JPS6355577U - - Google Patents
Info
- Publication number
- JPS6355577U JPS6355577U JP14928386U JP14928386U JPS6355577U JP S6355577 U JPS6355577 U JP S6355577U JP 14928386 U JP14928386 U JP 14928386U JP 14928386 U JP14928386 U JP 14928386U JP S6355577 U JPS6355577 U JP S6355577U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- package
- semiconductor package
- semiconductor
- shield plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000003779 heat-resistant material Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14928386U JPS6355577U (US20050075337A1-20050407-C00081.png) | 1986-09-29 | 1986-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14928386U JPS6355577U (US20050075337A1-20050407-C00081.png) | 1986-09-29 | 1986-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6355577U true JPS6355577U (US20050075337A1-20050407-C00081.png) | 1988-04-14 |
Family
ID=31064344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14928386U Pending JPS6355577U (US20050075337A1-20050407-C00081.png) | 1986-09-29 | 1986-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6355577U (US20050075337A1-20050407-C00081.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7134592B2 (en) | 2001-03-13 | 2006-11-14 | Daimlerchrysler Ag | Method and protection apparatus for installation of a temperature-sensitive electronic component |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54107257A (en) * | 1978-02-09 | 1979-08-22 | Fujitsu Ltd | Semiconductor device mounting method |
| JPS5683927A (en) * | 1979-12-12 | 1981-07-08 | Fujitsu Ltd | Replacement of semiconductor chip carrier |
| JPS5910298A (ja) * | 1982-07-09 | 1984-01-19 | 株式会社日立製作所 | 半導体装置の半田浸漬用治具 |
| JPS5994897A (ja) * | 1982-11-24 | 1984-05-31 | 太陽誘電株式会社 | 混成集積回路の製造方法 |
-
1986
- 1986-09-29 JP JP14928386U patent/JPS6355577U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54107257A (en) * | 1978-02-09 | 1979-08-22 | Fujitsu Ltd | Semiconductor device mounting method |
| JPS5683927A (en) * | 1979-12-12 | 1981-07-08 | Fujitsu Ltd | Replacement of semiconductor chip carrier |
| JPS5910298A (ja) * | 1982-07-09 | 1984-01-19 | 株式会社日立製作所 | 半導体装置の半田浸漬用治具 |
| JPS5994897A (ja) * | 1982-11-24 | 1984-05-31 | 太陽誘電株式会社 | 混成集積回路の製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7134592B2 (en) | 2001-03-13 | 2006-11-14 | Daimlerchrysler Ag | Method and protection apparatus for installation of a temperature-sensitive electronic component |
