JPS6352966A - Method of polishing both surfaces of workpiece - Google Patents
Method of polishing both surfaces of workpieceInfo
- Publication number
- JPS6352966A JPS6352966A JP61193245A JP19324586A JPS6352966A JP S6352966 A JPS6352966 A JP S6352966A JP 61193245 A JP61193245 A JP 61193245A JP 19324586 A JP19324586 A JP 19324586A JP S6352966 A JPS6352966 A JP S6352966A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- holder
- polishing
- adhesive
- accuracy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007517 polishing process Methods 0.000 title description 2
- 239000000853 adhesive Substances 0.000 claims abstract description 36
- 238000005498 polishing Methods 0.000 claims abstract description 26
- 230000001070 adhesive effect Effects 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000003746 surface roughness Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/048—Lapping machines or devices; Accessories designed for working plane surfaces of sliders and magnetic heads of hard disc drives or the like
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
この発明は、磁気ヘッド製造工程中の両面研磨方法に関
するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to a double-sided polishing method during the manufacturing process of a magnetic head.
従来の技術
近年、研磨加工技術は超精密加工が可能であり、特にラ
ッピング・ポリッシングは容易に高精度の平行平面の研
磨を行うことができるため、その用途も多種多様であり
、その中でガラス・フェライト等の非金属硬脆材料の精
密加工に生かされている例が最近きわめて多くなってい
る。特に、磁気ヘッド製造工程に関しては、不可欠な加
工法となっており、ヘッドコア半休を突き合わせて接着
し、きわめて狭い空隙を形成するためや、複数基板と金
属薄板を積層接着し量産性を高める工法では互いの基板
間の接着強４度を保つために、構成材料の高精度の平行
平面が必要であり、そのための研磨方法と精度の管理が
必要となっている。Conventional technology In recent years, polishing technology has enabled ultra-precision processing, and in particular, lapping and polishing can easily polish parallel planes with high precision, so its applications are diverse, among which glass・Recently, there have been many examples of its use in precision machining of non-metallic hard brittle materials such as ferrite. In particular, it has become an indispensable processing method in the magnetic head manufacturing process. It is used to butt and bond half the head core together to form an extremely narrow gap, and to stack and bond multiple substrates and thin metal plates to increase mass production. In order to maintain the adhesive strength of 4 degrees between the substrates, highly accurate parallel planes of the constituent materials are required, and polishing methods and precision management are required for this purpose.
従来の両面研磨方法は、ホルダに固定した被加工物の第
１の面を必要な表面仕上げ精度に研磨した後、−旦ホル
ダより取りはずし裏返して再びホルダに固定し、先に加
工した第１の面の裏面（第２の面）を研磨加工するとい
う貼り変え法で行っていた。In the conventional double-sided polishing method, after polishing the first side of the workpiece fixed to the holder to the required surface finish accuracy, it is removed from the holder, turned over, and fixed to the holder again, and the first side of the workpiece that was processed earlier is polished. This was done using a re-adhesive method in which the back side (second side) was polished.
発明が解決しようとする問題点
しかし、上記の研磨方法では被加工物の第１の面の加工
後ホルダより取りはずした際に、研磨加工されている第
１の面とされていない第２の面の加工ひずみの差により
大きな反りを生じ、第２の面の研磨加工後、前記の反り
の影響から必要とされている精度の平行度が得られない
という問題があった。Problems to be Solved by the Invention However, in the above polishing method, when the workpiece is removed from the holder after processing the first surface of the workpiece, the first surface that has been polished and the second surface that has not been polished are separated. A large warpage occurs due to the difference in processing strain, and after polishing the second surface, the required accuracy of parallelism cannot be obtained due to the influence of the warp.
