JPS6352789A - Laser beam machine - Google Patents
Laser beam machineInfo
- Publication number
- JPS6352789A JPS6352789A JP61195974A JP19597486A JPS6352789A JP S6352789 A JPS6352789 A JP S6352789A JP 61195974 A JP61195974 A JP 61195974A JP 19597486 A JP19597486 A JP 19597486A JP S6352789 A JPS6352789 A JP S6352789A
- Authority
- JP
- Japan
- Prior art keywords
- chips
- workpiece
- work
- slope member
- dropped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005284 excitation Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000005520 cutting process Methods 0.000 abstract description 5
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 238000003754 machining Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、複数の支持ビン上に、載置されたワークを
レーザ光により加工し、加工済のワークを隣位する支持
ピンの間を通して落下させるレーザ加工装置、特に落下
してきた加工済のワークを搬出する搬出装置の改良に関
するものである。[Detailed Description of the Invention] [Industrial Application Field] This invention processes workpieces placed on a plurality of support bins using a laser beam, and passes the processed workpieces between adjacent support pins. The present invention relates to an improvement in a dropping laser processing device, and in particular, to an unloading device for unloading a dropped processed workpiece.
［従来の技術］
第２図および第３図は、例えば実公昭５１−２８３９８
号公報に示されているレーザ加工装置と類似の従来のレ
ーザ加工装置をそれぞれ示すもので、図中、（１）は所
定間隔で配された複数の支持ピンで、先端が尖った剣状
又は先端が尖った細長い山形状をなしている。（２）は
この支持ピン（１）」二に載置されたワークで、集光レ
ンズ（３）で集光したレーザ光（４）が照射されてレー
ザ加工が行なわれる。（５）は加工済ワークで、隣位す
る支持ピン（１）の間を通して下方に落下する。（６）
は落下してきた加工済ワーク（５）を受ける容器で、所
定数の加工済ワーク（５）がたまった後、加工位置外に
搬出される。（７）は落下してきた加工済ワーク（５）
を受けるベルトコンベアで、図示しない駆動用モータで
常時駆動されて加工済ワーク（５）を加工位置外の容器
（８）まで搬送する。[Prior art] Figures 2 and 3 are based on, for example, Japanese Utility Model Publication No. 51-28398.
The figure shows a conventional laser processing device similar to the laser processing device shown in the publication. It has an elongated mountain shape with a pointed tip. (2) is a workpiece placed on this support pin (1), and is irradiated with a laser beam (4) focused by a condenser lens (3) to perform laser processing. (5) is a processed workpiece, which passes between adjacent support pins (1) and falls downward. (6)
is a container for receiving fallen processed workpieces (5), and after a predetermined number of processed workpieces (5) have accumulated, they are carried out of the processing position. (7) is the fallen processed workpiece (5)
The belt conveyor is constantly driven by a drive motor (not shown) to transport the processed workpiece (5) to a container (8) outside the processing position.
従来の１７−ザ加工装置は−１，記のように構成され、
ワーク（２）は支ＩＳピン（１）上に載置された状態で
１７−ザ光（４）により加りされ、加１゛済ワーク（５
）は隣位する支持ビン（］、）の間を通してド方に落ド
する。そして第２図に小すレーザ加圧装置の場合には、
落Ｔ’してきた加工済ワーク（５）は容器（６）内に収
容され、加工済ワー１（５）が所定数たまった後、容器
（６）は加圧位置外に搬出される。The conventional 17-za processing device is configured as shown in -1.
The workpiece (2) placed on the support IS pin (1) is loaded by the light beam (4) 17, and the processed workpiece (5
) falls in the direction of Do through between the adjacent support bins ( ], ). In the case of the laser pressurizing device shown in Fig. 2,
The processed workpiece (5) that has fallen T' is stored in a container (6), and after a predetermined number of processed workpieces 1 (5) have accumulated, the container (6) is carried out of the pressurizing position.
また第３図に示すレーザ加Ｉ：装ｆ／ｉの場合には、落
下してきた前二り済ワーク（５）ｔ′；ｌ＜ルトコ：ノ
ベア（７）で受けられ、順次容器（８）に収容される。In addition, in the case of the laser processing I: installation f/i shown in FIG. be accommodated in.
