JPS6355551U - - Google Patents
Info
- Publication number
- JPS6355551U JPS6355551U JP14895786U JP14895786U JPS6355551U JP S6355551 U JPS6355551 U JP S6355551U JP 14895786 U JP14895786 U JP 14895786U JP 14895786 U JP14895786 U JP 14895786U JP S6355551 U JPS6355551 U JP S6355551U
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- conductor layer
- solder
- mount element
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14895786U JPS6355551U (US20050065096A1-20050324-C00069.png) | 1986-09-29 | 1986-09-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14895786U JPS6355551U (US20050065096A1-20050324-C00069.png) | 1986-09-29 | 1986-09-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6355551U true JPS6355551U (US20050065096A1-20050324-C00069.png) | 1988-04-14 |
Family
ID=31063708
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14895786U Pending JPS6355551U (US20050065096A1-20050324-C00069.png) | 1986-09-29 | 1986-09-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6355551U (US20050065096A1-20050324-C00069.png) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017138555A1 (ja) * | 2016-02-12 | 2017-08-17 | 株式会社村田製作所 | リード線付き電子部品 |
JP2019186321A (ja) * | 2018-04-05 | 2019-10-24 | ローム株式会社 | 半導体装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS596865B2 (ja) * | 1975-05-22 | 1984-02-15 | オオツカセイヤク カブシキガイシヤ | 5−((2− ハロゲノ −1− ヒドロキシ ) アルキル ) カルボスチリルユウドウタイノセイゾウホウ |
-
1986
- 1986-09-29 JP JP14895786U patent/JPS6355551U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS596865B2 (ja) * | 1975-05-22 | 1984-02-15 | オオツカセイヤク カブシキガイシヤ | 5−((2− ハロゲノ −1− ヒドロキシ ) アルキル ) カルボスチリルユウドウタイノセイゾウホウ |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017138555A1 (ja) * | 2016-02-12 | 2017-08-17 | 株式会社村田製作所 | リード線付き電子部品 |
CN108369865A (zh) * | 2016-02-12 | 2018-08-03 | 株式会社村田制作所 | 带引线的电子部件 |
JPWO2017138555A1 (ja) * | 2016-02-12 | 2018-09-20 | 株式会社村田製作所 | リード線付き電子部品 |
CN108369865B (zh) * | 2016-02-12 | 2019-10-15 | 株式会社村田制作所 | 带引线的电子部件 |
JP2019186321A (ja) * | 2018-04-05 | 2019-10-24 | ローム株式会社 | 半導体装置 |