JPS61111160U - - Google Patents

Info

Publication number
JPS61111160U
JPS61111160U JP19733684U JP19733684U JPS61111160U JP S61111160 U JPS61111160 U JP S61111160U JP 19733684 U JP19733684 U JP 19733684U JP 19733684 U JP19733684 U JP 19733684U JP S61111160 U JPS61111160 U JP S61111160U
Authority
JP
Japan
Prior art keywords
semiconductor element
terminals
sealed
periphery
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19733684U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19733684U priority Critical patent/JPS61111160U/ja
Publication of JPS61111160U publication Critical patent/JPS61111160U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP19733684U 1984-12-25 1984-12-25 Pending JPS61111160U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19733684U JPS61111160U (ko) 1984-12-25 1984-12-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19733684U JPS61111160U (ko) 1984-12-25 1984-12-25

Publications (1)

Publication Number Publication Date
JPS61111160U true JPS61111160U (ko) 1986-07-14

Family

ID=30755575

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19733684U Pending JPS61111160U (ko) 1984-12-25 1984-12-25

Country Status (1)

Country Link
JP (1) JPS61111160U (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6349454A (ja) * 1986-08-18 1988-03-02 Rohm Co Ltd サ−マルヘツド

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6349454A (ja) * 1986-08-18 1988-03-02 Rohm Co Ltd サ−マルヘツド

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