［発明が解決しようとする問題点］
」−記のような従来の１７一ザ加丁装置において、第２
図に示す構造のものは、所定数の加［］済ワーク（５）
が容器（６）内にたまった後に容ＫＨｆｉ）を加工位置
外に搬出する方法を採っているため、容器（６）内の加
工済ワーク（５）がレーザ光（４）により損傷するおそ
れがあり、また多数の支持ビン（１）が配される大きな
加−しデー・プルの場合には、容器（６）の大きさに限
度があるため適用できないという問題がある。[Problems to be solved by the invention] In the conventional 17-piece cutting device as described above, the second
The structure shown in the figure has a predetermined number of added works (5).
Since a method is adopted in which the workpiece (KHfi) is carried out of the processing position after it accumulates in the container (6), there is a risk that the processed workpiece (5) in the container (6) will be damaged by the laser beam (4). In addition, there is a problem that this method cannot be applied to a large replenishment pull where a large number of support bins (1) are arranged because there is a limit to the size of the container (6).
・方、第３図に示４ものは、加工済ワーク（５）が順次
ベルトコン＜７Ｃ７）ｆ搬送されるため、加「済ワーク
（５）が１／・−ザ光（４）により損傷するごとはない
が、ベルトコンベア（７）は高価で、しかも搬出装置が
大形となるとい）問題がある。- On the other hand, in the case of 4 shown in Fig. 3, the processed workpiece (5) is sequentially conveyed by the belt controller, so the processed workpiece (5) is damaged by the light (4). Although this is not the case, there are problems in that the belt conveyor (7) is expensive and the delivery device is large.
また、従来の］／−ザ加１゛装置は、いずれ１）加工済
ワ・−り（５）と切り粉とが混っ−Ｃ容器（Ｂ）、（８
）内に収容されるため、次Ｉ”程において゛これを分画
しなければならｔ、作業が容易でないという問題もある
。In addition, the conventional]/-thermal processing equipment will eventually 1) process the processed workpiece (5) and chips into the -C container (B), (8).
), there is also the problem that it must be fractionated in the next step, which is not an easy task.
ζ二の発明は、かかる問題点を解決するためになされた
もので、加工済ワークの１７−ザ光による損傷を防１１
−でき、１．７かも加工済ワークを切り粉と完全に分離
した状態；で加工位置外し、″搬出でき、また搬出装置
を小型、安価に構成Ｃきるｌ／−ザ加１：装置を得るこ
とを［１的どする。The invention of ζ2 was made in order to solve this problem, and it prevents the processed workpiece from being damaged by 17-the light.
- It is possible to remove the machined workpiece from the machining position and carry it out in a state where it is completely separated from the chips, and the carrying-out device can be configured to be small and inexpensive. To do something like [1 target].
［問題点を解決するだめの手段１
この発明に係るレーザ加工装置は、支）、〜ビンのド方
位置に、多数の小開］−１を有し・端に向かってで傾斜
する斜面部材を設けるとどもに、この斜面部材な加振機
構により加振し、落ドしてきた加■二済のワークを、斜
面部材１−を滑らせ−て加１−位置外に搬出するように
したものである。[Means for Solving the Problems 1] The laser processing apparatus according to the present invention has a slope member having a large number of small openings at positions on the side of the bottle and tilting toward the end. is provided, and the slope member is vibrated by the vibration excitation mechanism so that the dropped workpiece, which has been machined, is carried out of the working position by sliding the slope member 1-. It is something.
［作用ｊ
この発明においては、文士１ビンのド方位置に斜面部材
を配置し、支持ビンの間から落下【７てきた加■二済の
ワークを、斜面部材上を滑らせて加Ｔ召１′を置外に搬
出するように１．ているので、加「済ワークのレーザ光
による損傷を防１１−できる。また斜面部材は多数の小
開］−１を有しく二おり、しかも加振機構により加振さ
れるので、斜面部材を滑る間に加工済のワー りと切り
粉とが分離されて切り粉は斜面部材の小開口から落ド１
１、したかっ−ｒ、加１位置外に前二［済のワー りの
みを搬出Ｃきる。また駆動系は加振機構のみであるのＣ
搬出装置の構成を簡略小形化できる。[Function j] In this invention, a slope member is placed on the side of the first bin, and the workpiece that has fallen from between the support bins is slid on the slope member and 1. This prevents damage to the processed workpiece by the laser beam.In addition, the slope member has a large number of small openings, and is excited by the vibration mechanism, so that the slope member can be prevented from being damaged by the laser beam. During sliding, the machined workpiece and chips are separated and the chips fall through the small opening of the slope member.