そこで、前記の問題点を解決する方法として上記の貼り
変え法で被加工物の両面を研磨した後、再び同じ研磨方
法を繰り返し行う方法により、被加工物の両面の加工ひ
ずみを同等化でき必要とされる被加工物の加工面の反り
精度を得ることが可能となった。しかし、工数の増加に
より量産性。Therefore, as a method to solve the above problem, after polishing both sides of the workpiece using the above-mentioned repositioning method, the same polishing method is repeated again to equalize the processing strain on both sides of the workpiece. It has become possible to obtain the warpage accuracy of the machined surface of the workpiece. However, mass production is not possible due to the increase in man-hours.
作業性を悪くしていた。This made workability worse.
また、両面同時研磨機械を使用し研磨加工する方法も用
いられるが、被加工物の両面の端面ダレが発生し易いこ
とや工具の平行平面度の精度およびその他加工条件の管
理が難しいなどの問題があった。In addition, a method of polishing using a double-sided simultaneous polishing machine is also used, but there are problems such as sag on both sides of the workpiece, and difficulty in controlling the accuracy of the parallel flatness of the tool and other machining conditions. was there.
問題点を解決するための手段
前記問題点を解決するため本発明の両面研ハク方法は、
第１のホルダに固定した被加工物の第１の面の研磨加工
を行った後、被加工物を第１のホルダに固定しである状
態で被加工物の第１の面に第２のホルダを固定し、その
後に第１のホルダを取りはずし、そして被加工物の第２
の面の研磨加工を行うものである。Means for Solving the Problems In order to solve the above problems, the double-side polishing method of the present invention includes:
After polishing the first surface of the workpiece fixed to the first holder, the second surface of the workpiece is polished while the workpiece is fixed to the first holder. Fix the holder, then remove the first holder, and then remove the second holder from the workpiece.
The surface is polished.
作用
本発明は、上記した構成によって被加工物の第１の面の
研磨加工後、第１のホルダに被加工物を固定したそのま
まの状態で被加工物の第１の面に第２のホルダを固定し
第１のホルダを被加工物より取りはずす、以上のような
両面の研磨が終了するまで被加工物をホルダから一度も
取りはずさない移し変え法を採用しているため被加工物
に大きな反りを生しさすことなく加工面の高精度な平面
を保つことができ、その方法も簡華で工数も小さく安価
に両面研磨できるものである。Effect of the present invention With the above-described configuration, after polishing the first surface of the workpiece, the second holder is attached to the first surface of the workpiece while the workpiece is fixed to the first holder. This method uses a transfer method in which the first holder is fixed and removed from the workpiece, and the workpiece is never removed from the holder until both sides have been polished, so there is no possibility of large warpage in the workpiece. It is possible to maintain a highly accurate flatness of the machined surface without causing any scratches, and the method is simple and requires less man-hours, allowing both sides to be polished at low cost.
実施例
以下に本発明の一実施例の両面研磨方法について図面を
参照にしながら説明する。EXAMPLE A double-sided polishing method according to an example of the present invention will be described below with reference to the drawings.
（実施例１）
まず、第１図に示すように高精度の平面を有する第１の
ホルダ１上に、融解温度１２０℃程度の熱融解性の第１
の接着剤４を介して被加工物３を接着し、被加工物３の
第１の面３ａを所定の平面度および面粗さに研磨加工を
行う。(Example 1) First, as shown in FIG.
The workpiece 3 is bonded to the workpiece 3 via the adhesive 4, and the first surface 3a of the workpiece 3 is polished to a predetermined flatness and surface roughness.
