JPS6355435U - - Google Patents
Info
- Publication number
- JPS6355435U JPS6355435U JP1986148154U JP14815486U JPS6355435U JP S6355435 U JPS6355435 U JP S6355435U JP 1986148154 U JP1986148154 U JP 1986148154U JP 14815486 U JP14815486 U JP 14815486U JP S6355435 U JPS6355435 U JP S6355435U
- Authority
- JP
- Japan
- Prior art keywords
- thin metal
- metal wire
- spool
- capillary
- points
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/0711—
-
- H10W72/07141—
-
- H10W72/07168—
-
- H10W72/07502—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986148154U JPS6355435U (cg-RX-API-DMAC10.html) | 1986-09-26 | 1986-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986148154U JPS6355435U (cg-RX-API-DMAC10.html) | 1986-09-26 | 1986-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6355435U true JPS6355435U (cg-RX-API-DMAC10.html) | 1988-04-13 |
Family
ID=31062168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986148154U Pending JPS6355435U (cg-RX-API-DMAC10.html) | 1986-09-26 | 1986-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6355435U (cg-RX-API-DMAC10.html) |
-
1986
- 1986-09-26 JP JP1986148154U patent/JPS6355435U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6355435U (cg-RX-API-DMAC10.html) | ||
| JPS596839U (ja) | 半導体装置 | |
| JPS6422046U (cg-RX-API-DMAC10.html) | ||
| JPS63149627U (cg-RX-API-DMAC10.html) | ||
| JPS61203564U (cg-RX-API-DMAC10.html) | ||
| JPS5883157U (ja) | 樹脂封止半導体装置 | |
| JPS5937536U (ja) | 温度センサ | |
| JPS6142840U (ja) | 半導体装置 | |
| JPS5858354U (ja) | 半導体装置用リ−ドフレ−ム | |
| JPS63131128U (cg-RX-API-DMAC10.html) | ||
| JPH01126382U (cg-RX-API-DMAC10.html) | ||
| JPS58193602U (ja) | サ−ミスタ | |
| JPS6073249U (ja) | 樹脂封止半導体装置 | |
| JPS58422U (ja) | ワイヤボンデイングの接続構造 | |
| JPS6278762U (cg-RX-API-DMAC10.html) | ||
| JPS6339902U (cg-RX-API-DMAC10.html) | ||
| JPS59140431U (ja) | コンデンサ | |
| JPH0365245U (cg-RX-API-DMAC10.html) | ||
| JPS6262440U (cg-RX-API-DMAC10.html) | ||
| JPS59135881U (ja) | 抵抗溶接治具 | |
| JPS63201346U (cg-RX-API-DMAC10.html) | ||
| JPS60151132U (ja) | 半導体装置 | |
| JPS61136568U (cg-RX-API-DMAC10.html) | ||
| JPS5856446U (ja) | 樹脂封止半導体装置 | |
| JPS6037253U (ja) | 半導体装置 |