JPH0241447U - - Google Patents
Info
- Publication number
- JPH0241447U JPH0241447U JP11865688U JP11865688U JPH0241447U JP H0241447 U JPH0241447 U JP H0241447U JP 11865688 U JP11865688 U JP 11865688U JP 11865688 U JP11865688 U JP 11865688U JP H0241447 U JPH0241447 U JP H0241447U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit package
- lead
- out terminals
- resin part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11865688U JPH0241447U (ko) | 1988-09-09 | 1988-09-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11865688U JPH0241447U (ko) | 1988-09-09 | 1988-09-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0241447U true JPH0241447U (ko) | 1990-03-22 |
Family
ID=31363192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11865688U Pending JPH0241447U (ko) | 1988-09-09 | 1988-09-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0241447U (ko) |
-
1988
- 1988-09-09 JP JP11865688U patent/JPH0241447U/ja active Pending