JPS6356387A - Work holder for laser beam machine - Google Patents

Work holder for laser beam machine

Info

Publication number
JPS6356387A
JPS6356387A JP61200113A JP20011386A JPS6356387A JP S6356387 A JPS6356387 A JP S6356387A JP 61200113 A JP61200113 A JP 61200113A JP 20011386 A JP20011386 A JP 20011386A JP S6356387 A JPS6356387 A JP S6356387A
Authority
JP
Japan
Prior art keywords
workpiece
shaft
holding
laser beam
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61200113A
Other languages
Japanese (ja)
Inventor
Hideyuki Sakitani
崎谷 秀幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP61200113A priority Critical patent/JPS6356387A/en
Publication of JPS6356387A publication Critical patent/JPS6356387A/en
Pending legal-status Critical Current

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  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To facilitate laser beam processing of different welding directions by mounting a turn table to a turning shaft of a stationary table and disposing a driving source for rotating a holding table to the turn table. CONSTITUTION:The turn table 8 is mounted to the turning shaft S of the stationary table 9 and the output shaft of a motor 10 is connected to the turning shaft S. A motor 11 to drive the T shaft of the holding table 7 is further disposed to the turn table 8. After a work 4 to be welded from the peripheral wall surface is mounted to the holding table 7, the motor 10 of the shaft S is rotated in an arrow (a) direction to tilt the turn table 8, then the welding in an optional angle direction by laser light 3 is executed. The shaft S is turned in an arrow (b) direction and the welding in a perpendicular direction is executed in the case of welding the contact surfaces of inside and outside materials 6b, 5b of the work 4b. The laser beam processing of the different welding directions is easily executed by the above-mentioned method.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はレーザ加工機に関し、さらに詳しくはレーザ加
工機のワーク保持装置の改良に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a laser processing machine, and more particularly to an improvement of a workpiece holding device for a laser processing machine.

【従来の技術〕[Conventional technology]

第3図は従来のレーザ加工機におけるワーク保持装置の
一例を示す模式図で、この例ではレーザ加工機によりレ
ーザ溶接を行なう場合を示しである。図において、(1
)はレーザ加工機のレーザ加工ヘッド、(2)は集束レ
レズ、(3)はレーザ光で、このレーザ加工ヘッド(1
)は水平方向(Y軸)及び垂直方向(2軸)に直線移動
可能に構成されている。
FIG. 3 is a schematic diagram showing an example of a workpiece holding device in a conventional laser processing machine, and this example shows a case where laser welding is performed by the laser processing machine. In the figure, (1
) is the laser processing head of the laser processing machine, (2) is the focusing lens, and (3) is the laser beam.
) is configured to be linearly movable in the horizontal direction (Y axis) and vertical direction (two axes).

(4)は外側の材料(5)に内側の材料(6)を圧入し
た円筒状のワーク、(7)はワーク(4)を保持する保
持台、(8)はモータな有し、保持台(7)、したがっ
てワーク(4)を矢印方向に回転させる回転台で、これ
ら回転台(8)及び保持台(7)によりワーク保持装置
−を構成している。
(4) is a cylindrical workpiece in which the inner material (6) is press-fitted into the outer material (5), (7) is a holding stand that holds the workpiece (4), and (8) is a motor and holding stand. (7), therefore, a rotating table for rotating the workpiece (4) in the direction of the arrow; the rotating table (8) and the holding table (7) constitute a workpiece holding device.

上記のように構成した従来装置の作用を説明すれば、次
の通りであるi・先ず・ワーク(4)を保持台(7)に
保持させ、レーザ加工ヘッド(1)を水平方向(Y軸)
及び垂直方向(2軸)に駆動し、ワーク(4)の加工(
溶接)部である外側の材料(5)と内側の材料(4)と
の接合部に近付ける。この状態で回転台(7)を矢印方
向に回転させると同時にレーザ光(3)を出射させ、集
束レンズ(2)により収束させて一点に集め、ワーク(
4)の加工部(4a)に照射すれば、ワ−ク(4)の加
工部(4a)はレーザ熱によって溶解する。
The operation of the conventional apparatus configured as described above is as follows: First, the workpiece (4) is held on the holding table (7), and the laser processing head (1) is moved in the horizontal direction (Y-axis )
and in the vertical direction (2 axes) to process the workpiece (4) (
approach the joint between the outer material (5) and the inner material (4), which is the welding part. In this state, the rotary table (7) is rotated in the direction of the arrow, and at the same time the laser beam (3) is emitted, converged by the converging lens (2) and focused at one point, and the workpiece (
When the laser beam irradiates the processed portion (4a) of the workpiece (4), the processed portion (4a) of the workpiece (4) is melted by the laser heat.

