JPS636195U - - Google Patents

Info

Publication number
JPS636195U
JPS636195U JP9844286U JP9844286U JPS636195U JP S636195 U JPS636195 U JP S636195U JP 9844286 U JP9844286 U JP 9844286U JP 9844286 U JP9844286 U JP 9844286U JP S636195 U JPS636195 U JP S636195U
Authority
JP
Japan
Prior art keywords
solder
solder powder
solid
ultra
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9844286U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9844286U priority Critical patent/JPS636195U/ja
Publication of JPS636195U publication Critical patent/JPS636195U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】
第1図は本考案に係るチツプ型部品の基板装着
用半田を示す斜視図、第2図a〜cは同半田によ
る電子部品の装着工程を示す説明図、第3図a〜
cは別の電子部品装着工程を示す説明図である。 1:半田固型体。

Claims (1)

    【実用新案登録請求の範囲】
  1. 超微粒な半田粉と、その半田粉の融点に相応す
    る活性剤を含む固型フラツクスとの混合材を固型
    体に成形してなることを特徴とするチツプ型部品
    の基板装着用半田。
JP9844286U 1986-06-26 1986-06-26 Pending JPS636195U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9844286U JPS636195U (ja) 1986-06-26 1986-06-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9844286U JPS636195U (ja) 1986-06-26 1986-06-26

Publications (1)

Publication Number Publication Date
JPS636195U true JPS636195U (ja) 1988-01-16

Family

ID=30966378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9844286U Pending JPS636195U (ja) 1986-06-26 1986-06-26

Country Status (1)

Country Link
JP (1) JPS636195U (ja)

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