次に第２図は、第１図で示した第１のホルダｌに固定さ
れた被加工物３の第１の面３ａに高精度の平面を有する
第２のホルダ２を密着させ、被加工物３と第２のホルダ
２の密着外端部に非ｊｌｔｌ熱性の第２の接着剤５とし
て、第１の接着剤４の融解温度で接着強度が劣化しない
瞬間接着剤を適量滴下し固定した側面図をあられしてお
り、その後に第１のホルダ１を第１の接着剤４の融解温
度まで加熱し被加工物３より取りはずす。前記、第２の
接着剤５は第１の接着剤４と同し熱融解性接着剤ではホ
ルダの接着またはＭ１）離時に熱により接着剤のゆるみ
や接着強度の低下をまねくため、熱による影響を受けな
い非加熱性の接着剤を使用する。Next, in FIG. 2, the second holder 2 having a highly accurate plane is brought into close contact with the first surface 3a of the workpiece 3 fixed to the first holder l shown in FIG. An appropriate amount of instant adhesive whose adhesive strength does not deteriorate at the melting temperature of the first adhesive 4 was dropped and fixed as a non-thermal second adhesive 5 on the outer end of the object 3 and the second holder 2 in close contact with each other. After that, the first holder 1 is heated to the melting temperature of the first adhesive 4 and removed from the workpiece 3. The second adhesive 5 is the same as the first adhesive 4, and when using a heat-melting adhesive, the heat may cause the adhesive to loosen or reduce adhesive strength when the holder is bonded or separated (M1), so it is not affected by heat. Use a non-heatable adhesive that will not be damaged by heat.
さらに第３図では、第２のホルダ２に移し変えられた被
加工物３の第２の面３ｂを任意の厚み寸法と平面度およ
び第１の面３ａと同等の面粗さに研磨加工を行う。上記
のように被加工物３の両面を同等の仕上面に研磨加工す
ることによれば加工ひずみが同等化され反りを最小限に
押さえる効果を有する。前記の加工後、第２のホルダ２
を瞬間接着剤の剥離剤のアセトン液中に浸ン貞させ超音
波により第２の接着剤５を溶解させ被加工物３を取りは
ずす。これで両面研磨が終了する。Furthermore, in FIG. 3, the second surface 3b of the workpiece 3 transferred to the second holder 2 is polished to an arbitrary thickness, flatness, and surface roughness equivalent to the first surface 3a. conduct. By polishing both surfaces of the workpiece 3 to have the same finished surface as described above, the processing strain is equalized and warpage is minimized. After the above processing, the second holder 2
The second adhesive 5 is immersed in an acetone solution, which is an instant adhesive release agent, and the second adhesive 5 is dissolved by ultrasonic waves, and the workpiece 3 is removed. This completes double-sided polishing.
以上のような方ｊ五によれば、第５図のような磁気ヘッ
ドの構成材料として使用されているフェライト６とガラ
ス７の複合材で外径寸法２８Ｘ１５×１で両面を鏡面に
研磨加工を行った被加工物３の平行度は０．５μ以内で
従来の貼り変え方法による平面度の１〜２μよりすぐれ
ている。According to the above person, a composite material of ferrite 6 and glass 7, which is used as a constituent material of a magnetic head as shown in Fig. 5, has an outer diameter of 28 x 15 x 1 and is polished to a mirror finish on both sides. The parallelism of the processed workpiece 3 was within 0.5μ, which is superior to the flatness of 1 to 2μ obtained by the conventional re-pasting method.
（実施例２）
第１の接着剤４を非加熱性接着剤として、紫外線により
硬化する感光性樹脂を使用し、第２の接着剤５を非加熱
性接着剤として瞬間接着剤を使用する実施例１と同様の
研磨方法。感光性樹脂の剥離剤はジクロルエタンを用い
瞬間接着剤を侵さないものとする。(Example 2) An implementation in which a photosensitive resin that is cured by ultraviolet rays is used as the first adhesive 4 as a non-heatable adhesive, and an instant adhesive is used as the second adhesive 5 as a non-heatable adhesive. Polishing method similar to Example 1. Dichloroethane is used as a release agent for the photosensitive resin so that it does not attack the instant adhesive.
以上のような方法においても実施例１と同様の効果を有
し、加熱しないことから熱による変形。The above method also has the same effect as in Example 1, and since no heating is performed, no deformation due to heat occurs.
膨張などの影響が大きい被加工物３に対して有効な手段
である。This is an effective means for the workpiece 3 that is greatly affected by expansion and the like.
