JPS6357758U - - Google Patents
Info
- Publication number
- JPS6357758U JPS6357758U JP15167686U JP15167686U JPS6357758U JP S6357758 U JPS6357758 U JP S6357758U JP 15167686 U JP15167686 U JP 15167686U JP 15167686 U JP15167686 U JP 15167686U JP S6357758 U JPS6357758 U JP S6357758U
- Authority
- JP
- Japan
- Prior art keywords
- light receiving
- receiving element
- photocoupler device
- step portion
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Description
第１図ａ，ｂは本考案による半導体フオトカプ
ラー装置の一実施例を示す要部斜視図、その断面
図、第２図、第３図は本考案の他の実施例を示す
要部斜視図、第４図、第５図は従来の半導体フオ
トカプラー装置を説明する図、第６図ないし第８
図は従来の半導体フオトカプラー装置の問題点を
説明する図である。 １……発光用赤外ＬＥＤチツプ（発光素子）、
２……受光用チツプ（受光素子）、３……発光素
子搭載用フレーム、４……受光素子搭載用フレー
ム、４ａ……リードパツド、４ａ′……段差部、
４ｂ……受光素子搭載パツド、５……光透過パイ
プ、６……モールド樹脂、７，８……配線。
ラー装置の一実施例を示す要部斜視図、その断面
図、第２図、第３図は本考案の他の実施例を示す
要部斜視図、第４図、第５図は従来の半導体フオ
トカプラー装置を説明する図、第６図ないし第８
図は従来の半導体フオトカプラー装置の問題点を
説明する図である。 １……発光用赤外ＬＥＤチツプ（発光素子）、
２……受光用チツプ（受光素子）、３……発光素
子搭載用フレーム、４……受光素子搭載用フレー
ム、４ａ……リードパツド、４ａ′……段差部、
４ｂ……受光素子搭載パツド、５……光透過パイ
プ、６……モールド樹脂、７，８……配線。
Claims (1)
- 受光素子搭載フレームのリードパツド部の一部
に、配線を係止する段差部を設けたことを特徴と
する半導体フオトカプラー装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15167686U JPS6357758U (ja) | 1986-10-01 | 1986-10-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15167686U JPS6357758U (ja) | 1986-10-01 | 1986-10-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6357758U true JPS6357758U (ja) | 1988-04-18 |
Family
ID=31068962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15167686U Pending JPS6357758U (ja) | 1986-10-01 | 1986-10-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6357758U (ja) |
-
1986
- 1986-10-01 JP JP15167686U patent/JPS6357758U/ja active Pending