1. I want to carry out only the previous two [finished workpieces] outside of the first position. Also, the drive system is only the vibration mechanism.
The configuration of the unloading device can be simplified and downsized.
し実施例］
第１図はこの発明の一実施例を示すもので、図中、第２
図および第７３図と同一０壮は同−又は相″Ｉ′１部分
をノ（＜−”ｌ−０（９）は支持ビン（１）のＦ方位置
に配置きれ一端縁に向かって傾斜する斜面部材で、例え
ば所遁！メツシュの網材あるいはパンチングボードＡ・
、板面に多数の小開［］をイ１する部）−イで形成され
、加工済ワーク（５）とともに隣位する支持ビン（１）
の間を通して釉ドし−できた切り粉（１０）は、上記小
開口を合して落下［２斜面部材（９）ド方の受は間（１
１）に抽象される９、１−うにな−〕ｒいるとどもＩご
、加ｆ済ワー・り（５）は、斜面部材（９）ｌ−を滑っ
て加工位置外の容器（８）内に収容、〜れるようになっ
ている。（１２）はｌ記斜面部材（９）に振動なＩｊえ
るバイブ］／−・りＣ１斜面部材（９）を加振するご＋
＞−８ｊより、加−１”済ワータ（５）とし１り粉（１
０）どの分離が促進されるとともに、加工済ワーク（５
）の斜面部＃ （９） −１；、 ｅの滑動が促進され
る９、１記のよ５ ＋１１ ｉＪ成、′″−］−また１
、・−田／ＩＩＩ Ｌ装置におい（”１３、Ｌ／ −−
−ｊＪ’Ｘ、（４） ｃｒ） ”） り（２） ヘ（
ｒ） 照Ｊ ｌ−’： 、ｊ： り切断さねた加［済ワ
−；Ｆ（５）ｉＪ、すＪ断時に牛じる切り粉（ｌＯ）と
ともに、隣位する支持ビン（１）の間を通って斜面部材
（９）上に落下する。斜面部材（９）は、バイブレータ
（１２）により振動がケーえられているので、加工済ワ
ーク（５）と切り粉（１０）とが分離され、切り粉（ｌ
Ｏ）は、斜面部材（９）の小開口を通して落下し受は皿
（１１）に捕集され、また加工済ワーク（５）は、斜面
部材（９）の上を滑って加工位置外の容器（８）に収容
される。Embodiment] FIG. 1 shows an embodiment of the present invention.
0 (9) is the same as the figure and Fig. 73, and the phase ``I'1 part is the same as the ``I''1 part. For example, Tokoron! mesh material or punching board A.
, a support bin (1) formed with a large number of small openings on the plate surface (A)-A, and adjacent to the machined workpiece (5).
The glazed chips (10) fall through the gap between the two slope members (9) and fall through the small openings.
1) Abstracted from 9, 1-Una-]R, the added workpiece (5) slides on the slope member (9) and the container (8) outside the machining position. It is designed to be housed inside. (12) is a vibration vibration applied to the slope member (9)]/-・When the slope member (9) is vibrated
> From -8j, add 1" added water (5) and ground flour (1
0) Which separation is promoted and processed workpiece (5
) slope part # (9) -1;, sliding of e is promoted 5 +11 iJ formation, '''-] - and 1
,・-田/III L device smell ("13, L/ --
-jJ'X, (4) cr) ”) ri (2) he (
r) Teru J l-': , j: Cutting process finished work; F (5) It passes through the gap and falls onto the slope member (9). Since the slope member (9) is vibrated by the vibrator (12), the machined workpiece (5) and the chips (10) are separated, and the chips (l
O) falls through the small opening of the slope member (9) and is collected by the tray (11), and the processed workpiece (5) slides on the slope member (9) and falls into a container outside the processing position. It is accommodated in (8).
［発明の効果］
この発明は以」二説明したとおり、支持ビンの下方位置
に、多数の小開口を有し一端に向かって傾斜する斜面部
材を設けるとともに、この斜面部材を加振機構により加
振し、落下してきた加工済のワークを、斜面部材」−を
滑らせて加工位置外に搬出するようにしてるので、加工
済のワークのレーザ光による損傷を防止できるとともに
、加工済のワークと切り粉を完全に分離した状態で加工
位置外に搬出でき、また搬出装置を小形、安価に構成で
き、どのような加工テーブルにも適用できる等の効果が
ある。[Effects of the Invention] As explained below, the present invention provides a slope member having a large number of small openings and sloping toward one end at a position below a support bin, and also applies a vibration mechanism to the slope member. Since the machined workpiece that has been shaken and falls is carried out of the processing position by sliding the slope member, it is possible to prevent the machined workpiece from being damaged by the laser beam, and to separate the machined workpiece from the machined workpiece. The cutting chips can be carried out of the processing position in a completely separated state, the carrying-out device can be made small and inexpensive, and it can be applied to any type of processing table.