ワーク(4)がほぼ1回転しTこところでレーザ光(3
)の照射を停止すると共に保持台(7)を停止させれば
、ワーク(4)の加工部(4a)は第4図に示すように
全周に亘って溶解し、溶接(18される。
The workpiece (4) rotates approximately once, and at this point the laser beam (3
) and the holding table (7) is stopped, the processed portion (4a) of the workpiece (4) is melted and welded (18) over its entire circumference as shown in FIG.

第5図は従来のワーク保持装置の他の例を示す模式図で
ある。この装置は第3図で示した回転台(8)’f9D
’回転し、その底部を固定台(9)の側面に固定したも
のである、このようなワーク保持装置−においては、加
工ヘッド(1)から出射し1こレーザ光(3)は矢印方
向に回転¥ろワーク(4)の周壁面に照射され、第6図
に示すようにワーク(4)の外側の材料(5)を貫通溶
解してさらに内側の材料(6)をある深さにまで浴解し
、両材料(5) 、 (6)な溶接α荀する。
FIG. 5 is a schematic diagram showing another example of a conventional work holding device. This device is a rotary table (8)'f9D shown in Figure 3.
In such a workpiece holding device, which rotates and has its bottom fixed to the side of a fixed table (9), one laser beam (3) is emitted from the processing head (1) in the direction of the arrow. Irradiation is applied to the peripheral wall surface of the rotating workpiece (4), and as shown in Figure 6, the material (5) on the outside of the workpiece (4) is penetrated and melted, and the material (6) on the inside is further penetrated to a certain depth. Dissolve and weld both materials (5) and (6).

〔発明が解決しようとf/、)問題点〕レーザ加工機の
レーザ加工ヘッド(1)から照射されるレーザ光(3)
は、一般に上記のように垂直方向(2軸)に固定されて
いる。このfこめ、従来のワーク保持装置においては、
はぼ同形状の円筒状のワーク(4)であっても、加工方
向が異なればこれを保持する保持台(7)の姿勢を変え
なげればならない。
[Problem that the invention attempts to solve] Laser light (3) irradiated from the laser processing head (1) of a laser processing machine
are generally fixed in the vertical direction (two axes) as described above. In consideration of this f, in the conventional work holding device,
Even if the cylindrical workpiece (4) has the same shape, if the machining direction is different, the attitude of the holding table (7) that holds the workpiece must be changed.

このため、各ワーク(4)の加工方向に対応し定構造の
ワーク保持装置−を使用して加工しなければならず、段
取りがきわめて面倒で、設備費も高価になるという問題
があつ1こ。
For this reason, it is necessary to process each workpiece (4) using a workpiece holding device with a fixed structure corresponding to the processing direction, which poses problems such as extremely troublesome setup and high equipment costs. .

本発明は、上記の問題点を解決するため)になされたも
ので、はぼ同形状のワークであれば、加工方向が異なっ
ても同じワーク保持装置で容易に加工することのできる
レーザ加工機のワーク保持装置を得ることを目的とした
ものである。
The present invention has been made in order to solve the above-mentioned problems, and is a laser processing machine that can easily process workpieces of approximately the same shape using the same workpiece holding device even if the processing direction is different. The purpose of this invention is to obtain a workpiece holding device.

〔問題点を解決するための手段] 本発明は、駆動源によって回動する軸を備えた固定台と
、ワークを保持する保持台と、この保持台を回転さ+!
:ろ駆動源とを有し、上記固定台の軸に取付けられ1こ
回転台とから構成したものである。
[Means for Solving the Problems] The present invention provides a fixing table having a shaft rotated by a drive source, a holding table for holding a workpiece, and a mechanism for rotating this holding table.
The rotating table is attached to the shaft of the fixed table and includes a rotary table.

[作 用〕 固定台の駆動源によって軸を回動さセ、この軸に取付け
た回転台を水平、垂直又は傾動させて、保持台に保持さ
れたワークを溶接位置に整合させる。
[Operation] The shaft is rotated by the drive source of the fixed table, and the rotary table attached to this shaft is horizontally, vertically, or tilted to align the workpiece held on the holding table to the welding position.

