JPS60152674U - Cathode structure for spatuters - Google Patents
Cathode structure for spatutersInfo
- Publication number
- JPS60152674U JPS60152674U JP3948684U JP3948684U JPS60152674U JP S60152674 U JPS60152674 U JP S60152674U JP 3948684 U JP3948684 U JP 3948684U JP 3948684 U JP3948684 U JP 3948684U JP S60152674 U JPS60152674 U JP S60152674U
- Authority
- JP
- Japan
- Prior art keywords
- cathode
- conductive plate
- capacitance circuit
- cathode structure
- spatuters
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
、 第１図は高周波スパッタ法の一例である複数ター
ゲツト法を説明するための図、第２図ａは高周波スパッ
タ法の一例である複合ターゲツト法を説明するためのタ
ーゲットを示す図、第２図すは第２図ａの側面図、第３
図は本考案になるスパッタ用カソード構造を示す図ミ第
４図はキャパシタンス（容量）を可変する方法の一例を
説明するための図である。
１１・・・カソード、１２・・・ターゲット、１３・・
・基板、１４・・・基板ホルダ、１５・・・冷却水用パ
イプ、１５ａ・・・冷却水導入口、１５ｂ・・・冷却水
排出口、１６・・・軸受部、１７・・・アースシールド
、１８・・・真空槽の外壁、１９・・・絶縁材、２０・
・・駆動歯車、２１・・・被駆動歯車、２２・・田−タ
フイン（第１の導電板）、２３・・・ステータフィン（
第２の導電板）、２４・・・高周波電源入力端子、２５
・・・カップリング・コイ／Ｌ； （ＬＣ）、２６・・
・同調用コンデンサ（Ｃｔ）。, FIG. 1 is a diagram for explaining a multiple target method, which is an example of a high frequency sputtering method, FIG. This is the side view of Figure 2a, Figure 3.
The figure shows the cathode structure for sputtering according to the present invention. FIG. 4 is a diagram for explaining an example of a method of varying capacitance. 11...Cathode, 12...Target, 13...
- Board, 14... Board holder, 15... Cooling water pipe, 15a... Cooling water inlet, 15b... Cooling water outlet, 16... Bearing part, 17... Earth shield , 18... Outer wall of vacuum chamber, 19... Insulating material, 20...
...Drive gear, 21...Driven gear, 22...Tough fin (first conductive plate), 23...Stator fin (
second conductive plate), 24...high frequency power input terminal, 25
...Coupling Koi/L; (LC), 26...
- Tuning capacitor (Ct).
Claims (1)
ソードを回転自在に構成すると共に、前記カソードの回
転軸に第１の導電板を設け、この第１の導電板に対向す
るように第２の導電板を設け、これら第１及び第２の導
電板で静電容量回路を構成し、高周波電源を前記静電容
量回路弁して前記ターゲットに供給し１．かつ、前記静
電容量回路を整合器のカンプリング容量として用うるよ
うにしたことを特徴とするスパッタ用カソード構造。In a high-frequency sputtering apparatus, a cathode that holds a target is configured to be rotatable, a first conductive plate is provided on the rotation axis of the cathode, and a second conductive plate is provided to face the first conductive plate. , a capacitance circuit is configured by these first and second conductive plates, and a high frequency power source is supplied to the target through the capacitance circuit valve; 1. A cathode structure for sputtering, characterized in that the capacitance circuit can be used as a compensating capacitor of a matching box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3948684U JPS60152674U (en) | 1984-03-19 | 1984-03-19 | Cathode structure for spatuters |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3948684U JPS60152674U (en) | 1984-03-19 | 1984-03-19 | Cathode structure for spatuters |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60152674U true JPS60152674U (en) | 1985-10-11 |
Family
ID=30547472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3948684U Pending JPS60152674U (en) | 1984-03-19 | 1984-03-19 | Cathode structure for spatuters |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60152674U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017503074A (en) * | 2013-12-18 | 2017-01-26 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | AC power connector, sputtering apparatus, and method therefor |
-
1984
- 1984-03-19 JP JP3948684U patent/JPS60152674U/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017503074A (en) * | 2013-12-18 | 2017-01-26 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | AC power connector, sputtering apparatus, and method therefor |
| CN110942971A (en) * | 2013-12-18 | 2020-03-31 | 应用材料公司 | AC power connector, sputtering apparatus and method thereof |
| US10818475B2 (en) | 2013-12-18 | 2020-10-27 | Applied Materials, Inc. | AC power connector, sputtering apparatus and method therefor |
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