JPS635636U - - Google Patents
Info
- Publication number
- JPS635636U JPS635636U JP1986098260U JP9826086U JPS635636U JP S635636 U JPS635636 U JP S635636U JP 1986098260 U JP1986098260 U JP 1986098260U JP 9826086 U JP9826086 U JP 9826086U JP S635636 U JPS635636 U JP S635636U
- Authority
- JP
- Japan
- Prior art keywords
- board
- lead
- integrated circuit
- printed wiring
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986098260U JPS635636U (en18) | 1986-06-26 | 1986-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986098260U JPS635636U (en18) | 1986-06-26 | 1986-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS635636U true JPS635636U (en18) | 1988-01-14 |
Family
ID=30966032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986098260U Pending JPS635636U (en18) | 1986-06-26 | 1986-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS635636U (en18) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0888250A (ja) * | 1994-09-20 | 1996-04-02 | Nec Corp | Ｔａｂテープおよびｔａｂインナーリードの接合方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010077A (en18) * | 1973-05-23 | 1975-02-01 | ||
| JPS54119877A (en) * | 1978-03-09 | 1979-09-18 | Toshiba Corp | Semiconductor device |
-
1986
- 1986-06-26 JP JP1986098260U patent/JPS635636U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010077A (en18) * | 1973-05-23 | 1975-02-01 | ||
| JPS54119877A (en) * | 1978-03-09 | 1979-09-18 | Toshiba Corp | Semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0888250A (ja) * | 1994-09-20 | 1996-04-02 | Nec Corp | Ｔａｂテープおよびｔａｂインナーリードの接合方法 |