発明の効果
以上のように本発明によれば、加工能率の向上と安定に
高精度の平行平面が得られるため、量産性１作業性が良
くすぐれた実用的な発明である。Effects of the Invention As described above, according to the present invention, it is possible to improve machining efficiency and to stably obtain highly accurate parallel planes, so it is a practical invention that is excellent in mass production and workability.
第１図は本発明における第１のホルダ１に被加工物３を
固定している斜視図、第２図は第１図に示す被加工物３
の第１の而３ａに第２のホルダ２を固定した側面図、第
３図は第２図の第１のホルダ１を取りはずした斜視図、
第４図は本発明の一実施例における被加工物の一例を示
す斜視図である。
１・・・・・・第１のホルダ、２・・・・・・第２のホ
ルダ、３・・・・・・被加工物、３ａ・・・・・・第１
の面、３ｂ・・・・・・第２の面、４・・・・・・第１
の接着剤、５・・・・・・第２の接着剤。
代理人の氏名 弁理士 中尾敏男 はか１名■
！耘 戯FIG. 1 is a perspective view of a workpiece 3 fixed to the first holder 1 according to the present invention, and FIG. 2 is a perspective view of the workpiece 3 shown in FIG.
Fig. 3 is a side view of the second holder 2 fixed to the first holder 3a, and Fig. 3 is a perspective view with the first holder 1 of Fig. 2 removed.
FIG. 4 is a perspective view showing an example of a workpiece in an embodiment of the present invention. 1...First holder, 2...Second holder, 3...Workpiece, 3a...First
surface, 3b...second surface, 4....first
adhesive, 5... second adhesive. Name of agent: Patent attorney Toshio Nakao Haka1 person■
! Yugi
Claims (3)
被加工物の第１の面に研磨加工を行い、前記第１の面に
第２のホルダを固定した後、第１のホルダを取りはずし
被加工物の第２の面に研磨加工を行うことを特徴とする
両面研磨方法。(1) Fix the workpiece to the first holder, polish the first surface of the workpiece by a polishing method, fix the second holder to the first surface, and then A double-sided polishing method characterized by removing the holder and polishing the second surface of the workpiece.
着剤として熱融解性接着剤、第２のホルダに固定する際
に第２の接着剤として非加熱性接着剤を使用することを
特徴とする特許請求の範囲第（１）項記載の両面研磨方
法。(2) A heat-melting adhesive is used as the first adhesive when fixing the workpiece to the first holder, and a non-heating adhesive is used as the second adhesive when fixing the workpiece to the second holder. A double-sided polishing method according to claim (1), characterized in that:
着剤として非加熱性接着剤、第２のホルダに固定する際
に第２の接着剤として非加熱性接着剤を使用することを
特徴とする特許請求の範囲第（１）項記載の両面研磨方
法。(3) A non-heating adhesive is used as the first adhesive when fixing the workpiece to the first holder, and a non-heating adhesive is used as the second adhesive when fixing the workpiece to the second holder. A double-sided polishing method according to claim (1), characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61193245A JPS6352966A (en) | 1986-08-19 | 1986-08-19 | Method of polishing both surfaces of workpiece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61193245A JPS6352966A (en) | 1986-08-19 | 1986-08-19 | Method of polishing both surfaces of workpiece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6352966A true JPS6352966A (en) | 1988-03-07 |
Family
ID=16304745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61193245A Pending JPS6352966A (en) | 1986-08-19 | 1986-08-19 | Method of polishing both surfaces of workpiece |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6352966A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02192817A (en) * | 1989-01-19 | 1990-07-30 | Showa Alum Corp | Extrusion die for hollow section |
-
1986
- 1986-08-19 JP JP61193245A patent/JPS6352966A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02192817A (en) * | 1989-01-19 | 1990-07-30 | Showa Alum Corp | Extrusion die for hollow section |
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