[実施例〕 第1図は本発明実施例の模式図で、第3図、第4図に示
した従来例と同−又は相当部分には同じ符号((1)〜
(9))を付し、説明を省略する、本実施例のワーク保
持装置 tl)においては、回転台(8)は固定台(9
)に設けた軸(以下S軸という)に取付けられており、
このS軸にはモータα0の出力軸が連結されて回転台(
8)を矢印a、b方向に回動させ、保持台(7)の姿勢
を変換する。αりは回転台(8)に数句けられ、保持台
(7)を回転させるモータで、以下保持台(7)の回転
軸をT軸とする。なお、鰺はY軸の左端で2軸の上端を
、(至)はY軸の右端で2軸の上端を、04はY軸の左
端で2軸の下端を、また(至)はY軸の右端で2軸の下
端を示すもので、レーザ加工ヘッド(1)の動作範囲を
示している。
[Embodiment] Fig. 1 is a schematic diagram of an embodiment of the present invention, in which the same or equivalent parts as in the conventional example shown in Figs. 3 and 4 are designated by the same reference numerals ((1) to
In the workpiece holding device (tl) of this embodiment, which is marked with (9)) and whose explanation is omitted, the rotary table (8) is replaced by the fixed table (9).
) (hereinafter referred to as the S-axis),
The output shaft of motor α0 is connected to this S axis, and the rotating table (
8) in the directions of arrows a and b to change the attitude of the holding table (7). The rotation axis (8) is a motor that rotates the holding table (7), and the axis of rotation of the holding table (7) will hereinafter be referred to as the T axis. In addition, for mackerel, the left end of the Y axis is the upper end of the 2nd axis, (to) is the right end of the Y axis and the upper end of the 2nd axis, 04 is the left end of the Y axis and the lower end of the 2nd axis, and (to) is the Y axis The right end indicates the lower end of the two axes and indicates the operating range of the laser processing head (1).

次に上記のように構成しに本発明実施例の作用の一例7
説明する。先ず保持台(7)に第6図に示すような内壁
面から溶接て゛ろワーク(4)を取付け1このち、S軸
のモータ00ヲ例えば矢印3方向に回転して回転台(8
)を実線で示す方向に傾動させ、任意の傾き角に設定し
て停止させる。なお、図にはT軸が水平方向で、ワーク
(4)の加工部が垂直方向に位置した場合を示したが、
T軸の傾きは任意の角度に設定することができる。
Next, Example 7 of the operation of the embodiment of the present invention configured as described above
explain. First, attach the welded workpiece (4) to the holding table (7) from the inner wall surface as shown in FIG.
) in the direction shown by the solid line, set the tilt angle to an arbitrary angle, and stop. Note that the figure shows a case where the T-axis is horizontal and the machining part of the workpiece (4) is located vertically.
The inclination of the T-axis can be set to any angle.

回転台(8)の傾き角の設定が終ったときは、レーザ加
工ヘッド(1)をY軸方向及びZ軸方向に移動させて、
ワーク(4)の加工部(4a)の近傍に位置させる。つ
いでT軸を駆動して保持台(7)に取付けたワーク(4
)を回転させると同時に、レーザ光(3)ヲワーク(4
)の加工部(4a)に照射し、加工部(4a)を溶解さ
せて溶接を開始する。ワーク(4)がほぼ1回転したと
ころでレーザ光(3)の照射を停止すると共にT軸の回
転を停止し、レーザ加エヘット責1)を移動させてワー
ク(4)全保持台(7)から外す。
When the tilt angle of the rotary table (8) has been set, move the laser processing head (1) in the Y-axis direction and the Z-axis direction,
It is located near the processing section (4a) of the workpiece (4). Next, drive the T-axis to move the workpiece (4) attached to the holding table (7).
) at the same time, the laser beam (3) and the workpiece (4) are rotated.
) is irradiated to the processed portion (4a) to melt the processed portion (4a) and start welding. When the workpiece (4) has rotated approximately once, the irradiation of the laser beam (3) is stopped, and the rotation of the T-axis is also stopped, and the laser processing head 1) is moved to remove the entire workpiece (4) from the holding table (7). remove.

一方、第4図に示すようなワーク(4b)の外側材料(
5b)と内側材II (6b)の接触面を溶接する場合
は、保持台(7)にワーク(4b)を取付けたのち、第
1図の鎖線で示すようにS軸を矢印(b)方向に回動し
て回転台(8)をほぼ垂直に保持し、レーザ加工ヘッド
(1)を鎖線の位置まで移動させて加工部(4a)にレ
ーザ光(3)を照射すると同時にT軸を回転させればよ
い。
On the other hand, the outer material (
5b) and the inner material II (6b), after mounting the workpiece (4b) on the holding table (7), rotate the S axis in the direction of the arrow (b) as shown by the chain line in Figure 1. The laser processing head (1) is moved to the position indicated by the chain line to irradiate the processing part (4a) with the laser beam (3), and the T-axis is rotated at the same time. Just let it happen.

