JPS6356260U - - Google Patents
Info
- Publication number
- JPS6356260U JPS6356260U JP14830086U JP14830086U JPS6356260U JP S6356260 U JPS6356260 U JP S6356260U JP 14830086 U JP14830086 U JP 14830086U JP 14830086 U JP14830086 U JP 14830086U JP S6356260 U JPS6356260 U JP S6356260U
- Authority
- JP
- Japan
- Prior art keywords
- rod
- magnetron sputtering
- magnetic field
- sputtering device
- shaped assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 230000005684 electric field Effects 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- 239000000498 cooling water Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
Description
第１図は本考案の実施例装置を示す要部拡大断
面図、第２図は第１図における―線断面矢視
図である。
１……同軸型マグネトロンスパツタ装置、２…
…ベースプレート、３……上部プレート、４……
減圧ガス空間、５……ターゲツト、６……集合棒
状体、７……冷却管、８……永久磁石、９……支
持プレート、１０……収納管、１１……冷却水排
水口、１２……冷却水導入管、１３……回転軸、
１４……ターゲツト支持体、１５……遮蔽管、１
６……回転自在継手、１７……絶縁リング、１８
……従動歯車、１９……駆動歯車、２０……絶縁
プレート、２１ａ〜２１ｅ……Ｏ―リング、２２
……高圧導入配線。
FIG. 1 is an enlarged cross-sectional view of a main part of an apparatus according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along the line -- in FIG. 1...Coaxial magnetron sputtering device, 2...
...Base plate, 3...Top plate, 4...
Decompressed gas space, 5...Target, 6...Collected rod-shaped body, 7...Cooling pipe, 8...Permanent magnet, 9...Support plate, 10...Storage pipe, 11...Cooling water drain port, 12... ...Cooling water introduction pipe, 13...Rotating shaft,
14...Target support, 15...Shielding tube, 1
6... Rotating universal joint, 17... Insulating ring, 18
... Driven gear, 19 ... Drive gear, 20 ... Insulation plate, 21a to 21e ... O-ring, 22
...High voltage introduction wiring.
Claims (1)
集合棒状体によつて電界と略直交する方向の磁場
を形成してスパツタリングを行なう同軸型マグネ
トロンスパツタ装置において、ターゲツトを前記
集合棒状体のまわりに旋回させる様に構成したこ
とを特徴とする同軸型マグネトロンスパツタ装置
。 In a coaxial magnetron sputtering device that performs sputtering by forming a magnetic field in a direction substantially perpendicular to an electric field using a rod-shaped assembly in which magnetic field-forming materials are arranged non-uniformly in the circumferential direction, the target is placed on the rod-shaped assembly. A coaxial type magnetron sputtering device characterized by being configured so that it can be rotated around.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14830086U JPS6356260U (en) | 1986-09-26 | 1986-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14830086U JPS6356260U (en) | 1986-09-26 | 1986-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6356260U true JPS6356260U (en) | 1988-04-15 |
Family
ID=31062438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14830086U Pending JPS6356260U (en) | 1986-09-26 | 1986-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6356260U (en) |
-
1986
- 1986-09-26 JP JP14830086U patent/JPS6356260U/ja active Pending
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