JPH0221754U - - Google Patents
Info
- Publication number
- JPH0221754U JPH0221754U JP10141288U JP10141288U JPH0221754U JP H0221754 U JPH0221754 U JP H0221754U JP 10141288 U JP10141288 U JP 10141288U JP 10141288 U JP10141288 U JP 10141288U JP H0221754 U JPH0221754 U JP H0221754U
- Authority
- JP
- Japan
- Prior art keywords
- circuit module
- contact surface
- contact
- circuit
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10141288U JPH0221754U (ko) | 1988-07-28 | 1988-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10141288U JPH0221754U (ko) | 1988-07-28 | 1988-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221754U true JPH0221754U (ko) | 1990-02-14 |
Family
ID=31330380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10141288U Pending JPH0221754U (ko) | 1988-07-28 | 1988-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221754U (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0465158A (ja) * | 1990-07-05 | 1992-03-02 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
-
1988
- 1988-07-28 JP JP10141288U patent/JPH0221754U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0465158A (ja) * | 1990-07-05 | 1992-03-02 | Mitsubishi Electric Corp | 半導体装置の製造方法 |