JPH0241474U - - Google Patents
Info
- Publication number
- JPH0241474U JPH0241474U JP12031788U JP12031788U JPH0241474U JP H0241474 U JPH0241474 U JP H0241474U JP 12031788 U JP12031788 U JP 12031788U JP 12031788 U JP12031788 U JP 12031788U JP H0241474 U JPH0241474 U JP H0241474U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- hard resin
- resin sheet
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12031788U JPH0241474U (en18) | 1988-09-13 | 1988-09-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12031788U JPH0241474U (en18) | 1988-09-13 | 1988-09-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0241474U true JPH0241474U (en18) | 1990-03-22 |
Family
ID=31366315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12031788U Pending JPH0241474U (en18) | 1988-09-13 | 1988-09-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0241474U (en18) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006033297A1 (ja) * | 2004-09-21 | 2006-03-30 | Intellectual Property Bank Corp. | Ｌｅｄを実装したユニットの製造方法、ｌｅｄソケット、ｌｅｄ実装用電子回路基板 |
-
1988
- 1988-09-13 JP JP12031788U patent/JPH0241474U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006033297A1 (ja) * | 2004-09-21 | 2006-03-30 | Intellectual Property Bank Corp. | Ｌｅｄを実装したユニットの製造方法、ｌｅｄソケット、ｌｅｄ実装用電子回路基板 |