JPS6357585U - - Google Patents

Info

Publication number
JPS6357585U
JPS6357585U JP15097886U JP15097886U JPS6357585U JP S6357585 U JPS6357585 U JP S6357585U JP 15097886 U JP15097886 U JP 15097886U JP 15097886 U JP15097886 U JP 15097886U JP S6357585 U JPS6357585 U JP S6357585U
Authority
JP
Japan
Prior art keywords
electronic components
board
temperature
applying
voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15097886U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15097886U priority Critical patent/JPS6357585U/ja
Publication of JPS6357585U publication Critical patent/JPS6357585U/ja
Pending legal-status Critical Current

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  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案に係る温度試験装置の要部切
欠側面図、第2図は、ボードの平面図、第3図は
、第2図のA―A線に沿う断面図である。 2……温度可変槽、6……ボード、10……電
子部品、11……ソケツト、12……プリント基
板、18……回路装置。
1 is a cutaway side view of a main part of a temperature testing device according to the present invention, FIG. 2 is a plan view of a board, and FIG. 3 is a sectional view taken along line AA in FIG. 2. 2...Temperature variable tank, 6...Board, 10...Electronic component, 11...Socket, 12...Printed circuit board, 18...Circuit device.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ボードに取付けたソケツトに、電子部品を装着
し、電子部品に試験電圧を印加しつゝ、温度可変
槽中で試験するようにした温度試験装置において
、電子部品への電圧印加用の回路装置を、ボード
に着脱自在に設けたプリント基板に形成したこと
を特徴とする温度試験装置。
In a temperature test equipment in which electronic components are mounted on sockets attached to a board and tested in a variable temperature chamber while applying a test voltage to the electronic components, a circuit device for applying voltage to the electronic components is installed. A temperature testing device characterized in that it is formed on a printed circuit board that is detachably attached to a board.
JP15097886U 1986-09-30 1986-09-30 Pending JPS6357585U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15097886U JPS6357585U (en) 1986-09-30 1986-09-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15097886U JPS6357585U (en) 1986-09-30 1986-09-30

Publications (1)

Publication Number Publication Date
JPS6357585U true JPS6357585U (en) 1988-04-16

Family

ID=31067613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15097886U Pending JPS6357585U (en) 1986-09-30 1986-09-30

Country Status (1)

Country Link
JP (1) JPS6357585U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817694A (en) * 1981-07-10 1983-02-01 トムソン−セ−・エス・エフ Device for supporting integrated circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817694A (en) * 1981-07-10 1983-02-01 トムソン−セ−・エス・エフ Device for supporting integrated circuit

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