JPS6354217B2 - - Google Patents

Info

Publication number
JPS6354217B2
JPS6354217B2 JP56110659A JP11065981A JPS6354217B2 JP S6354217 B2 JPS6354217 B2 JP S6354217B2 JP 56110659 A JP56110659 A JP 56110659A JP 11065981 A JP11065981 A JP 11065981A JP S6354217 B2 JPS6354217 B2 JP S6354217B2
Authority
JP
Japan
Prior art keywords
substrate
molybdenum
tungsten
thin
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56110659A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5814541A (ja
Inventor
Hideo Koizumi
Tadashi Morita
Yoshio Fukuhara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP11065981A priority Critical patent/JPS5814541A/ja
Publication of JPS5814541A publication Critical patent/JPS5814541A/ja
Publication of JPS6354217B2 publication Critical patent/JPS6354217B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492Bases or plates or solder therefor
    • H01L23/4924Bases or plates or solder therefor characterised by the materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP11065981A 1981-07-17 1981-07-17 半導体素子用基板 Granted JPS5814541A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11065981A JPS5814541A (ja) 1981-07-17 1981-07-17 半導体素子用基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11065981A JPS5814541A (ja) 1981-07-17 1981-07-17 半導体素子用基板

Publications (2)

Publication Number Publication Date
JPS5814541A JPS5814541A (ja) 1983-01-27
JPS6354217B2 true JPS6354217B2 (en, 2012) 1988-10-27

Family

ID=14541229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11065981A Granted JPS5814541A (ja) 1981-07-17 1981-07-17 半導体素子用基板

Country Status (1)

Country Link
JP (1) JPS5814541A (en, 2012)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0224431U (en, 2012) * 1988-08-04 1990-02-19
US7169344B2 (en) 2002-04-26 2007-01-30 L&L Products, Inc. Method of reinforcing at least a portion of a structure
USRE44796E1 (en) 2000-06-12 2014-03-11 Zephyros, Inc. Bladder system for reinforcing a portion of a longitudinal structure

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0690828B2 (ja) * 1983-09-14 1994-11-14 日本ビクター株式会社 磁気記録再生装置
JPS61136269A (ja) * 1984-12-07 1986-06-24 Hitachi Ltd 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0224431U (en, 2012) * 1988-08-04 1990-02-19
USRE44796E1 (en) 2000-06-12 2014-03-11 Zephyros, Inc. Bladder system for reinforcing a portion of a longitudinal structure
US7169344B2 (en) 2002-04-26 2007-01-30 L&L Products, Inc. Method of reinforcing at least a portion of a structure

Also Published As

Publication number Publication date
JPS5814541A (ja) 1983-01-27

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