JPS6359323U - - Google Patents
Info
- Publication number
- JPS6359323U JPS6359323U JP15344286U JP15344286U JPS6359323U JP S6359323 U JPS6359323 U JP S6359323U JP 15344286 U JP15344286 U JP 15344286U JP 15344286 U JP15344286 U JP 15344286U JP S6359323 U JPS6359323 U JP S6359323U
- Authority
- JP
- Japan
- Prior art keywords
- frequency
- resin
- semiconductor encapsulation
- utility
- preheating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims 4
- 238000005538 encapsulation Methods 0.000 claims 3
- 230000010355 oscillation Effects 0.000 claims 1
Landscapes
- Coating Apparatus (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図はこの考案の一実施例を示す正面図、第
２図はその側面図、第３図は従来の高周波予熱装
置を示す正面図、第４図はその側面図である。図
中、１は上部電極、２は下部電極、３は高周波発
振部、３ａ，３ｂは高周波発振器、４は樹脂タブ
レツトである。なお、各図中同一符号は同一又は
相当部分を示す。
FIG. 1 is a front view showing an embodiment of this invention, FIG. 2 is a side view thereof, FIG. 3 is a front view showing a conventional high frequency preheating device, and FIG. 4 is a side view thereof. In the figure, 1 is an upper electrode, 2 is a lower electrode, 3 is a high frequency oscillator, 3a and 3b are high frequency oscillators, and 4 is a resin tablet. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
た半導体封止用樹脂の高周波予熱装置。 (2) 複数の高周波発振器のうち１つは半導体封
止用樹脂に対応した第１の高周波を発し、他の１
つは半導体封止用樹脂中の水分に対応した第２の
高周波を発するように構成されていることを特徴
とする実用新案登録請求の範囲第(1)項記載の半
導体封止用樹脂の高周波予熱装置。[Claims for Utility Model Registration] (1) A high-frequency preheating device for semiconductor encapsulation resin equipped with multiple high-frequency oscillation sources with different frequencies. (2) One of the multiple high-frequency oscillators emits a first high-frequency wave corresponding to the semiconductor encapsulating resin, and the other
The high frequency wave of the resin for semiconductor encapsulation according to claim (1) of the utility model registration claim is characterized in that the second high frequency wave is emitted corresponding to the moisture in the resin for semiconductor encapsulation. Preheating device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15344286U JPS6359323U (en) | 1986-10-06 | 1986-10-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15344286U JPS6359323U (en) | 1986-10-06 | 1986-10-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6359323U true JPS6359323U (en) | 1988-04-20 |
Family
ID=31072328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15344286U Pending JPS6359323U (en) | 1986-10-06 | 1986-10-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6359323U (en) |
-
1986
- 1986-10-06 JP JP15344286U patent/JPS6359323U/ja active Pending
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