5 for inspecting the conductive rubber 6 and a general through hole part for the inspection of the gold-plated terminals 2 are implanted in the lower jig and only the conductive rubber 6 for inspecting the upper gold-plated terminals 2 is fitted to the upper jig. Then they are pressed on a press machine and the conductive rubber 6 and conduction pin 5 are brought into contact with this product at the same time from above and below the wired board.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は配線板の検査方法に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a wiring board inspection method.

(従来の技術) 配線板の断線、短絡等の回路欠陥を検出するには導通検
登機を用いて電気的に行う方法があり、被検食物と桜A
!11′?!:とるには導通ピンを用いて行うのが通常
の方法である。
(Prior art) There is a method of electrically detecting circuit defects such as disconnections and short circuits on wiring boards using a continuity tester.
! 11′? ! :The usual method is to use a conductive pin.

第3図はプレス叛7に検査すべき配線板1を挟む状態説
明図であり、この配線板を第5図に示す。配線板1は表
裏に金めつき端子2を有する。この回路にはエツチング
不良による断線3または短絡4を発生する。このような
欠陥検出には導通検査機の導通ピン5(第4図)を用い
て金めつき端子2と接触して導通検査を行う。
FIG. 3 is an explanatory diagram of a state in which a wiring board 1 to be inspected is sandwiched between press plates 7, and this wiring board is shown in FIG. The wiring board 1 has gold-plated terminals 2 on the front and back sides. In this circuit, disconnections 3 or short circuits 4 occur due to etching defects. To detect such defects, a continuity test is performed by contacting the gold-plated terminal 2 using a continuity pin 5 (FIG. 4) of a continuity tester.

(発明が解決しようとする問題点) 以上の検査条件におい工、配線板の表裏に高密度の金め
つき端子を持つため、導通ピンを金めつき端子に精度良
(位置合わせすることが困難である。
(Problems to be Solved by the Invention) Under the above inspection conditions, since there are high-density gold-plated terminals on the front and back of the wiring board, it is difficult to align the conductive pins with the gold-plated terminals with good precision (difficult to align). It is.

また、金めつき端子2には導通ピンによって傷が発生し
て不良となることがあるばかりでなく、金めっき2は標
準格子上にないことが多いために一般の100ミルユニ
バーサル型導通検査機で表裏の金めつき端子2を同時8
で検査することが不可能である。
In addition, not only can the gold-plated terminal 2 be damaged by the conductive pin, resulting in a defect, but also the gold-plated terminal 2 is often not on the standard grid, so it cannot be used with a general 100 mil universal continuity tester. At the same time, connect gold-plated terminals 2 on the front and back to 8
It is impossible to test by

(問題点を解決するための手段〉 以上の問題点にかんがみ、検討の結果得た本発明は、製
品回路部に加圧4電ゴム全圧看させて回路欠陥の検出全
可能とする方法である。
(Means for Solving the Problems) In view of the above-mentioned problems, the present invention, which was obtained as a result of study, is a method that makes it possible to detect circuit defects by causing the product circuit section to monitor the full pressure of the four electric rubbers. be.

本発明を図によって説明する。第1図は加圧導電ゴムを
利用した治具の拡大見取図である。
The present invention will be explained using figures. FIG. 1 is an enlarged sketch of a jig using pressurized conductive rubber.

加圧導電ゴム6の上面をプレス板7で加圧する。The upper surface of the pressurized conductive rubber 6 is pressurized with a press plate 7.

この場合、加圧導電ゴム6の上面に部分的に圧力を強め
るため、金pA性突起8を金めっき端子ピッチに合うよ
うに取付けろ。さらにこの金属性突起8と導通検査機の
コネクタとを配線で接続する。次いで、プレス機7を押
すと金めっき端子2と金属性突起8が導通して導通試験
が可能となろ。
In this case, in order to partially strengthen the pressure on the upper surface of the pressurized conductive rubber 6, attach the gold PA protrusions 8 so as to match the pitch of the gold-plated terminals. Furthermore, this metal protrusion 8 and the connector of the continuity tester are connected by wiring. Next, when the press 7 is pressed, the gold-plated terminal 2 and the metal protrusion 8 are electrically connected, making it possible to conduct a continuity test.

また、配線板の表裏の金めつき端子を同時に検査可能と
するた、め、加圧導電ゴム6を配線板の上面と下面に同
じ方式で取付ける治具を2式作って検査を行うと両面同
FI?fvc検査ができる。
In addition, in order to be able to inspect the gold-plated terminals on the front and back sides of the wiring board at the same time, it is possible to make two sets of jigs for attaching the pressurized conductive rubber 6 to the top and bottom surfaces of the wiring board in the same way, and to inspect both sides. Same FI? FVC test can be done.

その方式を第2図に示す。The method is shown in Figure 2.

下治具は金めつき端子部の検査のための加圧導電ゴムと
一般スルーホール部を検査するための導通ビンをたてる
。また、上治具を工上側金めっき端子部全検査するため
の加圧導電ゴムだけを取付けた治具を用意し、プレス機
にセットし配#鈑の上下から同時にこの製品に加圧導電
ゴムと導通ビン全接触させる。
The lower jig holds pressurized conductive rubber for inspecting gold-plated terminals and a conductive bottle for inspecting general through-hole sections. In addition, we prepared a jig to which only the pressurized conductive rubber was attached in order to inspect all the gold-plated terminals on the upper side of the upper jig, set it in the press machine, and simultaneously applied the pressurized conductive rubber to this product from the top and bottom of the distribution plate. Make full contact with the conductive bottle.