第2図は本発明の他の実施例の模式図である。FIG. 2 is a schematic diagram of another embodiment of the invention.

第1図の実施例では、固定台(9)、回転台(8)、保
持台(7)からなる1台のワーク保持装置(ハ)を備え
たレーザ加工機について説明したが、本実施例ではこの
ようなワーク保持装置f2℃を2台備えたものである、
即ち、モータを備えた基台叩上に、モータの出力軸(Q
軸)に連結されたターンテーブルαηを設け、このター
ンテープ/L’αηに第1図に示すようなワーク保持装
置al)、  (21a)を2台、回転台(8a)。
In the embodiment shown in FIG. 1, a laser processing machine equipped with one workpiece holding device (c) consisting of a fixed table (9), a rotary table (8), and a holding table (7) has been described. Here, we have two such work holding devices f2°C.
In other words, the output shaft of the motor (Q
A turntable αη connected to a shaft) is provided, and two workpiece holding devices al), (21a) as shown in FIG.

(8b)を水平にしたときに保持台(7a)・(7b)
が何れも外側に位置するように対向配置したものである
Holding stand (7a) and (7b) when (8b) is horizontal
are arranged facing each other so that both are located on the outside.

上記のようなワーク保持装置01)、  (21a)を
備えたレーザ加工機において、同じ加工方向のワークを
多数加工する場合は一方のワーク保持装置(例えばQη
)でワーク(4)をレーザ加工している間に、他方のワ
ーク保持装置(21a)に新らしいワーク(4′)をセ
ットし、レーザ加工が終、つた時点でターンテーブル(
17)を180°回転させて加工すれば、新らしいワー
ク(4’)’&加工している間に他方のワーク保持装置
では、加工済のワーク(4)の取出し及び新らしいワー
クのセットができるので、加工効率を大幅に向上させる
ことができる。
In a laser processing machine equipped with the workpiece holding devices 01) and (21a) as described above, when processing a large number of workpieces in the same processing direction, one workpiece holding device (for example, Qη
), a new workpiece (4') is set on the other workpiece holding device (21a), and when the laser processing is finished, the turntable (
17) is rotated 180° and machined, a new workpiece (4')' is created & while machining, the other workpiece holding device takes out the machined workpiece (4) and sets a new workpiece. As a result, processing efficiency can be greatly improved.

上記のワークの取付け、取出しにはロボットを使用して
もよく、これによって作業能率が向上するばかりでなく
、レーザ加工が可能なワークの種類も増加し、フレキシ
ブルなシステムを形成することができる。
A robot may be used to attach and take out the above-mentioned workpieces, which not only improves work efficiency but also increases the types of workpieces that can be laser-processed, making it possible to form a flexible system.

なお、上記の説明では、本発明に係るワーク保持装置に
よって主としてワークを溶接する場合について述べ1こ
が、他のレーザ加工を行なう場合にも本発明を実施しう
ろことは云う迄もない。
In the above description, the case in which workpieces are welded using the workpiece holding device according to the present invention has been mainly described, but it goes without saying that the present invention can also be practiced in cases where other laser processing is performed.

