JPS6357752U - - Google Patents

Info

Publication number
JPS6357752U
JPS6357752U JP15098386U JP15098386U JPS6357752U JP S6357752 U JPS6357752 U JP S6357752U JP 15098386 U JP15098386 U JP 15098386U JP 15098386 U JP15098386 U JP 15098386U JP S6357752 U JPS6357752 U JP S6357752U
Authority
JP
Japan
Prior art keywords
plating layer
nickel plating
lead frame
lead
oxidation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15098386U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15098386U priority Critical patent/JPS6357752U/ja
Publication of JPS6357752U publication Critical patent/JPS6357752U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP15098386U 1986-09-30 1986-09-30 Pending JPS6357752U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15098386U JPS6357752U (ko) 1986-09-30 1986-09-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15098386U JPS6357752U (ko) 1986-09-30 1986-09-30

Publications (1)

Publication Number Publication Date
JPS6357752U true JPS6357752U (ko) 1988-04-18

Family

ID=31067623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15098386U Pending JPS6357752U (ko) 1986-09-30 1986-09-30

Country Status (1)

Country Link
JP (1) JPS6357752U (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021070260A1 (ko) * 2019-10-08 2021-04-15

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57166058A (en) * 1981-04-07 1982-10-13 Hitachi Cable Ltd Lead frame for semiconductor
JPS60117761A (ja) * 1983-11-30 1985-06-25 Toshiba Corp 半導体装置用リ−ドフレ−ム
JPS6310565B2 (ko) * 1984-06-25 1988-03-08 Taamo Jugen

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57166058A (en) * 1981-04-07 1982-10-13 Hitachi Cable Ltd Lead frame for semiconductor
JPS60117761A (ja) * 1983-11-30 1985-06-25 Toshiba Corp 半導体装置用リ−ドフレ−ム
JPS6310565B2 (ko) * 1984-06-25 1988-03-08 Taamo Jugen

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021070260A1 (ko) * 2019-10-08 2021-04-15
WO2021070260A1 (ja) * 2019-10-08 2021-04-15 トヨタ自動車株式会社 半導体装置

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