(作用) 本発明に用いる加圧4電ゴムは、圧力を加えると加圧部
分のみ圧縮方向に電気的に導通する。
(Function) When pressure is applied to the pressurized 4-electric rubber used in the present invention, only the pressurized portion becomes electrically conductive in the compression direction.

したがって、第1図において、加圧導電ゴム6を金めつ
き端子上VcWき、さらにその上面に金属性突起8?!
−各金めつき端子に対応して取付け、プレス板7で上か
ら押す。その結果金属性突起と金めつき端子間に局部的
に圧がかかって電気的に導通し得ることとなる。
Therefore, in FIG. 1, a pressurized conductive rubber 6 is placed on the gold-plated terminal VcW, and a metal protrusion 8 is placed on the top surface of the pressurized conductive rubber 6. !
- Attach it corresponding to each gold-plated terminal and press it from above with the press plate 7. As a result, pressure is applied locally between the metal protrusion and the gold-plated terminal, resulting in electrical continuity.

(発明の効果) 本発明の方法によって得た効果を次に挙げる。(Effect of the invention) The effects obtained by the method of the present invention are listed below.

(1)4通ピンによって金めつき端子部に発生する傷が
なくなった。
(1) Scratches that occur on the gold-plated terminals due to the four-pin pin are eliminated.

(2)導通ピンでは不可能な高密度ピッチ金めっき端子
の検査が可能となった。
(2) It is now possible to inspect high-density pitch gold-plated terminals, which is impossible with conductive pins.

(3)従来は導通治具に導通ビン埋込の穴を明けろ作業
を要したが、本発明によつてその必要がなく、導通治具
作製が簡略となった。
(3) Conventionally, it was necessary to make a hole in the conduction jig for embedding the conduction bottle, but with the present invention, this is not necessary and the manufacture of the conduction jig is simplified.

【図面の簡単な説明】[Brief explanation of drawings]

第1.2.3図は導電性ゴム利用を説明する斜視図、第
4図は2s通ビンの正面図、第5図は金めりき端子の損
傷状態の斜視図である。 1 配線板    2 金めつき端子 3 @線     4 短絡 5 導通ビン   6 加圧4電ゴム 7 ブレン鈑   8 金属惟突起 第1圓 帛3図
Figures 1.2.3 are perspective views for explaining the use of conductive rubber, Figure 4 is a front view of a 2s through bottle, and Figure 5 is a perspective view of a damaged gold-plated terminal. 1 Wiring board 2 Gold plated terminal 3 @ wire 4 Short circuit 5 Continuity bottle 6 Pressure 4 Electric rubber 7 Blend board 8 Metal protrusion 1st circle 3 diagram

Claims (1)

【特許請求の範囲】[Claims] 1、配線板を2枚のプレス板様治具板に挟み、該配線板
の端子部と治具板との間に加圧導電ゴム板を挟み、該加
圧導電ゴム板の各端子に対応する位置に金属性突起を配
し、該治具板で配線板を加圧するとき加圧導電ゴムの圧
縮方向に生ずる導通性を利用することを特徴とする配線
板の回路導通検査方法。
1. A wiring board is sandwiched between two press plate-like jig plates, and a pressurized conductive rubber plate is sandwiched between the terminal part of the wiring board and the jig plate, and each terminal of the pressurized conductive rubber plate is corresponded to 1. A circuit continuity testing method for a wiring board, characterized in that metal protrusions are arranged at positions where the wiring board is pressed, and the conductivity generated in the compression direction of the pressurized conductive rubber is utilized when the wiring board is pressed by the jig plate.
JP61207579A 1986-09-03 1986-09-03 Board circuit inspecting method for continuity of wired utilizing pressurized conductive rubber Pending JPS6361966A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61207579A JPS6361966A (en) 1986-09-03 1986-09-03 Board circuit inspecting method for continuity of wired utilizing pressurized conductive rubber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61207579A JPS6361966A (en) 1986-09-03 1986-09-03 Board circuit inspecting method for continuity of wired utilizing pressurized conductive rubber

Publications (1)

Publication Number Publication Date
JPS6361966A true JPS6361966A (en) 1988-03-18

Family

ID=16542092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61207579A Pending JPS6361966A (en) 1986-09-03 1986-09-03 Board circuit inspecting method for continuity of wired utilizing pressurized conductive rubber

Country Status (1)

Country Link
JP (1) JPS6361966A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04186173A (en) * 1990-11-21 1992-07-02 Nisshin Koki Kk Electronic parts inspecting tool
JPH0621783U (en) * 1992-07-22 1994-03-22 サンリツ株式会社 Cotton swab

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04186173A (en) * 1990-11-21 1992-07-02 Nisshin Koki Kk Electronic parts inspecting tool
JPH0621783U (en) * 1992-07-22 1994-03-22 サンリツ株式会社 Cotton swab

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