〔発明の効果〕・ 以上の説明から明らかなように、本発明はレーザ加工用
のワーク保持装置を、回転軸を備えた保持台と、この回
転軸に取付けられた回転台とによって構成したので、円
形又は円周の加工部を有するワークをレーザ加工するに
あにり、ワークとレレーザ光の照射角度を任意に設定す
ることができる。このため溶接方向の異なる種類のワー
クを、同じワーク保持装置により容易にレーザ加工を行
なうことができる。
[Effects of the Invention]- As is clear from the above description, the present invention has a workpiece holding device for laser processing that is composed of a holding table equipped with a rotating shaft and a rotating table attached to this rotating shaft. When laser processing a workpiece having a circular or circumferential processing portion, the irradiation angle of the workpiece and the laser beam can be arbitrarily set. Therefore, different types of workpieces with different welding directions can be easily laser-processed using the same workpiece holding device.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明実施例の模式図、第2図は本発明の他の
実施例の模式図、第3図、第5図はそれぞれ従来のワー
ク保持装置及びその作用を説明するための模式図、第4
図、第6図はワークの一例を示すもので、それぞれ(a
+は断面図、(blは平面図である。 図において、(1)は加工ヘッド、(4)はワーク、(
4a)は加工部、(7) 、  (7a )、(7b 
)はワークの保持台、(8)、  (8a)、 (8b
・)は回転台、(9)、  (9a)。 (9b)は固定台、αO0α℃にモータ、CLQは基台
、(ロ)はターンテーブル、01)・ (21a )は
ワーク保持装置である。なお、図中同一符号は同−又は
相当部分を示すものとする。 代理人 弁理士 佐 藤 正 年 第2図 Y車由 ]V、ターンチーフル (b) 第6因 (Q)        (b)
Fig. 1 is a schematic diagram of an embodiment of the present invention, Fig. 2 is a schematic diagram of another embodiment of the present invention, and Figs. 3 and 5 are schematic diagrams for explaining a conventional work holding device and its operation. Figure, 4th
Figures 6 and 6 show examples of workpieces, respectively (a
+ is a cross-sectional view, (bl is a plan view. In the figure, (1) is a processing head, (4) is a workpiece, (
4a) is the processing part, (7), (7a), (7b
) are the workpiece holding stands, (8), (8a), (8b
・) is a turntable, (9), (9a). (9b) is a fixed stand, αO0α°C is a motor, CLQ is a base, (b) is a turntable, and 01) and (21a) are work holding devices. Note that the same reference numerals in the figures indicate the same or equivalent parts. Agent: Patent Attorney Tadashi Sato Figure 2 Y Car Yu] V, Turntickle (b) Cause 6 (Q) (b)

Claims (2)

【特許請求の範囲】[Claims] (1)駆動源によつて回動する軸を備えた固定台と、ワ
ークを保持する保持台と、この保持台を回転させる駆動
源とを有し、上記固定台の軸に取付けられた回転台とか
らなるレーザ加工機のワーク保持装置。
(1) It has a fixed base with a shaft that rotates by a drive source, a holding base that holds a workpiece, and a drive source that rotates this holding base, and the rotation is attached to the shaft of the fixed base. A workpiece holding device for a laser processing machine consisting of a stand and a stand.
(2)上記ワーク保持装置2台をターンテーブル上に取
付けてなる特許請求の範囲第1項記載のレーザ加工機の
ワーク保持装置。
(2) A workpiece holding device for a laser processing machine according to claim 1, wherein the two workpiece holding devices are mounted on a turntable.
JP61200113A 1986-08-28 1986-08-28 Work holder for laser beam machine Pending JPS6356387A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61200113A JPS6356387A (en) 1986-08-28 1986-08-28 Work holder for laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61200113A JPS6356387A (en) 1986-08-28 1986-08-28 Work holder for laser beam machine

Publications (1)

Publication Number Publication Date
JPS6356387A true JPS6356387A (en) 1988-03-10

Family

ID=16419044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61200113A Pending JPS6356387A (en) 1986-08-28 1986-08-28 Work holder for laser beam machine

Country Status (1)

Country Link
JP (1) JPS6356387A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03114688A (en) * 1989-07-14 1991-05-15 Maho Ag Method and device for forming recess on workpiece using laser beam
JPH03116675A (en) * 1989-09-29 1991-05-17 Tanaka Kikinzoku Kogyo Kk Brush welding device for brush contact
JPH04100688A (en) * 1990-08-14 1992-04-02 Tsubakimoto Chain Co Work rotating device for laser beam machine
KR100624577B1 (en) 2005-05-18 2006-09-15 주식회사 파스웰드 Universal jig for laser welding machine
ITBG20090012A1 (en) * 2009-03-31 2010-10-01 Laservall Spa LASER WELDING SYSTEM

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03114688A (en) * 1989-07-14 1991-05-15 Maho Ag Method and device for forming recess on workpiece using laser beam
JPH03116675A (en) * 1989-09-29 1991-05-17 Tanaka Kikinzoku Kogyo Kk Brush welding device for brush contact
JPH04100688A (en) * 1990-08-14 1992-04-02 Tsubakimoto Chain Co Work rotating device for laser beam machine
KR100624577B1 (en) 2005-05-18 2006-09-15 주식회사 파스웰드 Universal jig for laser welding machine
ITBG20090012A1 (en) * 2009-03-31 2010-10-01 Laservall Spa LASER WELDING SYSTEM

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