JPS6361155U - - Google Patents

Info

Publication number
JPS6361155U
JPS6361155U JP1986153769U JP15376986U JPS6361155U JP S6361155 U JPS6361155 U JP S6361155U JP 1986153769 U JP1986153769 U JP 1986153769U JP 15376986 U JP15376986 U JP 15376986U JP S6361155 U JPS6361155 U JP S6361155U
Authority
JP
Japan
Prior art keywords
bonding part
light emitting
emitting diode
diode element
series
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986153769U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986153769U priority Critical patent/JPS6361155U/ja
Publication of JPS6361155U publication Critical patent/JPS6361155U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/01Manufacture or treatment
    • H10W72/0198Manufacture or treatment batch processes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1986153769U 1986-10-08 1986-10-08 Pending JPS6361155U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986153769U JPS6361155U (enExample) 1986-10-08 1986-10-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986153769U JPS6361155U (enExample) 1986-10-08 1986-10-08

Publications (1)

Publication Number Publication Date
JPS6361155U true JPS6361155U (enExample) 1988-04-22

Family

ID=31072949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986153769U Pending JPS6361155U (enExample) 1986-10-08 1986-10-08

Country Status (1)

Country Link
JP (1) JPS6361155U (enExample)

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