第１図はこの発明の一実施例を示すレーザ加工装置の構
成図、第２図および第３図は従来のレーザ加圧装置をそ
れぞれ示す第１図相当図である。
図において
（１）は支持ビン、 （２）はワーク、（３）は集光
レンズ、 （４）はレーザ光、（５）は加工済ワーク、
（８）は容器、（８）は斜面部材、 （１０）は切り
粉、（１２）はバイブレータ。
なお、各図中、同一符号は同−又は相当部分を示す。FIG. 1 is a block diagram of a laser processing apparatus showing an embodiment of the present invention, and FIGS. 2 and 3 are views corresponding to FIG. 1 showing conventional laser pressurizing apparatuses. In the figure, (1) is a support bin, (2) is a workpiece, (3) is a condenser lens, (4) is a laser beam, (5) is a processed workpiece,
(8) is a container, (8) is a slope member, (10) is a swarf, and (12) is a vibrator. In each figure, the same reference numerals indicate the same or corresponding parts.
Claims (2)
載置するとともに、集光レンズで集光したレーザ光を上
記ワークに照射してレーザ加工を行ない、加工済のワー
クを、隣位する支持ピンの間を通して下方に落下させる
レーザ加工装置において、上記支持ピンの下方位置に、
多数の小開口を有し一端に向かって傾斜する斜面部材を
設けるとともに、この斜面部材を加振機構により加振し
、落下してきた上記加工済のワークを、斜面部材上を滑
らせて加工位置外に搬出することを特徴とするレーザ加
工装置。(1) A workpiece is placed on a plurality of support pins arranged at predetermined intervals, and laser processing is performed by irradiating the workpiece with laser light focused by a condensing lens. In a laser processing device that drops the laser beam downward through the support pins located at the lower position of the support pins,
A slope member having many small openings and sloping toward one end is provided, and this slope member is vibrated by an excitation mechanism, and the fallen workpiece is slid onto the slope member and moved to the processing position. Laser processing equipment that is characterized by being transported outside.
ることを特徴とする特許請求の範囲第１項記載のレーザ
加工装置。(2) The laser processing apparatus according to claim 1, wherein the slope member is formed of a net material having a predetermined mesh.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61195974A JPS6352789A (en) | 1986-08-21 | 1986-08-21 | Laser beam machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61195974A JPS6352789A (en) | 1986-08-21 | 1986-08-21 | Laser beam machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6352789A true JPS6352789A (en) | 1988-03-05 |
Family
ID=16350098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61195974A Pending JPS6352789A (en) | 1986-08-21 | 1986-08-21 | Laser beam machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6352789A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5585015A (en) * | 1993-12-28 | 1996-12-17 | Mitsubishi Denki Kabushiki Kaisha | Laser machining apparatus and method |
| JP2012510372A (en) * | 2008-12-30 | 2012-05-10 | ▲機▼械科学研究▲総▼院先▲進▼▲製▼造技▲術▼研究中心 | Digitizing method and equipment for large and medium sand molds |
| JP2012139714A (en) * | 2010-12-28 | 2012-07-26 | Marusei:Kk | Device and method for manufacturing malleable roller |
-
1986
- 1986-08-21 JP JP61195974A patent/JPS6352789A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5585015A (en) * | 1993-12-28 | 1996-12-17 | Mitsubishi Denki Kabushiki Kaisha | Laser machining apparatus and method |
| JP2012510372A (en) * | 2008-12-30 | 2012-05-10 | ▲機▼械科学研究▲総▼院先▲進▼▲製▼造技▲術▼研究中心 | Digitizing method and equipment for large and medium sand molds |
| US8469080B2 (en) | 2008-12-30 | 2013-06-25 | Advanced Manufacture Technology Center China Academy Of Machinery Science And Technology | Digital processing method and device of large or medium-size sand mold |
| JP2012139714A (en) * | 2010-12-28 | 2012-07-26 | Marusei:Kk | Device and method for manufacturing malleable roller |
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